Analog Devices Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD557JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

2.56 V

No

1

Bipolar

8

2 µs

25 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

0.215 in (5.46 mm)

0.3 in (7.62 mm)

No

e0

0 V

Complementary Offset Binary

DAC08GT

Analog Devices

Digital to Analog converter

No Lead

16

DIE

18 V

Yes

1

8

0 ns

0.19 %

Parallel, 8 Bits

15 V

-15 V

Uncased Chip

85 ns

Tin Lead

Upper

X-XUUC-N16

No

e0

-10 V

Binary, Offset Binary

LTC2635HMSE-LMI12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2656BCUFD-L16#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

8.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC1668CG#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1 V

Yes

1

BICMOS

16

0.0122 %

Parallel, Word

5 V

-5 V

Small Outline, Shrink Pitch

20 ns

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-1 V

0.402 in (10.2 mm)

Binary

AD7538JRZ-REEL

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

14

1.5 µs

4 mA

0.012 %

Parallel, Word

12/15,-0.3 V

Small Outline

SOP24,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

Binary

AD7534TD/883B

Analog Devices

Digital to Analog converter

Parallel, Word

800 ns

Tin/Lead

e0

Binary

LTC2622CMS8#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

12

0.0977 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

7 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

DAC8012FR

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

1

CMOS

12

1 µs

2 mA

0.024 %

Parallel, Word

15 V

5/15 V

-15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, 2's Complement Binary

AD5314BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

900 μA

0.2441 %

Serial

3 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

Other Converters

7 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

3

0.033 in (0.85 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD7541AACHIPS

Analog Devices

Digital to Analog converter

Other

No Lead

18

DIE

Rectangular

Yes

1

CMOS

12

2 mA

0.024 %

Parallel, Word

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

600 ns

85 °C (185 °F)

-25 °C (-13 °F)

Upper

R-XUUC-N18

No

Binary, Offset Binary

AD1851RZ-REEL7

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3.12 V

Yes

1

BICMOS

16

15 mA

Serial

5 V

±5 V

-5 V

Small Outline

SOP16,.4

Other Converters

1.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-2.88 V

0.406 in (10.3 mm)

2's Complement Binary

AD7524AQ/883B

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

0.1953 %

Parallel, 8 Bits

15 V

In-Line

350 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary, Offset Binary

5962-9451802MLX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

BICMOS

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T24

Yes

Binary, Offset Binary

AD5671RBCPZ-RL

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

12

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2633HTS8-HI10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD7390AR-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

100 μA

0.0488 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

70 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

30 s

240 °C (464 °F)

0.193 in (4.9 mm)

Binary

LTC2630HSC6-HM12#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

12

0.0488 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2637HMS-LZ12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

HDG-0407BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

4

15 ns

225 mA

Parallel, 4 Bits

5 V

5 V

In-Line

DIP24,.6

Other Converters

8 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.215 in (5.457 mm)

0.6 in (15.24 mm)

No

e0

1.295 in (32.89 mm)

Binary

LTC7541AKSW#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

Small Outline

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

Binary, Offset Binary

AD7543TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.012 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

AD7543GTQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

2.5 mA

0.012 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

Binary

AD7537LP

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

BICMOS

12

2 µs

2 mA

0.0122 %

Parallel, 8 Bits

12 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

0.453 in (11.5062 mm)

Binary

5962-8770101RB

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

8

Parallel, 8 Bits

5 V

In-Line

180 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.953 in (24.195 mm)

Binary, Offset Binary

LTC2633ACTS8-LO12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.5 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5303ARUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

450 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

.001 V

0.197 in (5 mm)

Binary

AD9754ARUZRL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

14

0.0183 %

Parallel, Word

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

35 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.382 in (9.7 mm)

Binary

LTC1596-1AISW#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0015 %

Serial

5 V

Small Outline

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

-10 V

0.406 in (10.3 mm)

Binary, Offset Binary

LTC2619IGN-1#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

9 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

AD5062BRJ-2

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

3.996 V

Yes

1

CMOS

16

600 μA

0.0015 %

Serial

5 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

3 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

0.057 in (1.45 mm)

0.065 in (1.65 mm)

No

e0

0 V

0.116 in (2.95 mm)

Binary

5962-8851002XA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

11 V

No

4

CMOS

12

35 mA

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-11 V

Binary

LTC2641IMS8-14#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0061 %

Serial

3 V

Small Outline

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

AD7111UD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

8

4 mA

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Complementary Binary

AD9720KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

Bipolar

10

0 ns

0.098 %

Parallel, Word

5 V

-5.2 V

In-Line

5 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-1.2 V

1.472 in (37.4 mm)

Binary

LTC2640HTS8-LZ8#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD9753AST

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.25 V

Yes

1

CMOS

12

0.0366 %

Parallel, Word

3.3 V

3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

-1 V

0.276 in (7 mm)

Binary

LTC2633HTS8-LZ10#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5766-KGD-PT

Analog Devices

Digital to Analog converter

Industrial

No Lead

39

DIE

Square

10 V

Yes

1

16

0.0244 %

Serial

Uncased Chip

16 µs

105 °C (221 °F)

-40 °C (-40 °F)

Upper

S-XUUC-N39

0.157 in (4 mm)

-16 V

0.157 in (4 mm)

Binary

AD7522KD/883

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883

10

0.1 %

Serial, Parallel, Word

15 V

In-Line

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

1.397 in (35.49 mm)

Binary

LTC2630ACSC6-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.3906 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

0 V

0.079 in (2 mm)

Binary

LTC2621CDD#TR

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

12

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

7 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

5962-01-270-7108

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

Bipolar

12

4 µs

25 mA

0.018 %

±12/±15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

Binary, Offset Binary

AD1856R-REEL

Analog Devices

Digital to Analog converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

BIMOS

16

Serial

5 V

-5 V

Small Outline

1.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

240 °C (464 °F)

-3 V

0.39 in (9.9 mm)

2's Complement Binary

5962-01-310-9845

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

12

1 µs

3 mA

0.012 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

Binary

AD7545JPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.0488 %

Parallel, Word

5 V

Chip Carrier

LDCC20,.4SQ

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e3

260 °C (500 °F)

0.353 in (8.9662 mm)

Binary

5962-01-243-3072

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

4 mA

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T16

No

Complementary Binary

LTC2640HTS8-HM12#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.