Square Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5141EUA

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

14

200 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

MAX5141EUA+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

14

200 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5141EUA-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

14

200 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

MAX5141EUA+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

14

200 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5353AEUA-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

3.3 V

Yes

1

CMOS

12

400 μA

0.0244 %

Serial

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

14 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5353AEUA+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

3.3 V

Yes

1

CMOS

12

400 μA

0.0244 %

Serial

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

14 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5511ETC

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

8

7 μA

0.3906 %

Serial

2.7 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

245 °C (473 °F)

0.157 in (4 mm)

Binary

MAX5511ETC+

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

8

7 μA

0.3906 %

Serial

2.7 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

Binary

MAX5511ETC-T

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

8

7 μA

0.3906 %

Serial

2.7 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

0.157 in (4 mm)

Binary

MAX5511ETC+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

1

BICMOS

8

7 μA

0.3906 %

Serial

2.7 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

Binary

MAX5533EUA

Maxim Integrated

Digital to Analog Converter 12 bit

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

2

BICMOS

12

8 μA

0.1953 %

Parallel, Word

5 V

2/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

660 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

Binary, Offset Binary

MAX5533EUA+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

2

BICMOS

12

8 μA

0.1953 %

Parallel, Word

5 V

2/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

660 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0.118 in (3 mm)

Binary, Offset Binary

MAX5535ETC

Maxim Integrated

Digital to Analog Converter 12 bit

Industrial

No Lead

12

HVQCCN

Square

Yes

2

BICMOS

12

8 μA

0.1953 %

Parallel, Word

5 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

0.157 in (4 mm)

Binary, Offset Binary

MAX5535ETC+

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVQCCN

Square

Yes

2

BICMOS

12

8 μA

0.1953 %

Parallel, Word

5 V

2/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Other Converters

660 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

Binary, Offset Binary

MAX5734AUTN+

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.315 in (8 mm)

Binary

MAX5734AUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

-2.5 V

0.315 in (8 mm)

Binary

MAX5735BUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

-5 V

0.315 in (8 mm)

Binary

MAX5735BUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.315 in (8 mm)

Binary

MAX5741EUB-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

10

10 µs

420 μA

0.3906 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX5741EUB+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

10

10 µs

420 μA

0.3906 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5878EGK-D

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

0.0045 %

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e0

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5878EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

16

0.0045 %

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MCP4706A1T-E/MAY

Microchip Technology

Digital to Analog converter

Automotive

No Lead

6

HVSON

Square

Plastic/Epoxy

Yes

1

TS 16949

8

400 μA

0.3543 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

TSSOP6,.08

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N6

0.035 in (0.9 mm)

0.079 in (2 mm)

e4

0.079 in (2 mm)

Binary

MCP4728A7T-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

12

1.4 mA

0.3174 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MCP47CMB21-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.0244 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G10

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

PCM5101AQPWRQ1

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

AEC-Q100

32

32 mA

Serial

3.3 V

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e4

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

2's Complement Binary

PDAC63204RTET

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

250 kHz

1

12

200 μA

0.097656 %

Serial

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0 V

0.118 in (3 mm)

Binary

TLV5623IDGKR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.4 V

Yes

102 kHz

1

CMOS

8

20 µs

1.35 mA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

SSOP8,.19

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

TLV5636CDGKR

Texas Instruments

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.9 V

Yes

233 kHz

1

CMOS

12

7 µs

3.3 mA

0.0977 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD1933WBSTZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

4.96 V

Yes

1

AEC-Q100

Serial

3.3 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

With programmable PLL

e3

30 s

260 °C (500 °F)

-4.96 V

0.394 in (10 mm)

Binary

AD1933YSTZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

4.96 V

Yes

1

Serial

3.3 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

With programmable PLL

e3

260 °C (500 °F)

-4.96 V

0.394 in (10 mm)

Binary

AD1933YSTZ-RL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

4.96 V

Yes

1

Serial

3.3 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

With programmable PLL

e3

260 °C (500 °F)

-4.96 V

0.394 in (10 mm)

Binary

AD5322BRM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

400 μA

0.1953 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSOP10,.5

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

30 s

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

AD5324ARMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5325ARMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

0.3906 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5361BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

AD5362BSTZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

52

LQFP

Square

Plastic/Epoxy

15.1 V

Yes

1

16

30 µs

0.0015 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Flatpack, Low Profile

QFP52,.47SQ

Other Converters

20 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G52

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.394 in (10 mm)

2's Complement Binary

AD5399YRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

4 V

Yes

1

12

0.4 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

800 ns

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

2's Complement Binary

AD5544ACPZ-1-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Yes

1

CMOS

16

9 μA

0.0061 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

900 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

Binary

AD5620CRMZ-1REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

3.3 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5624BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5645RBCPZ-R2

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

5 µs

1.16 mA

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

3.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5664RBRMZ-3

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

16

10 µs

3 mA

0.0244 %

Serial

3 V

3/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5667RBCPZ-R2

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

5.5 V

Yes

1

CMOS

16

7 µs

0.0183 %

Serial

5 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5684RBCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

CMOS

12

7 µs

1.3 mA

0.0244 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

AD5696BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

16

8 µs

700 μA

0.0046 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5735ACPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

12 V

Yes

1

12

18 µs

11 mA

0.032 %

Serial

15 V

3/5,9/33 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

11 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-12 V

0.354 in (9 mm)

Binary

AD5763CSUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

32

TQFP

Square

Plastic/Epoxy

4.3 V

Yes

2

CMOS

16

10 µs

3.5 mA

0.0015 %

Serial

5 V

±5,3/5 V

-5 V

Flatpack, Thin Profile

TQFP32,.35SQ,32

Other Converters

8 µs

0.031 in (0.8 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G32

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-4.3 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.