Commercial Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MX7537LP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

245 °C (473 °F)

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MAX529CWG+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

8

BICMOS

8

2 µs

9 mA

0.3906 %

Serial

5 V

5,GND/-5 V

-5 V

Small Outline, Shrink Pitch

SOP24,.4

Other Converters

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G24

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.323 in (8.2 mm)

Binary

MX7538JCWG+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,-0.3 V

Small Outline

SOP24,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

Binary

AD7228LCWG

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

8

5 µs

38 mA

0.2 %

12/15, GND/-5 V

Small Outline

SOP24,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

No

e0

Binary

MX7538JN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

Binary

MX7528KCWP+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

8

400 ns

1 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

Binary

MAX500ACWE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

8

4.5 µs

22 mA

0.1953 %

Serial

15 V

11.4/16.5,GND/-5 V

-5 V

Small Outline

SOP16,.4

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.406 in (10.3 mm)

Binary

MX7245JP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

245 °C (473 °F)

-5 V

0.453 in (11.505 mm)

Binary

MX7524LCSE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Small Outline

SOP16,.25

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.406 in (10.3 mm)

Binary, Offset Binary

AD7521KCWN

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.1 %

15 V

15 V

Small Outline

SOP18,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

No

e0

Binary, Offset Binary

MX7541KN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.9 in (22.86 mm)

Binary, Offset Binary

AD566AKN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

350 ns

20 mA

0.012 %

-15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

e0

Binary, Offset Binary

MAX5354CUA+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

10

400 μA

0.0977 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

10 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MX7534KN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

14

1.5 µs

3 mA

0.0061 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

1.03 in (26.16 mm)

Binary, Offset Binary

MAX5304CUA+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

10

0.3906 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

10 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

Offset Binary

MX7545ALCWP+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

Binary, 2's Complement Binary

MAX542BCSD+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

1.1 mA

0.0031 %

Serial

5 V

5 V

Small Outline

SOP14,.25

Other Converters

1 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G14

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.341 in (8.65 mm)

Offset Binary

MX7847JR+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

2

BICMOS

12

10 mA

0.0244 %

Parallel, Word

12 V

±12/±15 V

-12 V

Small Outline

SOP24,.4

Other Converters

4 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.606 in (15.4 mm)

Binary, Offset Binary

MX7530JCWE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

2 mA

0.2 %

Parallel, Word

15 V

15 V

Small Outline

SOP16,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.406 in (10.3 mm)

Binary, Offset Binary

MX7548JCWP+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

3 mA

0.0244 %

Parallel, 8 Bits

5 V

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.104 in (2.642 mm)

0.302 in (7.67 mm)

No

e3

30 s

260 °C (500 °F)

0.512 in (13.005 mm)

Binary, Offset Binary, 2's Complement Binary

MX7530KCWE+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

2 mA

0.1 %

Parallel, Word

15 V

15 V

Small Outline

SOP16,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.406 in (10.3 mm)

Binary, Offset Binary

MX7543KP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

250 °C (482 °F)

0.353 in (8.965 mm)

Binary, Offset Binary

MAX502BCNG-T

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

12

5 µs

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary

MAX5443BCUA+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

16

200 μA

0.0061 %

Serial

3 V

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5253ACAP+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0122 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX543BCWE+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

500 μA

0.0244 %

Serial

15 V

5/15 V

Small Outline

SOP16,.4

Other Converters

250 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.406 in (10.3 mm)

Binary, Offset Binary, 2's Complement Binary

MAX515CSA+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

4.6 V

Yes

1

CMOS

10

400 μA

0.0488 %

Serial

5 V

5 V

0 V

Small Outline

SOP8,.25

Other Converters

25 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

MAX5353ACUA+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

3.3 V

Yes

1

CMOS

12

400 μA

0.0244 %

Serial

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

14 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX7533LN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

0.05 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T16

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

0.755 in (19.175 mm)

Offset Binary

MAX5251ACAP+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

1.9 V

Yes

4

CMOS

10

980 μA

0.0488 %

Serial

3.3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

12 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

0 V

0.283 in (7.2 mm)

Binary

MAX535BCUA+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

13

400 μA

0.0122 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

16 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MX7543KCWE+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.406 in (10.3 mm)

Binary, Offset Binary

MAX531BCSD+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

4.6 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

±5 V

-5 V

Small Outline

SOP14,.25

Other Converters

25 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G14

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-4.6 V

0.341 in (8.65 mm)

Binary

MX7533J/D-T

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

DIE

Rectangular

Yes

1

CMOS

10

0.1953 %

Parallel, Word

15 V

Uncased Chip

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N16

No

e0

Binary, Offset Binary

MAX534ACEE+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

4

CMOS

8

1.3 mA

0.3906 %

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

8 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.89 mm)

Binary

MX7226KC/D

Analog Devices

Digital to Analog converter

Commercial

4

BICMOS

8

4 µs

13 mA

0.39 %

12/15, GND/-5 V

DIE OR CHIP

Other Converters

70 °C (158 °F)

0 °C (32 °F)

No

Binary

MX7543JCWE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Serial

5 V

5 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.406 in (10.3 mm)

Binary, Offset Binary

MX7547KN-T

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

Binary, Offset Binary, 2's Complement Binary

MX7225LN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

8

4 µs

10 mA

0.1953 %

Parallel, Word

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary

MX7520KCWE+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

2 mA

0.1 %

Parallel, Word

15 V

15 V

Small Outline

SOP16,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.406 in (10.3 mm)

Binary, Offset Binary

MAX552BCUB+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

12

1 µs

500 μA

0.0244 %

Serial

3 V

3/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

120 ns

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

0.118 in (3 mm)

Offset Binary

MAX520BCWE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

4

CMOS

8

20 μA

0.39 %

Serial

5 V

5 V

Small Outline

SOP16,.4

Other Converters

2 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.406 in (10.3 mm)

Binary

MX7245JP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

245 °C (473 °F)

-5 V

0.453 in (11.505 mm)

Binary

MX7224LP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

2 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

0 V

0.353 in (8.965 mm)

Offset Binary

MX7845KP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

0.18 in (4.572 mm)

0.453 in (11.506 mm)

No

e3

-10 V

0.453 in (11.506 mm)

Binary

MX7543KCWE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.406 in (10.3 mm)

Binary, Offset Binary

MAX257CCWG

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

18 mA

0.0122 %

Parallel, 8 Bits

5 V

-5 V

Small Outline

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

Binary

MX7548KP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

3 mA

0.0122 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J20

1

0.177 in (4.496 mm)

0.354 in (8.992 mm)

No

e3

0.354 in (8.992 mm)

Binary, Offset Binary, 2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.