No Lead Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD5391BCP-3-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

3.6 V

Yes

1

CMOS

12

8 µs

0.0244 %

Serial

3 V

3.3,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

6 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

AD5024BCPZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

5.5 V

Yes

4

12

6 mA

0.0366 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16(UNSPEC)

Other Converters

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

1

0.035 in (0.9 mm)

0.157 in (4 mm)

No

e3

0 V

0.157 in (4 mm)

Binary

5962-87702022A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

0.0488 %

Parallel, Word

5 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N20

No

e4

Binary, 2's Complement Binary

LTC2617CDE-1#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

14

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD664TE-BIP

Analog Devices

Digital to Analog converter

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

BIMOS

12

19 mA

0.012 %

Parallel, Word

15 V

-15 V

Chip Carrier

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N44

0.1 in (2.54 mm)

0.651 in (16.545 mm)

No

-10 V

0.651 in (16.545 mm)

Binary

5962-87701012C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

8

Parallel, 8 Bits

Chip Carrier

180 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD5542AACPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Yes

1

CMOS

16

150 μA

0.0031 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

1 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

No

0.118 in (3 mm)

Binary

DAC8841GBC

Analog Devices

Digital to Analog converter

Other

No Lead

24

DIE

3 V

Yes

8

CMOS

8

6 µs

26 mA

0.586 %

Serial

5 V

5 V

Uncased Chip

DIE OR CHIP

Other Converters

25 °C (77 °F)

-25 °C (-13 °F)

Tin Lead

Upper

X-XUUC-N24

No

e0

0 V

Binary

AD5602BCPZ-2-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

6

HVSON

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

R-PDSO-N6

0.031 in (0.8 mm)

0.079 in (2 mm)

0 V

0.118 in (3 mm)

Binary

AD7545UE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

LTC2634IUD-HZ10#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5348BCP-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

VQCCN

Square

5.499 V

Yes

1

CMOS

12

10 µs

1.65 mA

0.3906 %

Parallel, Word

3 V

3/5 V

Chip Carrier, Very Thin Profile

LCC40,.24SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e0

240 °C (464 °F)

.001 V

0.236 in (6 mm)

Binary

LTC2637HDE-LMX10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5671RBCPZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

12

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2607CDE-1

Analog Devices

Digital to Analog converter

Commercial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

16

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.157 in (4 mm)

Binary

LTC2611CDD#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2634IUD-HMI12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5391BCPZ-5-REEL

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

5.5 V

Yes

1

12

8 µs

475 μA

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

3 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

260 °C (500 °F)

0 V

0.354 in (9 mm)

Binary

LTC2634IUD-HZ12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5622ACPZ-2-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

6

HVSON

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.1465 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

R-PDSO-N6

0.031 in (0.8 mm)

0.079 in (2 mm)

0 V

0.118 in (3 mm)

Binary

LTC2751AIUHF-16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0015 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

LTC2636IDE-LMX12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

5962-87701012X

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

38535Q/M;38534H;883B

8

Parallel, 8 Bits

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

180 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

LTC2655BIUF-L16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

4

CMOS

16

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

9.1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

5962-88663023C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

8

CMOS

8

22 mA

Parallel, 8 Bits

15 V

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary

AD5628BCPZ-2-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

12

7 µs

2.25 mA

0.0244 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

2.5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2635HUD-HMI10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2656CUFD-L12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD7545GUE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

2 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

LTC2637IDE-HMI12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5304ACPZ-WP

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSSON

Square

5.499 V

Yes

1

CMOS

8

8 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile, Shrink Pitch

SOLCC10,.11,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

.001 V

0.118 in (3 mm)

Binary

AD5640BCPZ-1500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

0 V

0.118 in (3 mm)

Binary

AD5512AACPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Yes

1

CMOS

12

150 μA

0.0244 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

1 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

No

0.118 in (3 mm)

Binary

AD5625RBCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

4.5 µs

1.16 mA

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5735X

Analog Devices

Digital to Analog converter

No Lead

64

Square

Yes

16

Chip Carrier

Quad

S-XQCC-N64

No

LTC2636CDE-LMI8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD9720TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

38535Q/M;38534H;883B

10

290 mA

0.1465 %

Parallel, Word

5 V

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

DAC8408G

Analog Devices

Digital to Analog converter

No Lead

28

DIE

Rectangular

10 V

Yes

4

CMOS

8

0 ns

0.195 %

Parallel, 8 Bits

5 V

Uncased Chip

190 ns

Upper

R-XUUC-N28

No

-10 V

Binary, Offset Binary

DAC08-000C

Analog Devices

Digital to Analog converter

Military

No Lead

16

DIE

Rectangular

18 V

Yes

1

Bipolar

38535V;38534K;883S

8

3.8 mA

0.1 %

Parallel, 8 Bits

15 V

±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

125 °C (257 °F)

-55 °C (-67 °F)

Matte Tin - annealed

Upper

R-XUUC-N16

1

No

e3

-10 V

Binary

AD7535TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

38535Q/M;38534H;883B

14

1.5 µs

4 mA

0.006 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

LTC2637IDE-LZ10#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD7845TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

BICMOS

38535Q/M;38534H;883B

12

5 µs

10 mA

0.024 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-10 V

0.45 in (11.43 mm)

Binary

AD5677RBCPZ-2-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.006103 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2753CUK-12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

12

0.0244 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

LTC2641ACDD-16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

8

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

16

0.0015 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N8

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

ADV7125WBCPZ170-RL

Analog Devices

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

1.4 V

Yes

1

CMOS

8

0.3906 %

Parallel, 8 Bits

3.3 V

3.3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N48

1

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

0 V

0.276 in (7 mm)

Binary

AD5668BCPZ-2500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

16

7 µs

2.25 mA

0.0244 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

2.5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5304BCPZ-WP

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSSON

Square

5.499 V

Yes

1

CMOS

8

8 µs

900 μA

0.2441 %

Serial

3 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile, Shrink Pitch

SOLCC10,.11,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

.001 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.