Other Digital-to-Analog Converters 1,129

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MX7534BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

14

1.5 µs

3 mA

0.0061 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary, Offset Binary

MX7547BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary, 2's Complement Binary

MX7535AD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary, Offset Binary

MAX5207ACUB+

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

3 V

Yes

1

BICMOS

16

1.5 mA

0.0305 %

Serial

3 V

3/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

25 µs

0.02 in (0.5 mm)

105 °C (221 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Offset Binary

MX7524CD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7524JP+

Maxim Integrated

Digital to Analog converter

Other

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

250 °C (482 °F)

0.353 in (8.965 mm)

Binary, Offset Binary

MAX5732BUTN-T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

0 V

0.315 in (8 mm)

Binary

MAX5735AUTN-T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-5 V

0.315 in (8 mm)

Binary

MAX5331UCB+

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

9.2 V

Yes

1

BICMOS

12

0.1 %

Serial

10 V

-4 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

e3

30 s

260 °C (500 °F)

-4.5 V

0.394 in (10 mm)

Binary

MAX5762AUTK

Maxim Integrated

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MX7548AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

3 mA

0.0244 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T20

1

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

0.97 in (24.638 mm)

Binary, Offset Binary, 2's Complement Binary

MX7545BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2 mA

0.0244 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

Binary, Offset Binary, 2's Complement Binary

MX7228BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

8

CMOS

8

5 µs

38 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

1.25 in (31.75 mm)

Binary

MX7542GBD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MX7547CQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary, 2's Complement Binary

AD7530JQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

10

2 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

e0

Binary, Offset Binary

MX7538AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary

MAX5774UCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

7.5 V

Yes

1

BICMOS

14

20 µs

0.0244 %

Serial

5 V

2.7/5,5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-2.5 V

0.394 in (10 mm)

2's Complement Binary

MAX5735AUCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0122 %

Serial

5 V

3/5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

-5 V

0.394 in (10 mm)

Binary

AD7531KQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.1 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

Binary, Offset Binary

MX7536AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Offset Binary

MX7524KEPE+

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Matte Tin

Dual

R-PDIP-T16

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

0.755 in (19.175 mm)

Binary, Offset Binary

MX7543AD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

MX7543BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5734BUTN-T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-2.5 V

0.315 in (8 mm)

Binary

MX7537CQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary, 2's Complement Binary

MX7545AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2 mA

0.0488 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

Binary, Offset Binary, 2's Complement Binary

MAX5733BUCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0244 %

Serial

5 V

3/5,3/10 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MAX5734CUCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

7.5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0977 %

Serial

5 V

3/5,3/8 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

-2.5 V

0.394 in (10 mm)

Binary

MAX5621UCB+

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

9.2 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

e3

30 s

260 °C (500 °F)

-4.5 V

0.394 in (10 mm)

Binary

MX7524AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7534BD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

3 mA

0.0061 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-CDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

-10 V

Binary, Offset Binary

MAX5732BUTN

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

0 V

0.315 in (8 mm)

Binary

MX7225CQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

4 µs

10 mA

0.1953 %

Parallel, Word

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

No

e0

Binary

MAX5733CUCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0977 %

Serial

5 V

3/5,3/10 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MX7534AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

14

1.5 µs

3 mA

0.0122 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary, Offset Binary

MX7536BD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

Offset Binary

MX7524KP+

Maxim Integrated

Digital to Analog converter

Other

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

0.353 in (8.965 mm)

Binary, Offset Binary

MAX5733AUTN-T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

0 V

0.315 in (8 mm)

Binary

MAX5735BUTN-T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-5 V

0.315 in (8 mm)

Binary

MAX5732CUCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0977 %

Serial

5 V

3/5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MAX5735BUCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0244 %

Serial

5 V

3/5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

-5 V

0.394 in (10 mm)

Binary

MAX5621UCB+T

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

9.2 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

-4.5 V

0.394 in (10 mm)

Binary

MAX5733BUTN-T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

0 V

0.315 in (8 mm)

Binary

MX7538BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary

MX7528BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

8

400 ns

1 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MX7543GBQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5774UTK

Maxim Integrated

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

7.5 V

Yes

1

BICMOS

14

20 µs

0.0244 %

Serial

5 V

2.7/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-2.5 V

0.394 in (10 mm)

2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.