Square Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

PCM4104PFBTG4

Texas Instruments

Digital to Analog converter

Commercial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

6.15 V

Yes

1

24

40 mA

Serial

5 V

3.3,5 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

0.02 in (0.5 mm)

70 °C (158 °F)

-10 °C (14 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.276 in (7 mm)

2's Complement Binary

PCM5242RHBT

Texas Instruments

Digital to Analog converter

Other

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

32

32 mA

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Quad

S-PQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

e4

260 °C (500 °F)

0.197 in (5 mm)

2's Complement Binary

R2A20152NS#W0

Renesas Electronics

Digital to Analog converter

Other

No Lead

8

HVSON

Square

Plastic/Epoxy

5.4 V

Yes

1

CMOS

8

1.5 mA

0.39 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC8,.08,20

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Dual

S-PDSO-N8

0.031 in (0.8 mm)

0.087 in (2.2 mm)

.1 V

0.087 in (2.2 mm)

Binary

R2A20178NP

Renesas Electronics

Digital to Analog converter

No Lead

24

HVQCCN

Square

5.4 V

Yes

1

CMOS

8

300 µs

2 mA

0.39 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Quad

S-XQCC-N24

0.031 in (0.8 mm)

0.157 in (4 mm)

.1 V

0.157 in (4 mm)

Binary

R2A20178NP#W0

Renesas Electronics

Digital to Analog converter

Other

No Lead

24

HVQCCN

Square

5.4 V

Yes

1

CMOS

8

300 µs

2 mA

0.39 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Quad

S-XQCC-N24

0.031 in (0.8 mm)

0.157 in (4 mm)

.1 V

0.157 in (4 mm)

Binary

AD5312ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

450 μA

0.3906 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5516ABC-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

14

32 µs

0.0122 %

Serial

5 V

±4.75/±13.2,3/5,5 V

Grid Array, Low Profile

BGA74,11X11,40

Other Converters

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-2.5 V

0.472 in (12 mm)

Binary

AD5684BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

12

7 µs

700 μA

0.0244 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD9121BCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

CMOS

14

495 mA

Serial

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.39SQ,20

Other Converters

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

No

e3

-1 V

0.394 in (10 mm)

2's Complement

DAC3162IRGZR

Texas Instruments

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

4.1 V

Yes

500 MHz

1

12

66 mA

Parallel, Word

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Other Converters

10 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

2.5 V

0.276 in (7 mm)

Offset Binary

DAC38RF96IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC5662AIPFBR

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

275 MHz

2

CMOS

12

90 mA

0.0488 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-1 V

0.276 in (7 mm)

Offset Binary

DAC5662AIPFBRG4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

2

CMOS

12

90 mA

0.0488 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-1 V

0.276 in (7 mm)

Offset Binary

DAC8734SRHAR

Texas Instruments

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

15 V

Yes

125 kHz

1

16

6 µs

4 mA

0.0015 %

Serial

16.5 V

±10.8/±18,3/5 V

-16.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Quad

S-PQCC-N40

2

0.039 in (1 mm)

0.236 in (6 mm)

No

e4

260 °C (500 °F)

-15 V

0.236 in (6 mm)

Binary, 2's Complement Binary

LTC2672CUH-12#PBF

Analog Devices

Digital to Analog Converter 12 bit

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

12

5.3 mA

0.09765625 %

Serial

5 V

-3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

0.197 in (5 mm)

Binary

LTC2672CUH-12#TRPBF

Analog Devices

Digital to Analog Converter 12 bit

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

12

5.3 mA

0.09765625 %

Serial

5 V

-3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

0.197 in (5 mm)

Binary

MCP4911T-E/MS

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

SOP

Square

Plastic/Epoxy

4.096 V

Yes

1

10

350 μA

0.34179 %

Serial

5 V

3/5 V

Small Outline

SOP8,.19

Other Converters

4.5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

40 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX547BCQH-D

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0488 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

1

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e0

-4.5 V

0.653 in (16.585 mm)

Offset Binary

MAX547BCQH+D

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0488 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e3

245 °C (473 °F)

-4.5 V

0.653 in (16.585 mm)

Offset Binary

AD9957BSVZ

Analog Devices

Digital to Analog Converter 14 bit

Gull Wing

100

HTFQFP

Square

Plastic/Epoxy

Yes

1

14

610 mA

0.009155 %

Serial

1.8 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP100,.63SQ

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

0.047 in (1.2 mm)

0.551 in (14 mm)

e3

260 °C (500 °F)

0.551 in (14 mm)

Offset Binary, 2's Complement Binary

AD5324ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5379ABCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

14.5 V

Yes

1

CMOS

14

30 µs

0.0183 %

Serial, Parallel, Word

12 V

3/5,±12/±15 V

-12 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.512 in (13 mm)

Binary

AD5413BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

12.6 V

Yes

1

14

20 µs

0.012 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

12 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

-12.6 V

0.197 in (5 mm)

Binary

AD5674RBCPZ-2

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD9146BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

1 V

Yes

1

16

343 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Other Converters

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N48

3

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.276 in (7 mm)

Binary, 2's Complement Binary

DAC08RC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

18 V

Yes

1

Bipolar

MIL-STD-883

8

150 ns

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

Chip Carrier

LCC20,.35SQ

Other Converters

85 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

-10 V

0.35 in (8.89 mm)

Binary

MAX5203BEUB

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

10

SOP

Square

Plastic/Epoxy

3.6 V

Yes

1

BICMOS

16

50 mA

0.06103515 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5203BEUB+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

3.6 V

Yes

1

BICMOS

16

1.5 mA

0.06103515 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5214GUA+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

14

80 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

SSOP8,.19

Other Converters

14 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5702BAUB+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

2

BICMOS

12

900 μA

0.0244 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.116 in (2.94 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.116 in (2.94 mm)

Offset Binary

MAX5895EGK-D

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

2

CMOS

16

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e0

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5895EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

2

CMOS

16

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

AD5316RBCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

CMOS

10

7 µs

1.3 mA

0.0488 %

Serial

3 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.031 in (0.8 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5592RBCPZ-1-RL7

Analog Devices

Digital to Analog Converter 12 bit

No Lead

16

VQCCN

Square

5 V

Yes

1

12

2.7 mA

0.0244 %

Serial

3 V

Chip Carrier, Very Thin Profile

LCC16,.12SQ,20

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5203BEUB-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

10

SOP

Square

Plastic/Epoxy

3.6 V

Yes

1

BICMOS

16

50 mA

0.06103515 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5203BEUB+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

3.6 V

Yes

1

BICMOS

16

1.5 mA

0.06103515 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

AD9161BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

11

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9778ABSVZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

100

HTFQFP

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

0.0061 %

Parallel, Word

1.8 V

1.8,3.3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP100,.63SQ

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

0.047 in (1.2 mm)

0.551 in (14 mm)

No

e3

260 °C (500 °F)

-1 V

0.551 in (14 mm)

Binary

LTC2606CDD-1#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5733BUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

0 V

0.315 in (8 mm)

Binary

MAX5733BUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

HI2315JCQ

Renesas Electronics

Digital to Analog converter

Commercial Extended

Gull Wing

32

Square

Plastic/Epoxy

2 V

Yes

1

CMOS

10

30 mA

0.1464 %

Parallel, Word

5 V

75 °C (167 °F)

-20 °C (-4 °F)

Quad

S-PQFP-G32

1.8 V

Binary

ISL5629/2IN

Renesas Electronics

Digital to Analog converter

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.25 V

Yes

1

CMOS

8

62 mA

0.1953 %

Parallel, 8 Bits

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

-1 V

0.276 in (7 mm)

Offset Binary

AD5301BRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

225 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5305ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5305ARMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5338ARMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

375 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

7 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5339BRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

375 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.