Square Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD9765ASTRL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.25 V

Yes

1

CMOS

12

0.0488 %

Parallel, Word

5 V

3/5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

35 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

-1 V

0.276 in (7 mm)

Binary

DAC122S085CIMMX/NOPB

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

2.5 MHz

1

CMOS

12

8.5 µs

410 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

8.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.09 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC3171IRGC25

Texas Instruments

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1 V

Yes

1

14

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e4

30 s

260 °C (500 °F)

-.5 V

0.354 in (9 mm)

Offset Binary

DAC3482IRKDT

Texas Instruments

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

16

450 mA

Serial

3.3 V

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

SLGA88,15X15,24

Other Converters

10 ns

0.024 in (0.6 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N88

3

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e4

30 s

260 °C (500 °F)

-.5 V

0.354 in (9 mm)

Offset Binary, 2's Complement Binary

DAC53202RTER

Texas Instruments

Digital to Analog converter

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

10 kHz

1

10

0.09765 %

Serial

2.7 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

25 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC5672AIPFBR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

275 MHz

2

CMOS

14

90 mA

0.0244 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.041 in (1.05 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-1 V

0.276 in (7 mm)

Offset Binary

DAC5672MPFBEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

200 MHz

1

CMOS

14

90 mA

0.0305 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

LTC2611IDD#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2664IUH-16#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0061 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

-10 V

0.197 in (5 mm)

Binary

LTC2672HUH-16#PBF

Analog Devices

Digital to Analog Converter 16 bit

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

16

5.3 mA

0.09765625 %

Serial

5 V

-3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

200 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

MAX547ACQH

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

8

CMOS

13

44 mA

0.0244 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e0

245 °C (473 °F)

-4.5 V

0.653 in (16.585 mm)

Offset Binary

MAX5661GCB+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

10.48 V

Yes

1

BICMOS

16

9.5 mA

0.0153 %

Serial

5 V

5,±15 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

5.44 ms

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-10.48 V

0.394 in (10 mm)

Binary

MAX5661GCB+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

QFP

Square

Plastic/Epoxy

Yes

1

BICMOS

16

9.5 mA

0.015 %

5,±15 V

Flatpack

QFP64,.47SQ,20

Other Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G64

3

No

e3

30 s

260 °C (500 °F)

Binary

MCP47CMB02-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB02T-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G10

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB11-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB12-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

10

720 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

AD5300BRMZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

6 µs

250 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

4 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5337ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

375 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5398BCPZ-REEL

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

5 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC8,.11,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N8

3

0.035 in (0.9 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.6 V

0.118 in (3 mm)

Binary

AD5535BKBC

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

Plastic/Epoxy

224 V

Yes

1

CMOS

14

20 mA

Serial

5 V

Grid Array, Low Profile

BGA124,14X14,40

60 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Bottom

S-PBGA-B124

0.067 in (1.7 mm)

0.591 in (15 mm)

No

1 V

0.591 in (15 mm)

Binary

AD5686RTCPZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

16

0.0076 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5766BCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

10 V

Yes

1

16

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

16 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B49

1

0.026 in (0.65 mm)

0.156 in (3.96 mm)

e1

-10 V

0.156 in (3.96 mm)

Binary

AD7537JPZ

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

BICMOS

12

2 µs

2 mA

0.0244 %

Parallel, 8 Bits

12 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

260 °C (500 °F)

0.453 in (11.5062 mm)

Binary

AD7537JPZ-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

BICMOS

12

2 µs

2 mA

0.0244 %

Parallel, 8 Bits

12 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

40 s

260 °C (500 °F)

0.453 in (11.5062 mm)

Binary

AD9142ABCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

30 s

260 °C (500 °F)

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

AD9789BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

164

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

556 mA

Parallel, Word

3.3 V

1.5,1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA164,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B164

3

0.051 in (1.3 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

ADV7125WBCPZ170

Analog Devices

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

1.4 V

Yes

1

CMOS

8

0.3906 %

Parallel, 8 Bits

3.3 V

3.3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.276 in (7 mm)

Binary

AK4458VN

Asahi Kasei Microdevices

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

2.95 V

Yes

1

32

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N48

0.039 in (1 mm)

0.276 in (7 mm)

-2.95 V

0.276 in (7 mm)

2's Complement Binary

DAC5574IDGSRG4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

8

8 µs

900 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

12 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC6574IDGS

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

188 kHz

1

10

9 µs

900 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

9 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC6574IDGSG4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

188 kHz

1

10

9 µs

900 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

12 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8413FPCZ

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

BICMOS

12

12 mA

0.0488 %

Parallel, Word

5 V

5/±15 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

10 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

0.453 in (11.506 mm)

Binary

DAC8413FPCZ-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

BICMOS

12

12 mA

0.0488 %

Parallel, Word

5 V

±5/±15 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

10 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

0.453 in (11.506 mm)

Binary

DAC8562TDGSR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

16

7 µs

Serial

5.5 V

Small Outline, Thin Profile, Shrink Pitch

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8563TDGSR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

16

7 µs

Serial

5.5 V

Small Outline, Thin Profile, Shrink Pitch

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HMSE-HMI12#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HMSE-LMI12#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2641IDD-12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

12

0.0122 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N8

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

LTC2642AIDD-16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

16

0.0015 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

LTC2654BCUF-L16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

8.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2664HUH-16#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0061 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

-10 V

0.197 in (5 mm)

Binary

LTC2755AIUP-16#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

16

0.0015 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.354 in (9 mm)

Binary

MCP47CMB11-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB11-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

12

620 μA

0.0244 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB01-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

8

620 μA

0.0391 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

AD5315BRMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

900 μA

0.2441 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5325BRMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

900 μA

0.2441 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.