Analog Devices Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7302BN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

CMOS

8

2 µs

5 mA

0.3906 %

Parallel, 8 Bits

3 V

3/5 V

In-Line

DIP20,.3

Other Converters

1.2 µs

0.1 in (2.54 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.992 in (25.2 mm)

Binary

AD5339ARM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

375 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

AD5342BRU-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

12

10 µs

0.29 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

0.382 in (9.7 mm)

Binary

AD9754ARUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

14

0.0183 %

Parallel, Word

5 V

Small Outline, Thin Profile, Shrink Pitch

35 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G28

0.043 in (1.1 mm)

0.173 in (4.4 mm)

-1 V

0.382 in (9.7 mm)

Binary

5962-01-407-9965

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

8

400 ns

1 mA

0.2 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-XDIP-T20

No

Binary, Offset Binary

LTC2630AISC6-LM12#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.4 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD9744ACP

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

VQCCN

Square

1.25 V

Yes

1

CMOS

14

0.0305 %

Parallel, Word

3.3 V

3.3 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

240 °C (464 °F)

-1 V

0.197 in (5 mm)

Binary, 2's Complement Binary

LTC1595AIN8#PBF

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

16

0.0015 %

Serial

5 V

In-Line

1 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

Binary, Offset Binary

AD7225KPZ

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

MIL-STD-883

8

5 µs

10 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

-5 V

0.453 in (11.506 mm)

Binary, Offset Binary

5962-01-385-0666

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

4

BICMOS

8

5 µs

12 mA

0.2 %

12/15, GND/-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T20

No

Binary

AD3860S

Analog Devices

Digital to Analog converter

Through-Hole

24

Rectangular

Plastic/Epoxy

No

12

In-Line

Dual

R-PDIP-T24

No

AD7248AAN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

10 µs

12 mA

0.0183 %

Parallel, 8 Bits

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP20,.3

Other Converters

7 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.3 in (7.62 mm)

No

e0

-5 V

Binary

AD396KD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

15 µs

28 mA

0.0061 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Offset Binary

PM7533GP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

15 V

No

2

CMOS

10

1 µs

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.793 in (20.13 mm)

Binary, Offset Binary

AD5767BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

Yes

1

12

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N40

3

0.031 in (0.8 mm)

0.236 in (6 mm)

30 s

260 °C (500 °F)

0.236 in (6 mm)

Binary

LTC1664CN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

CMOS

10

0.2441 %

Serial

3 V

In-Line

19 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.77 in (19.558 mm)

Binary

LTC2632ACTS8-LZ12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

600 μA

0.036 %

Parallel, Word

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

4.4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2609IGN-1#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

AD667KPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

Bipolar

12

4 µs

25 mA

0.0122 %

Parallel, Word

12 V

±12/±15 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

3 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.178 in (4.51 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

-10 V

0.453 in (11.506 mm)

Binary, Offset Binary, 2's Complement Binary

AD7549TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 µs

5 mA

0.0122 %

Parallel, 4 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.175 in (4.45 mm)

0.3 in (7.62 mm)

No

e0

1.062 in (26.972 mm)

Binary, Offset Binary

LTC1597AIG

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0015 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-10 V

0.402 in (10.2 mm)

Binary

LTC1657LIGN#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

16

0.0183 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

20 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.39 in (9.9 mm)

Binary

AD7528CQ/883B

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

38535Q/M;38534H;883B

8

400 ns

2 mA

0.2 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary, Offset Binary

AD768ACHIPS

Analog Devices

Digital to Analog converter

Other

No Lead

31

DIE

Rectangular

Yes

1

BICMOS

16

0.0122 %

Parallel, Word

5 V

±5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

25 µs

25 °C (77 °F)

25 °C (77 °F)

Upper

R-XUUC-N31

No

Binary

AD9746BCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

CMOS

14

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.39SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

AD5674BCPZ-1-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD7547JP

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

2 µs

2 mA

0.0244 %

Parallel, Word

12 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

0.453 in (11.506 mm)

Binary

LTC2631AHTS8-LZ8#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

0 V

0.114 in (2.9 mm)

Binary

AD7520SQ/883B

Analog Devices

Digital to Analog converter

Parallel, Word

500 ns

Tin Lead

e0

Binary

LTC1821AIGW#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

12.6 V

Yes

1

16

0.0015 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

2 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G36

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-12.6 V

0.606 in (15.4 mm)

Binary, Offset Binary

AD1859JRS-REEL

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

18

30 mA

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP28,.25

Other Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

240 °C (464 °F)

0.402 in (10.2 mm)

2's Complement Binary

LTC2634CUD-LMI8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAR-01-G/DAI-01G

Analog Devices

Digital to Analog converter

No Lead

16

DIE

Yes

1

10

0 ns

8.33 mA

0.1 %

Parallel, Word

15 V

-15 V

Uncased Chip

Tin Lead

Upper

X-XUUC-N16

No

e0

Binary

AD5424YCP

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

8

0.0977 %

Parallel, 8 Bits

Chip Carrier

30 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N20

3

0.039 in (1 mm)

0.157 in (4 mm)

No

e0

240 °C (464 °F)

.4 V

0.157 in (4 mm)

Binary

LTC2631AITS8-LM8#TRMPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

0 V

0.114 in (2.9 mm)

Binary

LTC2640ITS8-HZ12#TRMPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.6 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2633A-H712#TRPBF

Analog Devices

Digital to Analog Converter 12 bit

Gull Wing

8

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

0.036621094 %

Serial

5 V

Dual

R-PDSO-G8

Binary

AD5303BRU-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

400 μA

0.1953 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

.001 V

0.197 in (5 mm)

Binary

LTC2637IMS-LMX8#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

3.5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

DAC8426AR/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883

8

14 mA

0.1953 %

Serial

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

0.2 in (5.08 mm)

0.22 in (5.59 mm)

No

e0

Binary

AD9760AR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

10

0.0977 %

Parallel, Word

5 V

3/5 V

Small Outline

SOP28,.4

Other Converters

35 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-1 V

0.705 in (17.9 mm)

Binary

LTC2634HMSE-LMI8#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

3.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8420FP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

2.5 V

No

4

BICMOS

12

0.0977 %

Serial

5 V

±5/±15 V

-5 V

In-Line

DIP16,.3

Other Converters

8 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-2.5 V

0.79 in (20.07 mm)

Binary

AD75069AJ

Analog Devices

Digital to Analog converter

Industrial

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

7.5 V

Yes

1

CMOS

12

8 µs

20 mA

0.012 %

Parallel, Word

12 V

5,±12 V

-12 V

Chip Carrier

LCC44,.65SQ

Other Converters

6 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-CQCC-J44

0.135 in (3.43 mm)

0.645 in (16.385 mm)

No

e0

-2.5 V

0.645 in (16.385 mm)

Offset Binary

LTC2629CGN#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

7 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

AD7305BN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

8

200 ns

6 mA

0.3906 %

Parallel, 8 Bits

5 V

3/5 V

-5 V

In-Line

DIP20,.3

Other Converters

1 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.992 in (25.2 mm)

Binary

LTC2631ITS8-HZ10#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

10

0.0977 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5557CRU-R7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

38

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

10 μA

0.0061 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP38,.25,20

Other Converters

500 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G38

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

-10 V

0.382 in (9.7 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.