Analog Devices Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

5962-8965701LC

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

12

2 mA

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7394AN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

70 µs

200 μA

0.0488 %

Serial

3 V

3/5 V

In-Line

DIP14,.3

Other Converters

70 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T14

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

LTC2654BCGN-H16#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Small Outline, Shrink Pitch

7.9 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.192 in (4.88 mm)

Binary

ADV7128KR30-REEL

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

100 mA

0.0977 %

Parallel, Word

5 V

5 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

Binary

AD7537TE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

BICMOS

12

2 µs

2 mA

0.0122 %

Parallel, 8 Bits

12 V

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

5962-01-412-7971

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

2

BICMOS

12

1.5 µs

2 mA

0.012 %

12/15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

Binary

AD7845KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.5062 mm)

Binary, Offset Binary

AD5532ABCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

LTC2631CTS8-LM12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

12

0.061 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD569SD

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

5 V

No

1

BICMOS

16

6 µs

13 mA

0.04 %

Parallel, Word

12 V

±12 V

-12 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-5 V

Binary

LTC2634CUD-LZ12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5392BCP-5-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

5.5 V

Yes

1

CMOS

14

10 µs

0.0183 %

Serial

5 V

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

LTC7106IDDB-1#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

10

HVSON

Rectangular

Plastic/Epoxy

Yes

1

CMOS

7

1.25 %

Serial

3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N10

0.031 in (0.8 mm)

0.079 in (2 mm)

e3

0.118 in (3 mm)

2's Complement

AD5314ARM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

LTC1596-1CISW#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Small Outline

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

-10 V

0.406 in (10.3 mm)

Binary, Offset Binary

AD5620BRJ-1500RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

3.3 V

Yes

1

CMOS

12

10 µs

1 mA

0.0244 %

Serial

3 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

240 °C (464 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2600CGN#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

4 mA

0.0977 %

Serial

3 V

Small Outline, Shrink Pitch

SSOP16,.25

10 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.068 in (1.727 mm)

0.154 in (3.899 mm)

e0

0 V

0.193 in (4.8895 mm)

Binary

LTC2607IDE

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

16

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.157 in (4 mm)

Binary

AD7533ACHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

DIE

Yes

2

CMOS

10

800 ns

2 mA

0.1953 %

Parallel, Word

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

800 ns

85 °C (185 °F)

-40 °C (-40 °F)

Upper

X-XUUC-N

No

Binary, Offset Binary

AD7537LN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

2

BICMOS

12

2 µs

2 mA

0.0122 %

Parallel, 8 Bits

12 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

Binary

AD664BJ

Analog Devices

Digital to Analog converter

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

4

BICMOS

12

10 µs

19 mA

0.0183 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

Chip Carrier

LDCC44,.7SQ

Other Converters

10 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Gold

Quad

S-PQCC-J44

0.135 in (3.42 mm)

0.65 in (16.51 mm)

No

e4

0.65 in (16.51 mm)

Binary

5962R8993202VEA

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

100k Rad(Si)

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

MIL-PRF-38535 Class V

8

135 ns

8 mA

0.35 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

Yes

e0

-10 V

Binary

LTC2656BIUFD-L16#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

8.9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD7948BRZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

600 ns

0.0122 %

Parallel, 8 Bits

5 V

5 V

Small Outline

SOP20,.4

Other Converters

600 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

Binary, Offset Binary

AD667KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Square

Plastic/Epoxy

10 V

Yes

1

12

4 µs

0.0061 %

Parallel, Word

12 V

-12 V

In-Line

DIP28,.6

3 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.445 in (36.703 mm)

Binary, Offset Binary

AD5312BRM-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

400 μA

0.1953 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSOP10,.5

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

LTC2632A-LX12#TRPBF

Analog Devices

Digital to Analog Converter 12 bit

Gull Wing

8

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

600 μA

0.036621094 %

Serial

5 V

Dual

R-PDSO-G8

0 V

Binary

AD5640ARJ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

10 µs

1 mA

0.0488 %

Serial

5 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

240 °C (464 °F)

0 V

0.114 in (2.9 mm)

Binary

DAC8043A1FS

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

10 μA

0.0244 %

Serial

5 V

5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

240 °C (464 °F)

0.193 in (4.9 mm)

Offset Binary

AD5601BCPZ-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

6

HVSON

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

10 µs

100 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC6,.1,25

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N6

1

0.031 in (0.8 mm)

0.079 in (2 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

AD7524SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

0 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

LTC2640CTS8-LZ12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD7118CQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

6

2 mA

Parallel, Word

5 V

5/15 V

In-Line

DIP14,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

AD5312ARM-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

450 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

LTC2657BCUFD-L16#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

9.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD7224UE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

BICMOS

MIL-STD-883 Class B

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD7943BNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

12

0.0122 %

Serial

5 V

In-Line

600 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.793 in (20.13 mm)

Binary, Offset Binary

AD5679BCPZ-1-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5669RACPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

16

10 µs

2.5 mA

0.0488 %

Serial

3 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N16

0.031 in (0.8 mm)

0.157 in (4 mm)

No

0 V

0.157 in (4 mm)

Binary

AD7302BR-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

8

2 µs

5 mA

0.3906 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline

SOP20,.4

Other Converters

1.2 µs

0.05 in (1.27 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0 V

0.504 in (12.8 mm)

Binary

AD7840ARSZ

Analog Devices

Digital to Analog converter

Other

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

BICMOS

14

4 µs

14 mA

0.0122 %

Serial, Parallel, Word

5 V

±5 V

-5 V

Small Outline, Shrink Pitch

SSOP24,.3

Other Converters

2.5 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

-3 V

0.323 in (8.2 mm)

2's Complement Binary

LTC2752ACLX#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0015 %

Serial

5 V

Flatpack, Low Profile, Fine Pitch

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

LTC1329ACS8-50#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

8

150 μA

Serial

3.3 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0.193 in (4.9 mm)

Binary

AD9712AJP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

2 V

Yes

1

Bipolar

12

165 mA

0.048 %

Parallel, Word

5 V

-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Other Converters

22 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

-1.2 V

0.453 in (11.5062 mm)

Binary

AD9702BW

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

3 V

No

3

Bipolar

4

10 ns

348 mA

5 %

Parallel, 4 Bits

5 V

GND/5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Other Converters

8 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

-1.2 V

1.2 in (30.48 mm)

Binary

DAC8408BIET

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

0.0977 %

Parallel, 8 Bits

5 V

In-Line

190 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

LTC2664CUH-12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

12

0.0244 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

15.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

-10 V

0.197 in (5 mm)

Binary

AD662JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

2.56 V

No

1

BICMOS

12

13.5 mA

0.0977 %

Parallel, Word

5 V

5 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.992 in (25.2 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.