Square Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC1658IMS8#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0488 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

12 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2642IMS-16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

16

0.0031 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

MAX5216BGUA+T

Analog Devices

Digital to Analog converter

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.3 V

Yes

1

BICMOS

16

80 μA

0.0122 %

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

18 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5337BRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

375 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5623RBCPZ-3REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

12

4.5 µs

0.0244 %

Serial

3 V

3.3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

Other Converters

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.033 in (0.85 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5624BCPZ-R2

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5660CRMZ-2

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

10 µs

1 mA

0.0244 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5663RBRMZ-5

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

10 µs

3 mA

0.0244 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5664ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

900 μA

0.0244 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5664ARMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

900 μA

0.0244 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5693RARMZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

16

0.0122 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD9144BCPAZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Binary, Offset Binary, 2's Complement Binary

AD9781BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

CMOS

14

85 mA

Parallel, Word

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.39SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

DAC3482IZAYR

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

16

450 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

DAC60501MDGST

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

12

5 µs

0.0244 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC60501ZDQFR

Texas Instruments

Digital to Analog converter

Automotive

No Lead

8

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

12

5 µs

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N8

2

0.031 in (0.8 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

DAC60508ZCRTER

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

2

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC7562TDGST

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

12

7 µs

Serial

5.5 V

Small Outline, Thin Profile, Shrink Pitch

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8563TDGST

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

16

7 µs

Serial

5.5 V

Small Outline, Thin Profile, Shrink Pitch

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2621IDD-1#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5742AUB

Maxim Integrated

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

10 µs

420 μA

0.3906 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX5742AUB+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

0.3906 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5841MEUB

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

10

12 µs

420 μA

0.3906 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX5841MEUB+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

10

0.3906 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

TLV5616IDGKR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

3.2 V

Yes

102 kHz

1

CMOS

12

20 µs

1.35 mA

0.0977 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD1938WBSTZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

2.48 V

Yes

1

AEC-Q100

Serial

3.3 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

With programmable PLL

e3

30 s

260 °C (500 °F)

-2.48 V

0.276 in (7 mm)

Binary

AD5348BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

VQCCN

Square

5.499 V

Yes

1

CMOS

12

0.3906 %

Parallel, Word

3 V

Chip Carrier, Very Thin Profile

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.236 in (6 mm)

Binary

AD5625BCPZ-R2

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

4.5 µs

1.16 mA

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5676RBCPZ-RL

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

16

0.0046 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5764BSUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

32

TQFP

Square

Plastic/Epoxy

10.5263 V

Yes

1

CMOS

16

10 µs

0.0031 %

Serial

5 V

3/5,11.4/16.5 V

Flatpack, Thin Profile

TQFP32,.35SQ,32

Other Converters

10 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G32

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10.5263 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

AD9164BBCAZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

CS4344-CZZ

Cirrus Logic

Digital to Analog converter

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2.564 V

Yes

1

24

30 mA

Serial

3.3 V

3.3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

0.02 in (0.5 mm)

70 °C (158 °F)

-10 °C (14 °F)

Matte Tin

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

2.01 V

0.118 in (3 mm)

2's Complement

DAC5682ZIRGCT

Texas Instruments

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

4.1 V

Yes

1000 MHz

1

CMOS

16

0.006 %

Parallel, Word

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

10.4 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e4

30 s

260 °C (500 °F)

2.5 V

0.354 in (9 mm)

Offset Binary, 2's Complement Binary

DAC8560ICDGKTG4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5005 V

Yes

200 kHz

1

16

10 µs

850 μA

0.0183 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G8

2

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8801IDGKT

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

2 MHz

1

14

500 ns

5 μA

0.0061 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

500 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G8

2

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0.118 in (3 mm)

Binary

LTC2606IDD-1#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2621IDD-1#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2654BIUF-L16#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

8.9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

MAX547ACQH-TD

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0244 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

1

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e0

-4.5 V

0.653 in (16.585 mm)

Offset Binary

MAX547ACQH+TD

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0244 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e3

245 °C (473 °F)

-4.5 V

0.653 in (16.585 mm)

Offset Binary

AD5314ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5535BKBCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

Plastic/Epoxy

224 V

Yes

1

CMOS

14

20 mA

Serial

5 V

Grid Array, Low Profile

BGA124,14X14,40

60 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-PBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

e1

30 s

260 °C (500 °F)

1 V

0.591 in (15 mm)

Binary

AD5660CRMZ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

10 µs

1 mA

0.0244 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD9162BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

BU22210MUV-E2

ROHM

Digital to Analog converter

Other

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

10

2.5 mA

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Quad

S-XQCC-N16

0.039 in (1 mm)

0.118 in (3 mm)

2.4 V

0.118 in (3 mm)

Binary

DAC2904Y/250

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

125 MHz

2

CMOS

14

65 mA

Parallel, Word

5 V

3.3,5 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

30 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-1 V

0.276 in (7 mm)

Binary

DAC60508ZYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

6 mA

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC6574IDGSR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

188 kHz

1

10

9 µs

900 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

9 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.