Analog Devices Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2635HMSE-LZ10#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.1 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HUD-HZ8#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

0.1953 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.9 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2654BCUF-H16#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

7.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2655BIGN-L16#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

4

CMOS

16

0.0061 %

Serial

3 V

Small Outline, Shrink Pitch

9.1 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

LTC2668IUJ-12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

12

0.0244 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

15.5 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

-10 V

0.236 in (6 mm)

Binary

MAX5381LEUK+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

5

LSSOP

Rectangular

Plastic/Epoxy

Yes

1

8

0.3906 %

Serial

5 V

Small Outline, Low Profile, Shrink Pitch

20 µs

0.037 in (0.95 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G5

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

Binary

MAX5442ACUB+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

BICMOS

16

200 μA

0.0031 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

MAX547ACQH+D

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0244 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e3

30 s

245 °C (473 °F)

-4.5 V

0.653 in (16.585 mm)

Offset Binary

MAX5805BAUB+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

410 μA

0.024 %

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Offset Binary

AD5304BRMZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

900 μA

0.2441 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5330BRU-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

8 µs

250 μA

0.39 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

SSOP20,.25

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

0.256 in (6.5 mm)

Binary

AD5421CREZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

HTSSOP

Rectangular

Plastic/Epoxy

Yes

1

16

300 μA

0.0035 %

Serial

24 V

1.8/5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

50 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0.382 in (9.7 mm)

Binary

AD5444YRMZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

12

110 ns

10 μA

0.0122 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

100 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

Binary

AD5570BRSZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

14 V

Yes

1

BICMOS

16

16 µs

5 mA

0.0015 %

Serial

12 V

±12/±15 V

-12 V

Small Outline, Shrink Pitch

SSOP16,.3

Other Converters

12 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

-14 V

0.244 in (6.2 mm)

Binary

AD5570BRSZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

14 V

Yes

1

BICMOS

16

16 µs

5 mA

0.0015 %

Serial

12 V

±12/±15 V

-12 V

Small Outline, Shrink Pitch

SSOP16,.3

Other Converters

12 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

-14 V

0.244 in (6.2 mm)

Binary

AD5582YRVZ-REEL

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

3 mA

0.0244 %

Parallel, Word

5 V

5/15/±5 V

-5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP48,.3,20

Other Converters

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G48

3

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

40 s

260 °C (500 °F)

0.492 in (12.5 mm)

Binary

AD5583YRVZ-REEL

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

10

3 mA

0.0977 %

Parallel, Word

5 V

5/15/±5 V

-5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP48,.3,20

Other Converters

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G48

3

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

40 s

260 °C (500 °F)

0.492 in (12.5 mm)

Binary

AD5675RBRUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

16

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD5683RBCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

HVSON

Square

Plastic/Epoxy

5.005 V

Yes

1

16

0.0046 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N8

1

0.026 in (0.65 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD5689BCPZ-RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

16

8 µs

700 μA

0.0046 %

Serial

5 V

2/5,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

Other Converters

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5693RARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.005 V

Yes

1

16

0.0122 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7237AARZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

2

CMOS

12

0.0244 %

Parallel, 8 Bits

15 V

-15 V

Small Outline

5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

3

0.116 in (2.95 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.606 in (15.4 mm)

Binary

AD7244JRZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

3 V

Yes

2

BICMOS

14

0.0122 %

Serial

5 V

-5 V

Small Outline

2 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

-3 V

0.705 in (17.9 mm)

Binary

AD7528JRZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

400 ns

2 mA

0.3906 %

Parallel, 8 Bits

5 V

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

Binary, Offset Binary

AD7804BNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

4 µs

12 mA

0.293 %

Serial

3.3 V

3.3/5 V

In-Line

DIP16,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.793 in (20.13 mm)

Offset Binary, 2's Complement Binary

AD7809BSTZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

Yes

1

CMOS

10

4 µs

0.293 %

Parallel, 8 Bits

3.3 V

3.3/5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Other Converters

1.5 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

AD7846KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

9 µs

0.0122 %

Parallel, Word

15 V

5,±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

7 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

AD7943BRSZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

Yes

1

12

0.0122 %

Serial

5 V

Small Outline, Shrink Pitch

600 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

40 s

260 °C (500 °F)

0.283 in (7.2 mm)

Binary, Offset Binary

AD9121BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

CMOS

14

495 mA

Serial

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.39SQ,20

Other Converters

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

No

e3

-1 V

0.394 in (10 mm)

2's Complement

AD9716BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

40

HVQCCN

Square

1.2 V

Yes

1

CMOS

12

Serial

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N40

3

0.039 in (1 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.236 in (6 mm)

Binary, 2's Complement Binary

AD9744ARU

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

14

0.0305 %

Parallel, Word

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

11 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

-1 V

0.382 in (9.7 mm)

Binary, 2's Complement Binary

AD9765ASTRL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.25 V

Yes

1

CMOS

12

0.0488 %

Parallel, Word

5 V

3/5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

35 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

-1 V

0.276 in (7 mm)

Binary

DAC8412EPZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

BICMOS

12

12 mA

0.0244 %

Parallel, Word

5 V

5/±15 V

-5 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

Binary

LTC1654IGN#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

14

0.0244 %

Serial

3 V

Small Outline, Shrink Pitch

8.5 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.068 in (1.727 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

LTC2600CGN#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

Yes

1

16

0.0977 %

Serial

3 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.8895 mm)

Binary

LTC2611IDD#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2624CGN-1#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

Yes

4

12

0.0977 %

Serial

3 V

Small Outline, Shrink Pitch

7 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.8895 mm)

Binary

LTC2624IGN-1#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

Yes

4

12

0.0977 %

Serial

3 V

Small Outline, Shrink Pitch

7 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.8895 mm)

Binary

LTC2625IGN#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

7 µs

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

LTC2630ACSC6-HZ12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.8 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2630ACSC6-LZ12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2633HTS8-HZ12#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2664IUH-16#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0061 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

-10 V

0.197 in (5 mm)

Binary

LTC2672HUH-16#PBF

Analog Devices

Digital to Analog Converter 16 bit

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

16

5.3 mA

0.09765625 %

Serial

5 V

-3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

200 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

LTC2754AIUKG-16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0015 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.315 in (8 mm)

Binary

MAX519ACSE+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

2

BICMOS

8

5 mA

Serial

5 V

5 V

Small Outline

SOP16,.25

Other Converters

6 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.39 in (9.9 mm)

Binary

MAX5661GCB+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

LFQFP

Square

Plastic/Epoxy

10.48 V

Yes

1

BICMOS

16

9.5 mA

0.0153 %

Serial

5 V

5,±15 V

Flatpack, Low Profile, Fine Pitch

QFP64,.47SQ,20

Other Converters

5.44 ms

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-10.48 V

0.394 in (10 mm)

Binary

MAX5661GCB+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

64

QFP

Square

Plastic/Epoxy

Yes

1

BICMOS

16

9.5 mA

0.015 %

5,±15 V

Flatpack

QFP64,.47SQ,20

Other Converters

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQFP-G64

3

No

e3

30 s

260 °C (500 °F)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.