No Lead Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2635HUD-HZ10#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2637IDE-HZ12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD9911BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

2.39 V

Yes

1

10

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

1.21 V

0.315 in (8 mm)

Binary

AD7528SCHIPS

Analog Devices

Digital to Analog converter

Military

No Lead

20

DIE

Yes

2

CMOS

8

0.3906 %

Parallel, 8 Bits

5 V

Uncased Chip

125 °C (257 °F)

-55 °C (-67 °F)

Upper

X-XUUC-N20

No

Binary, Offset Binary

AD5660BCPZ-2500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5640BCPZ-2500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

0 V

0.118 in (3 mm)

Binary

5962-87702052X

Analog Devices

Digital to Analog Converter 12 bit

No Lead

20

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-PRF-38535

12

2 mA

0.048828125 %

Parallel, Word

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

Binary

LTC2611CDD-1#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2636CDE-LMI12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5647RBCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

5.5 V

Yes

1

CMOS

14

5 µs

0.0244 %

Serial

5 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Other Converters

3.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5391BCPZ-5

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

5.5 V

Yes

1

12

8 µs

475 μA

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

3 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.354 in (9 mm)

Binary

LTC2634IUD-LMX8#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.3 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2636HDE-HZ8#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

8

0.1953 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5445YCPZ

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

CMOS

12

120 ns

5 μA

0.0244 %

Parallel, Word

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16SQ,20

Other Converters

30 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.039 in (1 mm)

0.157 in (4 mm)

No

e3

260 °C (500 °F)

.4 V

0.157 in (4 mm)

Binary

AD9117BCPZRL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

3.25 V

Yes

1

14

0.0073 %

Serial, Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

11.5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.236 in (6 mm)

Binary, 2's Complement Binary

LTC2636HDE-LMX8#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2636IDE-LZ10#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

5962-87701022X

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

MIL-STD-883

8

Parallel, 8 Bits

5 V

Chip Carrier

180 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

Yes

0.35 in (8.89 mm)

Binary, Offset Binary

LTC2751BCUHF-16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0031 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

AD7224UE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

BICMOS

8

20 µs

6 mA

0.195 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD9715BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.2 V

Yes

1

CMOS

10

Serial

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.236 in (6 mm)

Binary, 2's Complement Binary

LTC2636HDE-LMI12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5390BCP-3-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

3.6 V

Yes

1

CMOS

14

10 µs

0.0244 %

Serial

3 V

3.3,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

AD9721TE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

3 V

Yes

1

Bipolar

MIL-STD-883

10

300 mA

0.1953 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

4.5 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-1.5 V

0.45 in (11.43 mm)

Binary

LTC2636IDE-LMX8#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

PM7548BRC/883

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

1

CMOS

38535Q/M;38534H;883B

12

1 µs

3 mA

0.012 %

Parallel, 8 Bits

15 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0 V

0.35 in (8.89 mm)

Binary, Offset Binary

LTC2634CUD-LMX8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7528TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

8

0 ns

2 mA

0.1953 %

Parallel, 8 Bits

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD5677RBCPZ-1-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.006103 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD9135BCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

11

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD9748ACP

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

1.25 V

Yes

1

CMOS

8

0.0391 %

Parallel, 8 Bits

3.3 V

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

240 °C (464 °F)

-1 V

0.197 in (5 mm)

Binary, 2's Complement Binary

AD7111UE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

1

CMOS

8

4 mA

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Complementary Binary

PM7543BRC/883

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.024 %

Parallel, Word

5 V

5 V

Chip Carrier

DIP16,.3

Other Converters

380 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0 V

0.35 in (8.89 mm)

Binary, Offset Binary

LTC2751ACUHF-16#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0015 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

AD9125BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

CMOS

16

490 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.39SQ,20

Other Converters

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N72

0.039 in (1 mm)

0.394 in (10 mm)

No

e3

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

LTC2636IDE-HMI12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2607CDE-1#TR

Analog Devices

Digital to Analog converter

Commercial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

16

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.157 in (4 mm)

Binary

DAC10G

Analog Devices

Digital to Analog converter

No Lead

18

DIE

Rectangular

18 V

Yes

1

10

15 mA

0.098 %

Parallel, Word

15 V

-15 V

Uncased Chip

85 ns

Tin Lead

Upper

R-XUUC-N18

No

e0

-18 V

Binary, Offset Binary

AD9768SE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

8

70 mA

Parallel, 8 Bits

5 V

5,-5.2 V

-5.2 V

Chip Carrier

LCC20,.35SQ

Other Converters

5 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

LTC2637HDE-LMI12#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

5962-87701012A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

8

500 μA

Parallel, 8 Bits

Chip Carrier

180 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

LTC2635CUD-LMX8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2637IDE-HMI10#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5753BCPZ-REEL

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

10 V

Yes

1

16

0.006 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

115 °C (239 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N40

0.039 in (1 mm)

0.236 in (6 mm)

-10 V

0.236 in (6 mm)

Binary

LTC2755CUP-14#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

14

0.0061 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.354 in (9 mm)

Binary

LTC2637CDE-LZ10#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5405YCP

Analog Devices

Digital to Analog converter

Automotive

No Lead

40

HVQCCN

Square

2.5 V

Yes

1

CMOS

12

120 ns

10 μA

0.0244 %

Parallel, Word

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

15 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e0

240 °C (464 °F)

0 V

0.236 in (6 mm)

Binary

AD5314ACPZ-WP

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSSON

Square

5.499 V

Yes

1

CMOS

10

9 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile, Shrink Pitch

SOLCC10,.11,20

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

.001 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.