Analog Devices Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2645IMS-L10#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

5 mA

0.098 %

Parallel, Word

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

7.4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

0 V

0.159 in (4.039 mm)

Binary

LTC2654BIUF-L16#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

8.9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2754BCUKG-16#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0031 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.315 in (8 mm)

Binary

AD5300BRTZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

6 µs

250 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Other Converters

4 µs

0.037 in (0.95 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e3

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5314ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5535BKBCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

Plastic/Epoxy

224 V

Yes

1

CMOS

14

20 mA

Serial

5 V

Grid Array, Low Profile

BGA124,14X14,40

60 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-PBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

e1

30 s

260 °C (500 °F)

1 V

0.591 in (15 mm)

Binary

AD5660CRMZ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

10 µs

1 mA

0.0244 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5676ARUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

0.0122 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD5722AREZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

HTSSOP

Rectangular

Plastic/Epoxy

12 V

Yes

1

CMOS

12

12 µs

3.25 mA

0.0244 %

Serial

5 V

3/5,±5/±15 V

-5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

10 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

-12 V

0.307 in (7.8 mm)

Binary, Offset Binary, 2's Complement Binary

AD7564BR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

10 μA

0.0122 %

Serial

5 V

5 V

Small Outline

SOP28,.4

Other Converters

550 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

30 s

240 °C (464 °F)

0.705 in (17.9 mm)

Binary

AD7837BRZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

2

BICMOS

12

5 µs

8 mA

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

Small Outline

SOP24,.4

Other Converters

3 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.606 in (15.4 mm)

Binary, Offset Binary

AD8300ARZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

Bipolar

12

3 mA

0.049 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

14 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

Binary

AD9162BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

DAC8800FSZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

2 µs

2 mA

0.195 %

Serial

12 V

12,GND/-5 V

-5 V

Small Outline

SOP20,.4

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.504 in (12.8 mm)

Binary

DS4402N+

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Square

Plastic/Epoxy

5 V

Yes

1

5

500 μA

3.125 %

Serial

4 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC14,.12,16

0.016 in (0.4 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC1661CMS8

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.494 V

Yes

1

CMOS

10

0.1953 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

30 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.046 in (1.17 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2664HUH-16#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0061 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

-10 V

0.197 in (5 mm)

Binary

LTC2754IUKG-12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.315 in (8 mm)

Binary

MAX532ACWE+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

12.5 V

Yes

2

CMOS

12

10 mA

0.0122 %

Serial

15 V

±12/±15 V

-15 V

Small Outline

SOP16,.4

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-12.5 V

0.406 in (10.3 mm)

Binary

MX7524JCSE+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Small Outline

SOP16,.25

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.406 in (10.3 mm)

Binary, Offset Binary

AD5370BSTZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

15.1 V

Yes

1

16

30 µs

20 mA

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.394 in (10 mm)

Binary

AD5582YRVZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

3 mA

0.0244 %

Parallel, Word

5 V

5/15/±5 V

-5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP48,.3,20

Other Converters

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G48

3

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

30 s

260 °C (500 °F)

0.492 in (12.5 mm)

Binary

AD558TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2.56 V

No

1

Bipolar

8

3 µs

25 mA

0.1465 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.8 in (20.32 mm)

Complementary Offset Binary

AD5622YKSZ-2500RL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

10 µs

100 μA

0.0488 %

Serial

3 V

3/5 V

Small Outline, Very Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e4

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD5667BCPZ-R2

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

5.5 V

Yes

1

CMOS

16

7 µs

0.0183 %

Serial

5 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-XDSO-N10

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC1448CS8

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

2

12

0.1343 %

Serial

3 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.9025 mm)

Binary

LTC1448CS8#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

2

12

700 μA

0.1343 %

Serial

3 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0 V

0.193 in (4.9 mm)

Binary

LTC2621CDD#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2625CGN#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

7 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

LTC2656BIUFD-H16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

7.9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2754ACUKG-16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0015 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.315 in (8 mm)

Binary

LTC2754BCUKG-16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0031 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.315 in (8 mm)

Binary

LTC2754CUKG-12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.315 in (8 mm)

Binary

LTC2754CUKG-12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.315 in (8 mm)

Binary

AD5620BRJZ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

10 µs

1 mA

0.0244 %

Serial

5 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e3

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5664RBRMZ-5REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

1.2 mA

0.0244 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5686ACPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

16

8 µs

700 μA

0.0122 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7564BR-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

10 μA

0.0122 %

Serial

5 V

5 V

Small Outline

SOP28,.4

Other Converters

550 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

Binary

AD9144BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Binary, Offset Binary, 2's Complement Binary

AD9144BCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

88

HVQCCN

Square

.75 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N88

3

0.035 in (0.9 mm)

0.472 in (12 mm)

e3

30 s

260 °C (500 °F)

-.25 V

0.472 in (12 mm)

Binary, Offset Binary, 2's Complement Binary

LTC2636IDE-LZ12#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2755ACUP-16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

16

0.0015 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.354 in (9 mm)

Binary

MAX515CPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

4.6 V

No

1

CMOS

10

400 μA

0.0488 %

Serial

5 V

5 V

0 V

In-Line

DIP8,.3

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX550ACUA+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

10 μA

0.39 %

Serial

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD1938YSTZRL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

2.48 V

Yes

1

Serial

3.3 V

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

With programmable PLL

e3

30 s

260 °C (500 °F)

-2.48 V

0.276 in (7 mm)

Binary

AD5060BRJZ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

5.45 V

Yes

1

CMOS

16

0.0015 %

Serial

3 V

5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

4 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5304ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5322ARMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

450 μA

0.3906 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.