Analog Devices Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7548AQ/883B

Analog Devices

Digital to Analog converter

12

LTC2637CDE-HMX8#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

8

0.1953 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2634CMSE-LZ10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

3.8 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2620IUFD#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

4 mA

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16X.2,20

7 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

M38510/12103BJX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

12

Parallel, Word

15 V

-15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T24

Yes

Binary

AD5660ACPZ-2500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0488 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7248KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

0.0244 %

Parallel, Word

12 V

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-5 V

1.2 in (30.48 mm)

Binary

5962-9306202M3X

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

3 V

Yes

1

MIL-STD-883

10

0.1465 %

Parallel, Word

5 V

-5.2 V

Chip Carrier

10 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

-1.5 V

0.45 in (11.43 mm)

Binary

AD7840LN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

14

4 µs

15 mA

0.003 %

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

2's Complement

ADDAC71-CSB-I

Analog Devices

Digital to Analog converter

Other

Pin/Peg

24

DIP

Rectangular

Metal

10 V

No

1

Bipolar

16

3 µs

55 mA

0.003 %

Parallel, Word

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP24,.6

Other Converters

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-MDMA-P24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

0 V

Complementary Binary

AD7303BR-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

2 µs

3.5 mA

0.3906 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

1.2 µs

0.05 in (1.27 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

240 °C (464 °F)

0 V

0.193 in (4.9 mm)

Binary

LTC2622IMS8

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

7 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

AD5421ACPZ-REEL7NEW

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

Yes

1

16

0.024 %

Serial

24 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

50 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

AD7948BN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

12

600 ns

0.0122 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP20,.3

Other Converters

600 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

Binary, Offset Binary

AD5675BCPZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5.5 V

Yes

1

16

0.0046 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2657BIUFD-H16#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

9.1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

PM7541AX

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, Offset Binary

AD5310RBRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

10

0.0488 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2609IGN-1#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

AD5305BRM-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

900 μA

0.2441 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

.001 V

0.118 in (3 mm)

Binary

DAC100ACQ4

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

2.5 V

No

1

Hybrid

10

0 ns

10 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

375 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-2.5 V

0.75 in (19.05 mm)

Complementary Binary

DAC8212AV

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

0 V

Binary, Offset Binary

PM7226GPBI

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

8

12 mA

Parallel, 8 Bits

-5 V

In-Line

3 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

Binary

DAC312HSZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

Bipolar

12

1 µs

18 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

Small Outline

SOP20,.4

Other Converters

250 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.504 in (12.8 mm)

Binary, Offset Binary, 2's Complement Binary

LTC2637HDE-HMI12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC1596CCN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

16

0.0061 %

Serial

5 V

In-Line

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

Binary, Offset Binary

AD7304BRZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

8

2 µs

6 mA

0.3906 %

Serial

5 V

3/5 V

-5 V

Small Outline

SOP16,.4

Other Converters

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.406 in (10.3 mm)

Binary

AD5338BRMZ-1

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

375 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

7 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

LTC2633AHTS8-LX12#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2634HUD-LZ10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2664IUH-16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0061 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

-10 V

0.197 in (5 mm)

Binary

5962-01-342-6539

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

16

6 µs

26 mA

0.024 %

12 V

±12 V

-12 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T28

No

Binary, Offset Binary

AD7845JPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

12

5 µs

0.0244 %

Parallel, Word

15 V

-15 V

Chip Carrier

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

260 °C (500 °F)

-10 V

0.453 in (11.5062 mm)

Binary, Offset Binary

DAC8426BIFS

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

8

14 mA

0.3906 %

Parallel, 8 Bits

15 V

Small Outline

3 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.504 in (12.8 mm)

Binary

AD7245SE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

1

CMOS

12

5 µs

12 mA

0.0366 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-5 V

0.45 in (11.43 mm)

Binary

LTC2635CUD-LMX10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5547BRU-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

38

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

10 μA

0.0031 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP38,.25,20

Other Converters

500 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G38

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

-10 V

0.382 in (9.7 mm)

Binary

5962-8948102VB

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

Parallel, Word

In-Line

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7528SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

38535Q/M;38534H;883B

8

600 ns

2 mA

0.3906 %

Parallel, 8 Bits

15 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

180 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

LTC1596-1CCSW#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Small Outline

1 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

-10 V

0.406 in (10.3 mm)

Binary, Offset Binary

LTC2631AHTS8-HM12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

PMADV7120KN80

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

8

125 mA

0.39 %

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T40

No

e0

Binary

PM7533AQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

2

CMOS

10

1 µs

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.75 in (19.05 mm)

Binary, Offset Binary

LTC2630AHSC6-HZ8#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

8

0.3906 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

3.7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

0.039 in (1 mm)

0.049 in (1.25 mm)

e3

0 V

0.079 in (2 mm)

Binary

LTC8043EN8

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

500 μA

0.0122 %

Serial

5 V

In-Line

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T8

1

0.15 in (3.809 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

LTC1450IN#PBF

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.0977 %

Parallel, Word

5 V

In-Line

14 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary

5962-8967802XX

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

MIL-STD-883

8

Parallel, 8 Bits

5 V

In-Line

190 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

Binary, Offset Binary

5962-8877801RX

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883

12

0.1221 %

Parallel, Word

15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-CDIP-T20

No

e0

Binary, 2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.