Other Digital-to-Analog Converters 1,129

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD9703BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

0 V

No

1

Bipolar

8

275 mA

0.2 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-.6375 V

Complementary Binary

AD7536AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

Offset Binary

DAC-888N

Analog Devices

Digital to Analog converter

Other

No Lead

18

DIE

Rectangular

5 V

Yes

1

8

16 mA

0.1 %

Parallel, 8 Bits

5 V

-12 V

Uncased Chip

300 ns

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-5 V

Binary

AD7245AQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

12

10 µs

12 mA

0.0244 %

Parallel, Word

12 V

12/15,GND/-12/-15 V

-12 V

In-Line

DIP24,.3

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

AD7536BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

Binary

DAC312GBC

Analog Devices

Digital to Analog converter

Other

No Lead

20

DIE

Rectangular

10 V

Yes

1

Bipolar

MIL-STD-883 Class B (Modified)

12

18 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

250 ns

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

-5 V

Binary, Offset Binary, 2's Complement Binary

AD7533AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

0.3 in (7.62 mm)

No

e0

0.79 in (20.07 mm)

Binary, Offset Binary

AD7544AD/883B

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD1865NZ

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

3 V

No

2

BIMOS

18

26 mA

1 %

Serial

5 V

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-3 V

1.2 in (30.48 mm)

2's Complement Binary

DAC20GBC

Analog Devices

Digital to Analog converter

Other

1

Bipolar

7.8 mA

15 V

±15 V

-15 V

DIE OR CHIP

Other Converters

25 °C (77 °F)

25 °C (77 °F)

No

Binary Coded Decimal, Complementary Binary Coded Decimal

AD9702BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

3 V

No

3

Bipolar

4

10 ns

348 mA

5 %

Parallel, 4 Bits

5 V

GND/5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Other Converters

8 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

-1.2 V

1.2 in (30.48 mm)

Binary

AD7248AQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

12 V

12/15,GND/-12/-15 V

-12 V

In-Line

DIP20,.3

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.953 in (24.195 mm)

Binary

AD7545ABE

Analog Devices

Digital to Analog converter

Other

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, 2's Complement Binary

AD7224BCHIPS

Analog Devices

Digital to Analog converter

Other

1

BICMOS

8

5 µs

6 mA

0.39 %

12/15, GND/-5 V

DIE OR CHIP

Other Converters

85 °C (185 °F)

-25 °C (-13 °F)

No

Binary

HDG-0605B

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Metal

No

1

ECL

MIL-STD-883 Class B (Modified)

6

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T24

No

e0

Binary

5962-01-415-8959

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Metal

No

1

Bipolar

12

50 ns

110 mA

0.0125 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-55 °C (-67 °F)

Dual

R-MDIP-T24

No

Complementary Binary, Complementary Offset Binary

AD7543AD/+

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 µs

2.5 mA

0.024 %

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

e0

Binary

AD7523CD/883B

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

0.05 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

AD7118CD

Analog Devices

Digital to Analog converter

Other

Through-Hole

14

DIP

Rectangular

Ceramic

No

1

CMOS

6

2 mA

5/15 V

In-Line

DIP14,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T14

No

e0

Binary

ADDAC100JD/883B

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Hybrid

38535Q/M;38534H;883B

10

375 ns

0.1 %

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Complementary Binary

PM562FV

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

0.012 %

5/15,-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary

AD568BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

40 mA

0.012 %

±12/±15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Binary, Offset Binary

5962-01-097-8481

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.05 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

DAC100BCQ8

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2.5 V

No

1

10

0 ns

8.33 mA

0.1 %

Parallel, Word

15 V

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-2.5 V

0.75 in (19.05 mm)

Binary

HDG-0807BW

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

3 V

No

1

Hybrid

8

18 ns

225 mA

Parallel, 8 Bits

5 V

5 V

In-Line

DIP24,.6

Other Converters

18 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

No

e0

-3 V

Binary

AD7542BD/883B

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD9712BAN

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

183 mA

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

Binary

AD9712BBN

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

183 mA

0.0427 %

Parallel, Word

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

Binary

ADDAC71-COB-I

Analog Devices

Digital to Analog converter

Other

Pin/Peg

24

DIP

Rectangular

Metal

10 V

No

1

Bipolar

16

3 µs

55 mA

0.003 %

Parallel, Word

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP24,.6

Other Converters

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-MDMA-P24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Complementary Offset Binary

AD7533BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

0.3 in (7.62 mm)

No

e0

0.79 in (20.07 mm)

Binary, Offset Binary

AD7548BQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

3 mA

1.1719 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T20

0.197 in (5 mm)

0.3 in (7.62 mm)

No

e0

0.953 in (24.195 mm)

Offset Binary

AD7542BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, Word

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

AD7245AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

5 V

No

1

CMOS

12

0.0488 %

Parallel, Word

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-5 V

Binary

AD1860R-K

Analog Devices

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3.12 V

Yes

1

BIMOS

18

15 mA

Serial

5 V

±5/±12 V

-5 V

Small Outline

SOP16,.4

Other Converters

1.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDSO-G16

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

-3.12 V

0.39 in (9.9 mm)

2's Complement Binary

AD7534BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

3 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T20

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

Binary

HDM-1210-SDB

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1.024 V

No

1

Bipolar

MIL-STD-883 Class B (Modified)

12

170 ns

72 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

120 ns

0.1 in (2.54 mm)

100 °C (212 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

0 V

Binary

5962-01-250-4838

Analog Devices

Digital to Analog converter

Other

Through-Hole

14

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

6

2 mA

5/15 V

In-Line

DIP14,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T14

No

Binary

DAC8408GBC

Analog Devices

Digital to Analog converter

Other

No Lead

28

DIE

Rectangular

Yes

4

CMOS

MIL-STD-883 Class B (Modified)

8

1 mA

0.0977 %

Parallel, 8 Bits

5 V

5 V

Uncased Chip

DIE OR CHIP

Other Converters

190 ns

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N28

No

e0

Binary, Offset Binary

DAC08GTBC

Analog Devices

Digital to Analog converter

Other

No Lead

16

DIE

Rectangular

18 V

Yes

1

Bipolar

MIL-STD-883 Class B (Modified)

8

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

85 ns

125 °C (257 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N16

No

e0

-10 V

Offset Binary

AD7522KD

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.0977 %

Serial, Parallel, Word

15 V

5,15 V

In-Line

DIP28,.6

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

e0

1.397 in (35.49 mm)

Binary

DAC8562GBC

Analog Devices

Digital to Analog converter

Other

No Lead

19

DIE

Rectangular

4.095 V

Yes

1

Bipolar

MIL-STD-883 Class B (Modified)

12

6 mA

0.0244 %

Parallel, Word

5 V

5 V

Uncased Chip

DIE OR CHIP

Other Converters

16 µs

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N19

No

e0

0 V

Binary

5962-01-213-0352

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

0.1 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

AD1856R-J

Analog Devices

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

BIMOS

16

15 mA

Serial

5 V

±5 V

-5 V

Small Outline

SOP16,.4

Other Converters

1.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDSO-G16

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

-3 V

0.39 in (9.9 mm)

2's Complement Binary

AD7520LD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.79 in (20.07 mm)

Binary

AD8522CHIPS

Analog Devices

Digital to Analog converter

Other

No Lead

14

DIE

Rectangular

Yes

2

Bipolar

12

5 mA

0.037 %

Serial

5 V

5 V

Uncased Chip

DIE OR CHIP

Other Converters

16 µs

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N14

No

e0

Binary

AD7538AQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

BICMOS

14

2 µs

4 mA

0.012 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD9713BBP-REEL

Analog Devices

Digital to Analog converter

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

188 mA

0.0427 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Other Converters

27 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

Binary

AD7546AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

16

0.05 %

Parallel, Word

15 V

-5 V

In-Line

DIP40,.6

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.