No Lead Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5735BUTN+T

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

±5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

-5 V

0.315 in (8 mm)

Binary

MAX5886EGK+TD

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

12

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Binary

MAX5893EGK+TD

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

12

20 μA

0.024 %

Parallel, Word

1.8 V

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MX7628KC/D

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

DIE

Rectangular

Yes

2

CMOS

8

400 ns

2 mA

0.1953 %

Parallel, 8 Bits

12/15 V

Uncased Chip

DIE OR CHIP

Other Converters

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

Binary

MAX5884EGM

Analog Devices

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

1.1 V

Yes

1

CMOS

14

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e0

245 °C (473 °F)

-.5 V

0.276 in (7 mm)

Binary

MAX5851ETL+

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.25 V

Yes

2

CMOS

8

0.0977 %

Parallel, 8 Bits

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

12 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.236 in (6 mm)

Complementary Binary

MX7548SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Parallel, 8 Bits

5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

Binary

MAX5733AUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

10 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5,10.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MAX5622UTK+T

Analog Devices

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

9.2 V

Yes

1

BICMOS

16

42 mA

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

-4.5 V

0.394 in (10 mm)

Binary

MAX5895EGK+

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

2

16

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5316GTG+T

Analog Devices

Digital to Analog converter

No Lead

24

HVQCCN

Rectangular

5.4 V

Yes

1

BICMOS

16

6.5 mA

0.001525 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16X.2,20

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-XQCC-N24

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary, 2's Complement Binary

MAX5873EGK+TD

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

12

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5295ETE

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

3 V

Yes

1

BICMOS

8

4 µs

0.1953 %

Serial

3 V

2/3.3,3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N16

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

245 °C (473 °F)

0 V

0.157 in (4 mm)

Binary

MAX5631AETK

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

VQCCN

Square

7.6 V

Yes

1

BICMOS

16

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

-3.25 V

0.394 in (10 mm)

Binary

MAX5873EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

12

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5316GTG+

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

QCCN

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

16

7.5 mA

0.0015 %

5 V

5 V

Chip Carrier

LCC24,.16X.2,20

Other Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-PQCC-N24

1

No

e3

30 s

260 °C (500 °F)

Binary, 2's Complement Binary

DS4422N+T&R

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Square

4.75 V

Yes

1

7

250 μA

0.7812 %

Serial

3.3 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC14,.12,16

Other Converters

0.016 in (0.4 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-XDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5877EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

14

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX513C/D

Analog Devices

Digital to Analog converter

Commercial

No Lead

13

DIE

Rectangular

3.6 V

Yes

1

CMOS

8

0.5859 %

Serial

3 V

3/3.3 V

0 V

Uncased Chip

DIE OR CHIP

Other Converters

70 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N13

No

e0

0 V

Binary

MX7548TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

Parallel, 8 Bits

5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

Binary

MAX5621UTK+T

Analog Devices

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

9.2 V

Yes

1

BICMOS

16

42 mA

0.015 %

Serial

10 V

-4,5,10 V

-4 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e3

-4.5 V

0.394 in (10 mm)

Binary

MX7524SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

Parallel, 8 Bits

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N20

Binary

MAX5765BUTK

Analog Devices

Digital to Analog converter

Other

No Lead

68

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Quad

S-XQCC-N68

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

-5 V

0.394 in (10 mm)

Binary

MAX5763UTK

Analog Devices

Digital to Analog converter

Commercial Extended

No Lead

68

HVQCCN

Square

10 V

Yes

1

BICMOS

16

0.0244 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Quad

S-XQCC-N68

1

0.031 in (0.8 mm)

0.394 in (10 mm)

No

0 V

0.394 in (10 mm)

Binary

MAX5732AUTN+

Analog Devices

Digital to Analog converter

Other

No Lead

56

HVQCCN

Square

5 V

Yes

1

BICMOS

16

20 µs

0.0122 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.315 in (8 mm)

Binary

MAX5816ATB+

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

4

BICMOS

12

1.4 mA

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5877EGK+TD

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

14

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

14 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MX7837C/D

Analog Devices

Digital to Analog converter

Commercial

No Lead

25

DIE

Rectangular

10 V

Yes

2

BICMOS

12

10 mA

0.024 %

Parallel, 8 Bits

12 V

±12/±15 V

-12 V

Uncased Chip

DIE OR CHIP

Other Converters

4 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N25

No

e0

-10 V

Binary, Offset Binary

DS4422N+

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Square

4.75 V

Yes

1

7

250 μA

0.7812 %

Serial

3.3 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC14,.12,16

Other Converters

0.016 in (0.4 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-XDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5894EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

1

CMOS

14

11 ns

0.0061 %

Parallel, Word

1.8 V

1.8/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX5253BC/D

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

DIE

Rectangular

3 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Uncased Chip

16 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

0 V

Binary, Offset Binary

MAX5136AGTG+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

24

QCCN

Square

Plastic/Epoxy

Yes

2

BICMOS

16

2.3 mA

0.015 %

3/5 V

Chip Carrier

LCC24,.16SQ,20

Other Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N24

1

No

e3

30 s

260 °C (500 °F)

Binary

MAX5139GTE+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.23 V

Yes

1

BICMOS

12

0.0244 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.02 V

0.118 in (3 mm)

Binary

MAX5580BETP+T

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

12

6 µs

4 mA

0.0977 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

0 V

0.197 in (5 mm)

Binary

MAX5580AETP+

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

12

6 µs

4 mA

0.0244 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

MAX5580BETP+

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

5.25 V

Yes

1

BICMOS

12

6 µs

4 mA

0.0977 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2634HUD-HZ10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2606CDD-1#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2611CDD-1#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2656IUFD-H12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.6 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2755BIUP-16#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

16

0.0031 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.354 in (9 mm)

Binary

AD9115BCPZRL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

3.25 V

Yes

1

10

0.0186 %

Serial, Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

11.5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.236 in (6 mm)

Binary, 2's Complement Binary

DAC8228GBC

Analog Devices

Digital to Analog converter

No Lead

18

DIE

5 V

Yes

1

CMOS

8

0.391 %

Parallel, 8 Bits

12 V

Uncased Chip

2 µs

Tin Lead

Upper

X-XUUC-N18

No

e0

0 V

Binary

LTC2755IUP-12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

12

0.0244 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.354 in (9 mm)

Binary

LTC2606IDD#TR

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2636CDE-LMX12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

5962-88778012A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

2 mA

0.1221 %

Parallel, Word

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

Binary, 2's Complement Binary

LTC2634HUD-HMI10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.