Commercial Digital-to-Analog Converters 2,400+

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MX767JP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

12 mA

0.02 %

±12/±15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

MX7543GKN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

Binary, Offset Binary

MAX509BCWP+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

4

8

10 mA

0.037 %

Serial

5 V

5/±5 V

-5 V

Small Outline

SOP20,.4

Other Converters

6 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.504 in (12.8 mm)

Binary

MX7520KCWE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

2 mA

0.1 %

Parallel, Word

15 V

15 V

Small Outline

SOP16,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.406 in (10.3 mm)

Binary, Offset Binary

MAX533ACEE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

4

CMOS

8

1.3 mA

0.3906 %

Serial

3 V

3/3.3 V

Small Outline, Shrink Pitch

SSOP16,.25

Other Converters

6 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.89 mm)

Binary

AM6012CWP

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

Bipolar

12

15 V

±15 V

-15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

No

e0

Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary

MAX520CPE

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

4

8

Serial

5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.755 in (19.175 mm)

Binary

MX7226KP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

4

CMOS

8

4 µs

13 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

250 °C (482 °F)

0.353 in (8.965 mm)

Binary

MX7534JN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

14

1.5 µs

3 mA

0.0122 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

1.03 in (26.16 mm)

Binary, Offset Binary

MAX544ACSA+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

14

1.1 mA

0.0031 %

Serial

5 V

5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Offset Binary

MX7547LP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MAX543BCPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

500 μA

0.0244 %

Serial

5 V

5/15 V

In-Line

DIP8,.3

Other Converters

250 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

Binary, Offset Binary, 2's Complement Binary

MAX518BCPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

2

BICMOS

8

5 mA

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

6 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

AD7224KCWN

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

8

5 µs

6 mA

0.39 %

12/15, GND/-5 V

Small Outline

SOP18,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

No

e0

Binary

AD7521LCWN

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.05 %

15 V

15 V

Small Outline

SOP18,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

No

e0

Binary, Offset Binary

MAX502ACNG+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

12

5 µs

10 mA

0.0732 %

Parallel, Word

15 V

±12/±15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.25 in (31.75 mm)

Binary, Offset Binary

MP7645JCWP

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.049 %

15 V

15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

No

e0

Binary

AD7225KC/D

Analog Devices

Digital to Analog converter

Commercial

4

BICMOS

8

4 µs

19 mA

0.39 %

12/15, GND/-5 V

DIE OR CHIP

Other Converters

70 °C (158 °F)

0 °C (32 °F)

No

Binary

MX7837C/D

Analog Devices

Digital to Analog converter

Commercial

No Lead

25

DIE

Rectangular

10 V

Yes

2

BICMOS

12

10 mA

0.024 %

Parallel, 8 Bits

12 V

±12/±15 V

-12 V

Uncased Chip

DIE OR CHIP

Other Converters

4 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N25

No

e0

-10 V

Binary, Offset Binary

AD7545LCWP

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.012 %

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

No

e0

Binary

MX7531LCWN+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

Binary, Offset Binary

MAX536ACWE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

4

CMOS

12

0.0122 %

Serial

15 V

12/15,-5 V

-5 V

Small Outline

SOP16,.4

Other Converters

3 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.406 in (10.3 mm)

Binary

MAX541BCSA+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

1.1 mA

0.0031 %

Serial

5 V

5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Offset Binary

AD7545JCWP

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.049 %

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

No

e0

Binary

AD7226KCWP

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

8

4 µs

24 mA

0.39 %

12/15, GND/-5 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

No

e0

Binary

MAX547ACMH+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0244 %

Parallel, Word

5 V

±5 V

-5 V

Flatpack

QFP44,.5SQ,32

Other Converters

5 µs

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-4.5 V

0.394 in (10 mm)

Offset Binary

MAX5253BC/D

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

DIE

Rectangular

3 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Uncased Chip

16 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

0 V

Binary, Offset Binary

MP7645LCWP

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.049 %

15 V

15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

No

e0

Binary

AM6012C/D

Analog Devices

Digital to Analog converter

Commercial

1

Bipolar

12

15 V

±15 V

-15 V

DIE OR CHIP

Other Converters

70 °C (158 °F)

0 °C (32 °F)

No

Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary

MX7535JP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

MX7538KN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12 V

12/15,-0.3 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.3 in (7.62 mm)

e3

30 s

260 °C (500 °F)

-10 V

1.27 in (32.26 mm)

Binary, Offset Binary

MAX520ACPE+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

CMOS

8

20 μA

0.39 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

2 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7545JCWP+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.0488 %

Parallel, Word

5 V

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5203ACUB+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

3.6 V

Yes

1

BICMOS

16

1.5 mA

0.030517 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5158CPE+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

2

CMOS

10

600 μA

0.0977 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MAX5201ACUB+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

SOP

Square

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

16

50 mA

0.030517 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX547BCQH+TD

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0488 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e3

245 °C (473 °F)

-4.5 V

0.653 in (16.585 mm)

Offset Binary

MAX531ACSD+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

4.6 V

Yes

1

CMOS

12

0.0122 %

Serial

5 V

±5 V

-5 V

Small Outline

SOP14,.25

Other Converters

25 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G14

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-4.6 V

0.341 in (8.65 mm)

Binary

MAX531ACPD+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

4.8 V

No

1

CMOS

12

0.0122 %

Serial

5 V

±5 V

-5 V

In-Line

DIP14,.3

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T14

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-4.8 V

0.75 in (19.05 mm)

Binary

MAX5200ACUB+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

SOP

Square

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

16

50 mA

0.030517 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G10

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5154BCPE+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

12

650 μA

0.0244 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

16 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

Binary

MAX5352BCPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

400 μA

0.0244 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

14 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary, Offset Binary

MAX535BCPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

13

400 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

16 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX5205ACUB+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

1.5 mA

0.0305 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

25 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Offset Binary

MAX531BCPD+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

4.8 V

No

1

CMOS

12

0.0244 %

Serial

5 V

±5 V

-5 V

In-Line

DIP14,.3

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T14

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-4.8 V

0.75 in (19.05 mm)

Binary

MAX5354CPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

10

400 μA

0.0977 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX504CPD+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

CMOS

10

400 μA

0.0488 %

Serial

5 V

5/±5 V

0 V

In-Line

DIP14,.3

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T14

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.75 in (19.05 mm)

Binary

MAX5200ACUB+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

SOP

Square

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

16

50 mA

0.030517 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.