Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
5 V |
No |
1 |
CMOS |
MIL-STD-883 |
8 |
5 µs |
10 mA |
0.1953 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
In-Line |
DIP24,.3 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
-5 V |
1.25 in (31.75 mm) |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Bipolar |
10 |
16 mA |
0.05 % |
5,-15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T16 |
No |
Binary, Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
18 V |
Yes |
1 |
Bipolar |
8 |
150 ns |
7.8 mA |
0.19 % |
Parallel, 8 Bits |
15 V |
±15 V |
-15 V |
Small Outline |
SOP16,.25 |
Other Converters |
85 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
0.39 in (9.9 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
13 V |
No |
4 |
BICMOS |
12 |
10 µs |
19 mA |
0.0183 % |
Parallel, Word |
15 V |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
14 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
14 |
5 µs |
1.16 mA |
0.0244 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP14,.25 |
3.5 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G14 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
8 |
CMOS |
8 |
0.1953 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
3.5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.159 in (4.039 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
1 |
Bipolar |
12 |
4 µs |
25 mA |
0.018 % |
±12/±15 V |
DIE OR CHIP |
Other Converters |
125 °C (257 °F) |
-55 °C (-67 °F) |
No |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
BICMOS |
12 |
2 mA |
Parallel, 8 Bits |
Chip Carrier |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary, Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
20 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
16 |
0.0183 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
8.9 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
R-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
10 |
9 µs |
250 μA |
0.29 % |
Parallel, Word |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
SSOP20,.25 |
Other Converters |
7 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.256 in (6.5 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
12 |
0.061 % |
Serial |
5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
4.6 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.114 in (2.9 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
2 |
BICMOS |
12 |
10 µs |
0.0244 % |
Serial |
12 V |
12/15,GND/-12/-15 V |
-12 V |
Small Outline |
SOP16,.4 |
Other Converters |
5 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
3 |
0.107 in (2.72 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.406 in (10.3 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
8 |
0.1953 % |
Serial |
5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
3.7 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
0 V |
0.114 in (2.9 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
4.2 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
0 V |
0.114 in (2.9 mm) |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
Yes |
1 |
Bipolar |
8 |
25 mA |
Parallel, 8 Bits |
5 V |
Chip Carrier |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0 V |
0.35 in (8.89 mm) |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
1 |
CMOS |
10 |
2.7 mA |
0.0977 % |
Serial |
5 V |
3/5/±5 V |
-5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.197 in (5 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
12 |
4 µs |
0.0244 % |
Serial |
15 V |
-15 V |
In-Line |
DIP24,.3 |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
1.2 in (30.48 mm) |
Binary, Offset Binary, 2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
0.2441 % |
Serial |
3 V |
Small Outline, Shrink Pitch |
19 µs |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
14 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
6 mA |
0.0061 % |
Serial |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP14,.25 |
Other Converters |
10.7 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G14 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary |
|||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
LSSOP |
Rectangular |
Plastic/Epoxy |
4.046 V |
Yes |
1 |
CMOS |
16 |
0.0015 % |
Serial |
3 V |
3 V |
Small Outline, Low Profile, Shrink Pitch |
TSSOP8,.1 |
Other Converters |
10 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
e0 |
0 V |
0.114 in (2.9 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
1 |
Bipolar |
12 |
40 mA |
0.018 % |
±12/±15 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
Binary, Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
5 V |
2 |
CMOS |
12 |
Parallel, Word |
12 V |
-12 V |
85 °C (185 °F) |
-40 °C (-40 °F) |
No |
-5 V |
Binary |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Gull Wing |
16 |
SOIC |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
8 |
400 ns |
2 mA |
0.195 % |
Parallel, 8 Bits |
5 V |
Small Outline |
SOP16,.25 |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDSO-G16 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
0.39 in (9.9 mm) |
Binary |
|||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
6 |
VSSOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
8 |
0.1953 % |
Serial |
3 V |
Small Outline, Very Thin Profile, Shrink Pitch |
3.2 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G6 |
1 |
0.039 in (1 mm) |
0.049 in (1.25 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.079 in (2 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
32 |
VQCCN |
Square |
1.25 V |
Yes |
1 |
CMOS |
12 |
0.061 % |
Parallel, Word |
3.3 V |
3.3 V |
Chip Carrier, Very Thin Profile |
LCC32,.2SQ,20 |
Other Converters |
11 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e0 |
240 °C (464 °F) |
-1 V |
0.197 in (5 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
8 |
0.1953 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
3.3 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
160 |
LFBGA |
Square |
1 V |
Yes |
1 |
CMOS |
10 |
0.0488 % |
Serial |
1.8 V |
1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA160,14X14,32 |
Other Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead Silver |
Bottom |
S-XBGA-B160 |
4 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e0 |
240 °C (464 °F) |
-1 V |
0.472 in (12 mm) |
Binary, 2's Complement Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
4.3 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.1 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
2 |
CMOS |
10 |
9 µs |
0.29 % |
Parallel, Word |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Other Converters |
7 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.307 in (7.8 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
8 |
0.1953 % |
Serial |
3 V |
Small Outline, Very Thin Profile, Shrink Pitch |
3.2 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.114 in (2.9 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
12 |
0.061 % |
Serial |
3 V |
Small Outline, Very Thin Profile, Shrink Pitch |
4.1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.114 in (2.9 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1.9 V |
Yes |
2 |
CMOS |
10 |
0.0586 % |
Parallel, Word |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
5.9 ns |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1 V |
0.354 in (9 mm) |
Offset Binary, 2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
52 |
LQFP |
Square |
Plastic/Epoxy |
3.6 V |
Yes |
1 |
CMOS |
14 |
10 µs |
0.0244 % |
Serial |
3 V |
3.3,3/5 V |
Flatpack, Low Profile |
QFP52,.47SQ |
Other Converters |
8 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G52 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.394 in (10 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
4.2 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
3.12 V |
Yes |
1 |
BIMOS |
18 |
15 mA |
Serial |
5 V |
±5/±12 V |
-5 V |
Small Outline |
SOP16,.4 |
Other Converters |
1.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
-3.12 V |
0.39 in (9.9 mm) |
2's Complement Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
3 V |
Yes |
1 |
CMOS |
8 |
2 µs |
5 mA |
0.3906 % |
Parallel, 8 Bits |
3 V |
3/5 V |
Small Outline |
SOP20,.4 |
Other Converters |
1.2 µs |
0.05 in (1.27 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.504 in (12.8 mm) |
Binary |
||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
2 |
CMOS |
8 |
8 µs |
0.39 % |
Parallel, 8 Bits |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
SSOP20,.25 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
0.256 in (6.5 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
6 |
VSSOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
10 |
0.0977 % |
Serial |
3 V |
Small Outline, Very Thin Profile, Shrink Pitch |
3.9 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G6 |
1 |
0.039 in (1 mm) |
0.049 in (1.25 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.079 in (2 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
38535Q/M;38534H;883B |
12 |
2 µs |
3 mA |
0.012 % |
Parallel, 8 Bits |
15 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
12 |
2 mA |
0.0244 % |
Parallel, Word |
5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
8 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
4 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.159 in (4.039 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
Yes |
8 |
BICMOS |
12 |
3.5 mA |
0.0122 % |
Serial |
5 V |
5 V |
Flatpack |
QFP44,.57SQ,32 |
Other Converters |
500 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e0 |
240 °C (464 °F) |
0.394 in (10 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
32 |
VQCCN |
Square |
1.25 V |
Yes |
1 |
CMOS |
12 |
0.061 % |
Parallel, Word |
3.3 V |
Chip Carrier, Very Thin Profile |
11 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
-1 V |
0.197 in (5 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
Bipolar |
8 |
70 mA |
Parallel, 8 Bits |
5 V |
5,-5.2 V |
-5.2 V |
In-Line |
DIP18,.3 |
Other Converters |
5 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
3 V |
No |
1 |
MOS |
12 |
4 µs |
13 mA |
0.012 % |
Parallel, Word |
5 V |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-3 V |
2's Complement Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
4 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.114 in (2.9 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
16 |
DIE |
Rectangular |
18 V |
Yes |
1 |
Bipolar |
MIL-STD-883 Class B (Modified) |
8 |
7.8 mA |
0.1 % |
Parallel, 8 Bits |
15 V |
±15 V |
-15 V |
Uncased Chip |
DIE OR CHIP |
Other Converters |
85 ns |
125 °C (257 °F) |
25 °C (77 °F) |
Tin Lead |
Upper |
R-XUUC-N16 |
No |
e0 |
-10 V |
Offset Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.