Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
12 |
0.2441 % |
Serial |
Small Outline, Low Profile, Shrink Pitch |
10 µs |
0.037 in (0.95 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.065 in (1.65 mm) |
No |
e0 |
0 V |
0.114 in (2.9 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
1 |
BICMOS |
16 |
0 ns |
0.0122 % |
Parallel, Word |
5 V |
±5 V |
-5 V |
Small Outline |
SOP28,.4 |
Other Converters |
25 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
-1.2 V |
0.705 in (17.9 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
16 |
0.0031 % |
Parallel, Word |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
2 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
0.276 in (7 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
2 |
BICMOS |
12 |
10 mA |
0.0122 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
Small Outline |
SOP24,.4 |
Other Converters |
3 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
-10 V |
0.606 in (15.4 mm) |
Binary, Offset Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
10 |
800 ns |
2 mA |
0.2 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDIP-T16 |
No |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
16 |
0.0031 % |
Parallel, Word |
5 V |
Small Outline, Shrink Pitch |
1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
-10 V |
0.323 in (8.2 mm) |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
12 |
10 µs |
375 μA |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
8 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
240 °C (464 °F) |
.001 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Pin/Peg |
24 |
DIP |
Rectangular |
No |
1 |
Hybrid |
MIL-PRF-38534 Class H |
12 |
0.0366 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-P24 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.272 in (32.32 mm) |
Binary |
|||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Small Outline, Very Thin Profile, Shrink Pitch |
4 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.114 in (2.9 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
4 |
BICMOS |
12 |
10 µs |
0.018 % |
5,±12/±15 V |
In-Line |
DIP28,.6 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T28 |
No |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Hybrid |
12 |
0.0122 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
Binary Coded Decimal |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
BICMOS |
14 |
1.5 µs |
4 mA |
0.012 % |
Parallel, Word |
12/15,-0.3 V |
Small Outline |
SOP24,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.606 in (15.4 mm) |
Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
4 |
BICMOS |
8 |
5 µs |
12 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
72 |
HVQCCN |
Square |
1 V |
Yes |
1 |
CMOS |
16 |
Serial |
3.3 V |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC72,.39SQ,20 |
Other Converters |
20 ns |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N72 |
3 |
0.039 in (1 mm) |
0.394 in (10 mm) |
e4 |
-1 V |
0.394 in (10 mm) |
Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
BICMOS |
12 |
2 µs |
2 mA |
0.0244 % |
Parallel, 8 Bits |
12 V |
12/15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
6 |
2 mA |
Parallel, Word |
5 V |
5/15 V |
In-Line |
DIP14,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.793 in (20.13 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
10 |
0.293 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
7 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
.001 V |
0.197 in (5 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
0.0488 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
8 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
No |
e0 |
0 V |
0.079 in (2 mm) |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
10 |
9 µs |
450 μA |
0.3906 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
7 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
240 °C (464 °F) |
.001 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1.25 V |
Yes |
1 |
CMOS |
12 |
0.0977 % |
Parallel, Word |
5 V |
5 V |
Small Outline |
SOP28,.4 |
Other Converters |
35 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
-1 V |
0.705 in (17.9 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
6 |
VSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
8 |
0.3906 % |
Serial |
5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
3.7 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G6 |
0.039 in (1 mm) |
0.049 in (1.25 mm) |
e3 |
0 V |
0.079 in (2 mm) |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
4 |
CMOS |
MIL-STD-883 |
8 |
0.1953 % |
Parallel, 8 Bits |
5 V |
Chip Carrier |
190 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary, Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Other |
No Lead |
48 |
HVQCCN |
Square |
1.4 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Parallel, Word |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Quad |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.276 in (7 mm) |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
10 |
9 µs |
375 μA |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
7 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
240 °C (464 °F) |
.001 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
No |
2 |
CMOS |
8 |
400 ns |
2 mA |
0.2 % |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
No |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
14 |
2 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
0.453 in (11.5062 mm) |
Binary, Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
3.35 V |
Yes |
1 |
16 |
0.0061 % |
Serial |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
10 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
16 |
0.0031 % |
Serial |
5 V |
Small Outline, Shrink Pitch |
2 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
-10 V |
0.244 in (6.2 mm) |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
0.0977 % |
Serial |
5 V |
Small Outline, Shrink Pitch |
7 µs |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
No |
e0 |
0 V |
0.193 in (4.8895 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Parallel, Word |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Other Converters |
35 ns |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
10 |
800 ns |
2 mA |
0.2 % |
15 V |
15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T16 |
No |
Binary, Offset Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
10 V |
No |
1 |
Bipolar |
MIL-STD-883 |
12 |
7 µs |
0.0122 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
-10 V |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
8 |
VSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
18 |
0.0244 % |
Serial |
5 V |
Small Outline, Very Thin Profile |
80 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-N8 |
3 |
0.033 in (0.85 mm) |
0.118 in (3 mm) |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
1 V |
Yes |
1 |
16 |
Serial |
3.3 V |
Grid Array, Low Profile, Fine Pitch |
20 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B196 |
0.051 in (1.3 mm) |
0.472 in (12 mm) |
-1 V |
0.472 in (12 mm) |
Binary, 2's Complement Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
18 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
Small Outline |
600 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G18 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.455 in (11.55 mm) |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
8 |
0 ns |
2 mA |
0.0977 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP16,.3 |
Other Converters |
500 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.793 in (20.13 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
8 |
CMOS |
8 |
0.1953 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
3.8 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.159 in (4.039 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
16 |
0.0015 % |
Parallel, Word |
5 V |
Small Outline, Shrink Pitch |
1 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
0.323 in (8.2 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
4.2 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
0 V |
0.114 in (2.9 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
8 |
CMOS |
8 |
0.1953 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
3.9 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.159 in (4.039 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
No |
1 |
CMOS |
12 |
1 µs |
2 mA |
0.024 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-XDIP-T18 |
No |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
1 µs |
2 mA |
0.012 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T18 |
No |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
2 |
CMOS |
12 |
10 µs |
15 mA |
0.024 % |
Parallel, Word |
15 V |
12/15,GND/-12/-15 V |
-15 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
3 V |
No |
2 |
CMOS |
12 |
4 µs |
28 mA |
0.012 % |
Serial |
5 V |
-5 V |
In-Line |
2.5 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-3 V |
2's Complement Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
5 |
VSSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
0.2441 % |
Serial |
3 V |
Small Outline, Very Thin Profile, Shrink Pitch |
30 µs |
0.037 in (0.95 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G5 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0 V |
0.114 in (2.9 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
1 |
CMOS |
12 |
10 µs |
12 mA |
0.0183 % |
Parallel, 8 Bits |
15 V |
12/15,GND/-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Other Converters |
7 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
0.953 in (24.195 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
5.5 V |
Yes |
4 |
12 |
6 mA |
0.0366 % |
Serial |
5 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16(UNSPEC) |
Other Converters |
5 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
1 |
0.035 in (0.9 mm) |
0.157 in (4 mm) |
No |
e3 |
0 V |
0.157 in (4 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 V |
No |
1 |
BICMOS |
16 |
5 mA |
0.0122 % |
Serial |
15 V |
5,±15 V |
-15 V |
In-Line |
DIP20,.3 |
Other Converters |
7 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
-10 V |
0.992 in (25.2 mm) |
Binary, Offset Binary, 2's Complement Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.