Square Digital-to-Analog Converters 2,400+

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2626CDD#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5134AGTG+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

QCCN

Square

Plastic/Epoxy

Yes

4

BICMOS

16

3.6 mA

0.015 %

3/5 V

Chip Carrier

LCC24,.16SQ,20

Other Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N24

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX5135GTG+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

QCCN

Square

Plastic/Epoxy

Yes

4

BICMOS

12

3.6 mA

0.024 %

3/5 V

Chip Carrier

LCC24,.16SQ,20

Other Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N24

1

No

e3

30 s

260 °C (500 °F)

Binary

MCP4706A0T-E/MAY

Microchip Technology

Digital to Analog converter

Automotive

No Lead

6

HVSON

Square

Plastic/Epoxy

Yes

1

TS 16949

8

400 μA

0.3543 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

TSSOP6,.08

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N6

1

0.035 in (0.9 mm)

0.079 in (2 mm)

e4

40 s

260 °C (500 °F)

0.079 in (2 mm)

Binary

MCP47CVB02T-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB02T-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.035 in (0.9 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

AD5313RBCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

CMOS

10

7 µs

1.3 mA

0.0488 %

Serial

3 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5337ARM-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

375 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

AD5378ABCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

5 V

Yes

1

Bipolar

14

30 µs

0.0183 %

Serial, Parallel, Word

5 V

3/5,±12/±15 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e1

30 s

260 °C (500 °F)

-3.5 V

0.512 in (13 mm)

Binary

AD5667RBRMZ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

0.0183 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5679RBCPZ-1

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5693RBRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

16

0.0046 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5694BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

12

7 µs

700 μA

0.0244 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5765CSUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

32

TQFP

Square

Plastic/Epoxy

4.3 V

Yes

4

CMOS

16

10 µs

2.25 mA

0.0015 %

Serial

5 V

±5,3/5 V

-5 V

Flatpack, Thin Profile

TQFP32,.35SQ,32

Other Converters

8 µs

0.031 in (0.8 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G32

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-4.3 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

AD7547KPZ

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

2 µs

0.0122 %

Parallel, Word

12 V

Chip Carrier

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

0.453 in (11.506 mm)

Binary

ADV7125JST330

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.4 V

Yes

1

CMOS

8

72 mA

0.3906 %

Parallel, 8 Bits

3.3 V

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

0 V

0.276 in (7 mm)

Binary

DAC38J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC9881SRGET

Texas Instruments

Digital to Analog converter

Industrial

No Lead

24

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

200 kHz

1

18

5 µs

1.5 mA

0.0011 %

Serial

5 V

2.7/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N24

2

0.039 in (1 mm)

0.157 in (4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary, 2's Complement Binary

LTC1658CMS8

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0488 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

12 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC1658CMS8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0488 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

12 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635CUD-LMO8#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2641CMS8-12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

12

0.0122 %

Serial

3 V

Small Outline

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

LTC2642AIMS-16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

16

0.0015 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

MCP47CVB01-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

TS 16949

8

700 μA

0.0391 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47FEB04-E/MQ

Microchip Technology

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

Plastic/Epoxy

Yes

1

8

2.5 mA

0.1953125 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

7.8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N20

0.039 in (1 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

PDAC38J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1

16

Serial

3.3 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

-.5 V

0.394 in (10 mm)

Binary

5962-89697013A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

CMOS

38535Q/M;38534H;883B

16

0.024 %

Parallel, Word

15 V

5,±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

7 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e4

-10 V

0.45 in (11.43 mm)

Binary, Offset Binary

AD5302ARM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

450 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

AD5390BCP-5

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

5.5 V

Yes

1

CMOS

14

10 µs

0.0183 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

AD5390BCP-5-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

5.5 V

Yes

1

CMOS

14

10 µs

0.0183 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

AD5541AACPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

Yes

1

CMOS

16

150 μA

0.0031 %

Serial

5 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Other Converters

1 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

No

0.118 in (3 mm)

Binary

AD5626BRMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

4.095 V

Yes

1

CMOS

12

2.5 mA

0.0244 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

16 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5640CRMZ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

10 µs

1 mA

0.0244 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5679RBCPZ-2

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5679RBCPZ-2-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5767BCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

Yes

1

12

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

10 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B49

1

0.026 in (0.65 mm)

0.156 in (3.96 mm)

e1

0.156 in (3.96 mm)

Binary

AD9102BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

1 V

Yes

1

CMOS

14

Serial

1.8 V

1.8/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

31.2 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.197 in (5 mm)

2's Complement Binary

AD9739ABBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

183 mA

Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

ADV7125JST240

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.4 V

Yes

1

CMOS

8

72 mA

0.3906 %

Parallel, 8 Bits

3.3 V

3.3/5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

0 V

0.276 in (7 mm)

Binary

DAC70508MRTER

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

2

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC7513E/2K5G4

Texas Instruments

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

95 kHz

1

12

10 µs

170 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

12 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G8

2

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC7563SQDGSRQ1

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

AEC-Q100

12

7 µs

1.6 mA

0.018 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2641CDD-12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

8

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

12

0.0122 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N8

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

LTC2688CUJ-16#PBF

Analog Devices

Digital to Analog converter

No Lead

40

HVQCCN

Square

15 V

Yes

1

CMOS

16

28 µs

37 mA

0.0000457 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

30 s

260 °C (500 °F)

-15 V

0.236 in (6 mm)

Binary

MAX547BCMH+TD

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0488 %

Parallel, Word

5 V

-5 V

Flatpack

5 µs

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-4.5 V

0.394 in (10 mm)

Offset Binary

MAX549ACUA-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

2

CMOS

8

550 μA

0.39 %

Serial

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0 V

0.118 in (3 mm)

Binary

MAX549ACUA+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

2

CMOS

8

550 μA

0.39 %

Serial

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.