Other Digital-to-Analog Converters 1,129

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

TDA1305TD-T

NXP Semiconductors

Digital to Analog converter

Other

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

20

40 mA

Serial

5 V

Small Outline

100 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.705 in (17.9 mm)

Binary

TDA1305T

NXP Semiconductors

Digital to Analog converter

Other

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

20

40 mA

Serial

5 V

5 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e4

0.705 in (17.9 mm)

Binary

TDA1543APN

NXP Semiconductors

Digital to Analog converter

Other

3.8 V

2

16

Serial

5 V

500 ns

85 °C (185 °F)

-30 °C (-22 °F)

No

1.8 V

2's Complement Binary

TDA1305TD

NXP Semiconductors

Digital to Analog converter

Other

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

20

40 mA

Serial

5 V

Small Outline

100 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.705 in (17.9 mm)

Binary

TDA1543T-T

NXP Semiconductors

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3.8 V

Yes

2

16

Serial

5 V

Small Outline

500 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Dual

R-PDSO-G16

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

1.8 V

0.406 in (10.3 mm)

2's Complement Binary

UDA1330ATS/N1

NXP Semiconductors

Digital to Analog converter

Other

Gull Wing

16

LSSOP

Rectangular

Plastic/Epoxy

Yes

1

20

Serial

5 V

Small Outline, Low Profile, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G16

0.059 in (1.5 mm)

0.173 in (4.4 mm)

No

0.205 in (5.2 mm)

Binary

TDA1543T

NXP Semiconductors

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3.8 V

Yes

2

16

Serial

5 V

Small Outline

500 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Dual

R-PDSO-G16

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

1.8 V

0.406 in (10.3 mm)

2's Complement Binary

TDA1543

NXP Semiconductors

Digital to Analog converter

Other

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

3.8 V

No

2

16

Serial

5 V

In-Line

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Dual

R-PDIP-T8

0.165 in (4.2 mm)

0.3 in (7.62 mm)

No

1.8 V

0.374 in (9.5 mm)

2's Complement Binary

UDA1431T

NXP Semiconductors

Digital to Analog converter

Other

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

1.925 V

Yes

1

CMOS

16

Serial

12 V

3.3,12 V

Small Outline

SOP14,.25

Other Converters

0.05 in (1.27 mm)

65 °C (149 °F)

5 °C (41 °F)

Dual

R-PDSO-G14

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

1.575 V

0.341 in (8.65 mm)

Binary

MB88141APFV

Infineon Technologies

Digital to Analog converter

Other

Gull Wing

24

LSSOP

Rectangular

Plastic/Epoxy

5.8 V

Yes

1

CMOS

8

100 µs

2.5 mA

0.5859 %

Serial

5 V

Small Outline, Low Profile, Shrink Pitch

SSOP24,.3

0.026 in (0.65 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G24

0.057 in (1.45 mm)

0.22 in (5.6 mm)

0 V

0.305 in (7.75 mm)

Binary

MB88141PF

Infineon Technologies

Digital to Analog converter

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

5.8 V

Yes

1

CMOS

8

100 µs

3.7 mA

0.5859 %

Serial

5 V

Small Outline

SOP24,.3

0.05 in (1.27 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G24

0.089 in (2.25 mm)

0.209 in (5.3 mm)

0 V

0.6 in (15.24 mm)

Binary

MB88347LPF

Infineon Technologies

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3.9 V

Yes

1

CMOS

8

200 µs

2 mA

0.5859 %

Serial

3 V

Small Outline

SOP16,.3

0.05 in (1.27 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G16

0.089 in (2.25 mm)

0.209 in (5.3 mm)

0 V

0.4 in (10.15 mm)

Binary

MB88141PFV

Infineon Technologies

Digital to Analog converter

Other

Gull Wing

24

LSSOP

Rectangular

Plastic/Epoxy

5.8 V

Yes

1

CMOS

8

100 µs

3.7 mA

0.5859 %

Serial

5 V

Small Outline, Low Profile, Shrink Pitch

SSOP24,.3

0.026 in (0.65 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G24

0.057 in (1.45 mm)

0.22 in (5.6 mm)

0 V

0.305 in (7.75 mm)

Binary

MB88347LPFV

Infineon Technologies

Digital to Analog converter

Other

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

3.9 V

Yes

1

CMOS

8

200 µs

2 mA

0.5859 %

Serial

3 V

Small Outline, Low Profile, Shrink Pitch

SSOP16,.25

0.026 in (0.65 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G16

0.057 in (1.45 mm)

0.173 in (4.4 mm)

0 V

0.197 in (5 mm)

Binary

MB88347LP

Infineon Technologies

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

3.9 V

No

1

CMOS

8

200 µs

2 mA

0.5859 %

Serial

3 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T16

0.172 in (4.36 mm)

0.3 in (7.62 mm)

0 V

0.77 in (19.55 mm)

Binary

MB88345PF

Infineon Technologies

Digital to Analog converter

Other

Gull Wing

32

LQFP

Square

Plastic/Epoxy

5.4 V

Yes

1

CMOS

8

100 µs

5.4 mA

0.5859375 %

Serial

5 V

Flatpack, Low Profile

QFP32,.28,32

0.031 in (0.8 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Quad

S-PQFP-G32

0.067 in (1.7 mm)

0.276 in (7 mm)

0 V

0.276 in (7 mm)

Binary

MB88146AP

Infineon Technologies

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5.8 V

No

1

CMOS

8

3.7 mA

0.5859 %

Serial, Parallel, 8 Bits

5 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T24

0.195 in (4.96 mm)

0.6 in (15.24 mm)

0 V

1.189 in (30.2 mm)

Binary

MB88141APF

Infineon Technologies

Digital to Analog converter

Other

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

5.8 V

Yes

1

CMOS

8

100 µs

2.5 mA

0.5859 %

Serial

5 V

Small Outline

SOP24,.3

0.05 in (1.27 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G24

0.089 in (2.25 mm)

0.209 in (5.3 mm)

0 V

0.6 in (15.24 mm)

Binary

MB88141AP

Infineon Technologies

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5.8 V

No

1

CMOS

8

100 µs

2.5 mA

0.5859 %

Serial

5 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T24

0.195 in (4.96 mm)

0.6 in (15.24 mm)

0 V

1.189 in (30.2 mm)

Binary

MB88141P

Infineon Technologies

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5.8 V

Yes

1

CMOS

8

100 µs

3.7 mA

0.5859 %

Serial

5 V

In-Line

DIP24,.6

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T24

0.195 in (4.96 mm)

0.6 in (15.24 mm)

0 V

1.189 in (30.2 mm)

Binary

MX7536AD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

245 °C (473 °F)

Offset Binary

MX7531KQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7542BD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MX7545CQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary, 2's Complement Binary

MAX5734AUTN-T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N56

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

-2.5 V

0.315 in (8 mm)

Binary

AD7530KQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

10

2 mA

0.1 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

e0

Binary, Offset Binary

MX7225BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

4 µs

10 mA

0.3906 %

Parallel, Word

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

No

e0

Binary

AD7531JQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

Binary, Offset Binary

MAX5774UCB+

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

7.5 V

Yes

1

BICMOS

14

0.0244 %

Serial

5 V

Flatpack, Low Profile, Fine Pitch

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.394 in (10 mm)

2's Complement Binary

MX7628BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

400 ns

2.5 mA

0.1953 %

Parallel, 8 Bits

12 V

12/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

0.95 in (24.13 mm)

Binary

MX7226BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

4 µs

13 mA

0.3906 %

Parallel, Word

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

MX7530LD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7524BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX5734AUTN+T

Maxim Integrated

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

7.5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

-3,3/5,5,8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-2.5 V

0.315 in (8 mm)

Binary

MX7542AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7542AD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MX7543GBD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

0.75 in (19.05 mm)

Binary, Offset Binary

MX7537AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary, 2's Complement Binary

MX7524LP+

Maxim Integrated

Digital to Analog converter

Other

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e3

0.353 in (8.965 mm)

Binary, Offset Binary

MX7535BD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

-10 V

Binary, Offset Binary

MX7548BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

3 mA

0.0122 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T20

1

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

0.97 in (24.638 mm)

Binary, Offset Binary, 2's Complement Binary

MX7547AQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5732BUCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0244 %

Serial

5 V

3/5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MAX5733AUCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0122 %

Serial

5 V

3/5,3/10 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

1

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MAX5732AUCB

Maxim Integrated

Digital to Analog converter

Other

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

20 µs

15 mA

0.0122 %

Serial

5 V

3/5 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G64

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e0

0 V

0.394 in (10 mm)

Binary

MX7537BQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

Binary, Offset Binary, 2's Complement Binary

MX7524CQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7531LQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.05 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.