Analog Devices Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX538BCSA+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2.6 V

Yes

1

CMOS

12

300 μA

0.0244 %

Serial

5 V

5 V

Small Outline

SOP8,.25

Other Converters

25 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

AD1865N-K

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

3.06 V

No

2

BICMOS

18

1 %

Serial

5 V

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-3.06 V

1.22 in (30.988 mm)

2's Complement Binary

MAX547BCQH+D

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0488 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e3

245 °C (473 °F)

-4.5 V

0.653 in (16.585 mm)

Offset Binary

AD1862N

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

20

16 mA

Serial

12 V

±12 V

-12 V

In-Line

DIP16,.3

Other Converters

350 ns

0.1 in (2.54 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.793 in (20.13 mm)

2's Complement Binary

AD7534KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

MOS

14

3 mA

0.006 %

Parallel, 8 Bits

-.3 V

In-Line

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

Binary, Offset Binary

AD7534KN/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

14

1.5 µs

3 mA

0.006 %

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

Binary, Offset Binary

DAC312HP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

Bipolar

12

1 µs

18 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP20,.3

Other Converters

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.992 in (25.2 mm)

Binary, Offset Binary, 2's Complement Binary

AD9957BSVZ

Analog Devices

Digital to Analog Converter 14 bit

Gull Wing

100

HTFQFP

Square

Plastic/Epoxy

Yes

1

14

610 mA

0.009155 %

Serial

1.8 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP100,.63SQ

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

0.047 in (1.2 mm)

0.551 in (14 mm)

e3

260 °C (500 °F)

0.551 in (14 mm)

Offset Binary, 2's Complement Binary

AD5310BRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

8 µs

250 μA

0.39 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5324ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD7233ANZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

10 µs

10 mA

0.0244 %

Serial

12 V

±12/±15 V

-12 V

In-Line

DIP8,.3

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-5 V

0.389 in (9.88 mm)

2's Complement Binary

AD7545AKNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

0.3 in (7.62 mm)

No

e3

Binary, 2's Complement Binary

AD565AJD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

0 ns

18 mA

0.0122 %

Parallel, Word

15 V

-15 V

-15 V

In-Line

DIP24,.6

Other Converters

250 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-1.5 V

Binary, Offset Binary

AD565AJD/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

250 ns

18 mA

0.018 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

250 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD5335BRUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

2.999 V

Yes

4

CMOS

10

9 µs

900 μA

0.3906 %

Parallel, 8 Bits

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

7 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.307 in (7.8 mm)

Binary

5962-8770203RA

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

12

2 mA

0.0488 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

Yes

e0

Binary

AD5025BRUZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

12

4 mA

0.0122 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

10.7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G14

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5321BRTZ-500RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

250 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Other Converters

8 µs

0.037 in (0.95 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e4

260 °C (500 °F)

.001 V

0.114 in (2.9 mm)

Binary

AD9752ARZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

12

39 mA

0.0488 %

Parallel, Word

5 V

5 V

Small Outline

SOP28,.4

Other Converters

35 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.705 in (17.9 mm)

Binary

AD5301BRTZ-500RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

250 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Other Converters

6 µs

0.037 in (0.95 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e4

260 °C (500 °F)

.001 V

0.114 in (2.9 mm)

Binary

AD5379ABCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

14.5 V

Yes

1

CMOS

14

30 µs

0.0183 %

Serial, Parallel, Word

12 V

3/5,±12/±15 V

-12 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.512 in (13 mm)

Binary

AD5413BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

12.6 V

Yes

1

14

20 µs

0.012 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

12 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

30 s

260 °C (500 °F)

-12.6 V

0.197 in (5 mm)

Binary

AD5531BRUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

0.0122 %

Serial

15 V

±12/±15 V

-15 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

20 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.197 in (5 mm)

Binary

AD7225BQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

5 V

No

1

CMOS

MIL-STD-883

8

5 µs

10 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary, Offset Binary

AD7302BRUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

8

2 µs

5 mA

0.3906 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

1.2 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD7533LNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

1 µs

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e3

0.75 in (19.05 mm)

Binary, Offset Binary

AD8582ARZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

4.095 V

Yes

2

Bipolar

12

7 mA

0.05 %

Parallel, Word

5 V

5 V

Small Outline

SOP24,.4

Other Converters

16 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.606 in (15.4 mm)

Binary

ADV7127JRUZ240

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

1.4 V

Yes

1

CMOS

10

0.0977 %

Parallel, Word

3.3 V

3.3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.307 in (7.8 mm)

Binary

AD5543SRMZ-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

16

10 μA

0.0045 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

0.025 in (0.635 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G8

1

e4

30 s

260 °C (500 °F)

Binary

AD5601BKSZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

10 µs

0.1953 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G6

1

0.043 in (1.1 mm)

0.049 in (1.25 mm)

No

e4

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD5674RBCPZ-2

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD7224LNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

8

20 µs

6 mA

0.195 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.885 in (22.479 mm)

Binary

AD7244AQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

3 V

No

2

BICMOS

14

4 µs

27 mA

0.0122 %

Serial

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

2 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-3 V

Binary

AD7845JNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

0.19 in (4.82 mm)

0.3 in (7.62 mm)

No

e3

-10 V

1.227 in (31.165 mm)

Binary, Offset Binary

AD9146BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

48

HVQCCN

Square

1 V

Yes

1

16

343 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Other Converters

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N48

3

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.276 in (7 mm)

Binary, 2's Complement Binary

DAC08RC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

18 V

Yes

1

Bipolar

MIL-STD-883

8

150 ns

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

Chip Carrier

LCC20,.35SQ

Other Converters

85 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

-10 V

0.35 in (8.89 mm)

Binary

LTC2607IDE#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2615CGN-1#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

9 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

MAX5203BEUB+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

3.6 V

Yes

1

BICMOS

16

1.5 mA

0.06103515 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

25 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary, Offset Binary

MAX5214GUA+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

14

80 μA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

SSOP8,.19

Other Converters

14 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MAX5253BCAP+

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

12

980 μA

0.0244 %

Serial

3 V

3.3 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

16 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

MAX5702BAUB+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

2

BICMOS

12

900 μA

0.0244 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.116 in (2.94 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.116 in (2.94 mm)

Offset Binary

MAX5719AGSD+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

1.05 mA

0.0019 %

Serial

5 V

Small Outline

SOP14,.25

1.5 µs

0.05 in (1.27 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G14

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

e3

30 s

260 °C (500 °F)

0 V

0.341 in (8.65 mm)

Offset Binary

MAX5895EGK+D

Analog Devices

Digital to Analog converter

Industrial

No Lead

68

HVQCCN

Square

1.1 V

Yes

2

CMOS

16

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

AD5316RBCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.005 V

Yes

1

CMOS

10

7 µs

1.3 mA

0.0488 %

Serial

3 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.031 in (0.8 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5592RBCPZ-1-RL7

Analog Devices

Digital to Analog Converter 12 bit

No Lead

16

VQCCN

Square

5 V

Yes

1

12

2.7 mA

0.0244 %

Serial

3 V

Chip Carrier, Very Thin Profile

LCC16,.12SQ,20

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7398BRZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

12

6 µs

0.0366 %

Serial

5 V

3/5/±5 V

-5 V

Small Outline

SOP16,.4

Other Converters

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.406 in (10.3 mm)

Binary

LTC1453CN8#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2.54 V

No

1

CMOS

12

0.0977 %

Serial

3 V

In-Line

14 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.