Square Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5441ACUA+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

16

200 μA

0.0031 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5441BEUA

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

16

200 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX5441BEUA+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

16

200 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5441BEUA-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

16

200 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX5441BEUA+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

16

200 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5884EGM-D

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

1.1 V

Yes

1

CMOS

14

Parallel, Word

3.3 V

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N48

1

0.039 in (1 mm)

0.276 in (7 mm)

No

e0

-.5 V

0.276 in (7 mm)

Binary

MAX5884EGM+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

1.1 V

Yes

1

CMOS

14

Parallel, Word

3.3 V

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.276 in (7 mm)

Binary

MCP4725A3T-E/MAY

Microchip Technology

Digital to Analog converter

Automotive

No Lead

6

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

TS 16949

12

400 μA

0.354 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

TSSOP6,.08

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N6

0.035 in (0.9 mm)

0.079 in (2 mm)

e4

0 V

0.079 in (2 mm)

Binary

MCP4728A5T-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

12

1.4 mA

0.3174 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MCP47CMB01-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

8

620 μA

0.0391 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB02-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB11-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB12-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

10

720 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

PCM5242RHBR

Texas Instruments

Digital to Analog converter

Other

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

32

32 mA

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Quad

S-PQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

e4

260 °C (500 °F)

0.197 in (5 mm)

2's Complement Binary

AD5322ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

450 μA

0.3906 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5361BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

AD5381BSTZ-5-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

8 µs

0.0244 %

Parallel, Word

5 V

3/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Other Converters

6 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

0.063 in (1.6 mm)

0.551 in (14 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.551 in (14 mm)

Binary

AD5390BSTZ-3

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

52

LQFP

Square

Plastic/Epoxy

5.5 V

Yes

1

14

8 µs

475 μA

0.0244 %

Serial

5 V

Flatpack, Low Profile

QFP52,.47SQ

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G52

3

0.063 in (1.6 mm)

0.472 in (12 mm)

No

e3

260 °C (500 °F)

0 V

0.472 in (12 mm)

Binary

AD5392BCPZ-5

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

5.5 V

Yes

1

14

8 µs

475 μA

0.0183 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

3 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.354 in (9 mm)

Binary

AD5405YCPZ-REEL

Analog Devices

Digital to Analog converter

Automotive

No Lead

40

HVQCCN

Square

2.5 V

Yes

1

CMOS

12

120 ns

10 μA

0.0244 %

Parallel, Word

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

15 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

260 °C (500 °F)

0 V

0.236 in (6 mm)

Binary

AD5405YCPZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

40

HVQCCN

Square

2.5 V

Yes

1

CMOS

12

120 ns

10 μA

0.0244 %

Parallel, Word

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

15 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

260 °C (500 °F)

0 V

0.236 in (6 mm)

Binary

AD5452YRM

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

12

110 ns

10 μA

0.0122 %

Serial

3.5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

16 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

0.118 in (3 mm)

Binary

AD5553CRM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

14

10 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

500 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

0.118 in (3 mm)

Binary

AD5553CRM-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

14

10 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

500 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

0.118 in (3 mm)

Binary

AD5620CRMZ-1

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

3.3 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5623RBCPZ-5REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

4.5 µs

1 mA

0.0244 %

Serial

5 V

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

Other Converters

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.033 in (0.85 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5623RSRMZ-EP-5R7

Analog Devices

Digital to Analog converter

Other

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

12

0.0366 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5625BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

4.5 µs

1.16 mA

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5663BRMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

450 μA

0.0183 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5663RBRMZ-3REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

16

7 µs

0.0244 %

Serial

3 V

3.3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5664BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

5.5 V

Yes

1

CMOS

16

7 µs

900 μA

0.0183 %

Serial

3 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5664BRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

900 μA

0.0183 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5669RBCPZ-2500R7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

16

7 µs

2.5 mA

0.0244 %

Serial

3 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

2.5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5687RBCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

12

7 µs

1.3 mA

0.0244 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

AD5689RTCPZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

16

0.0076 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5693RACPZ-1RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

5.005 V

Yes

1

16

0.0122 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N8

1

0.026 in (0.65 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD5735ACPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

12 V

Yes

1

12

18 µs

11 mA

0.032 %

Serial

15 V

3/5,9/33 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

11 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-12 V

0.354 in (9 mm)

Binary

AD5757ACPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Yes

1

16

11 mA

0.006 %

Serial

15 V

3/5,5,15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

Binary

AD5762RCSUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

32

TQFP

Square

Plastic/Epoxy

10.52 V

Yes

1

CMOS

16

10 µs

4.25 mA

0.0015 %

Serial

13.5 V

3/5,±12/±15 V

-13.5 V

Flatpack, Thin Profile

TQFP32,.35SQ,32

Other Converters

8 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G32

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10.52 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

AD7225LP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

MIL-STD-883

8

5 µs

10 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

-5 V

0.453 in (11.506 mm)

Binary, Offset Binary

AD7839ASZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

13

14 mA

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

Flatpack

QFP44,.57SQ,32

Other Converters

28 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.394 in (10 mm)

Binary

AD9117BCPZN

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.5 V

Yes

1

14

0.011 %

Serial

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

11.5 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-XQCC-N40

3

0.031 in (0.8 mm)

0.236 in (6 mm)

e4

30 s

260 °C (500 °F)

.8 V

0.236 in (6 mm)

Binary, 2's Complement Binary

AD9117BCPZNRL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.5 V

Yes

1

14

0.011 %

Serial

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

11.5 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-XQCC-N40

3

0.031 in (0.8 mm)

0.236 in (6 mm)

e4

30 s

260 °C (500 °F)

.8 V

0.236 in (6 mm)

Binary, 2's Complement Binary

AD9129BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

20 s

240 °C (464 °F)

1.5 V

0.472 in (12 mm)

Binary

AD9129BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

20 s

240 °C (464 °F)

1.5 V

0.472 in (12 mm)

Binary

AD9136BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD9154BCPAZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

3.37 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

2 V

0.472 in (12 mm)

Binary, Offset Binary, 2's Complement Binary

AD9154BCPAZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

3.37 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

2 V

0.472 in (12 mm)

Binary, Offset Binary, 2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.