Analog Devices Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD5665RBRUZ-1

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

1.16 mA

0.0244 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

4 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G14

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5679RBCPZ-2

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5679RBCPZ-2-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5685RBRUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.005 V

Yes

1

CMOS

14

8 µs

1.3 mA

0.0061 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5689BRUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

8 µs

700 μA

0.0046 %

Serial

5 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

0 V

0.197 in (5 mm)

Binary

AD5689RARUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.005 V

Yes

1

16

8 µs

1.3 mA

0.0122 %

Serial

5 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5767BCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

Yes

1

12

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

10 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B49

1

0.026 in (0.65 mm)

0.156 in (3.96 mm)

e1

0.156 in (3.96 mm)

Binary

AD5821BCBZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

3.6 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

AD7545AUQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.953 in (24.195 mm)

Binary, 2's Complement Binary

AD766SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

3.12 V

No

1

BICMOS

MIL-STD-883 Class B

16

Serial

5 V

-5 V

In-Line

1.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-2.88 V

0.75 in (19.05 mm)

2's Complement Binary

AD8803ARZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

4 mA

0.5859 %

Serial

3 V

3/5 V

Small Outline

SOP16,.25

Other Converters

600 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.39 in (9.9 mm)

Binary

AD9102BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

1 V

Yes

1

CMOS

14

Serial

1.8 V

1.8/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

31.2 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

-.5 V

0.197 in (5 mm)

2's Complement Binary

AD9739ABBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

183 mA

Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

ADV7125JST240

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.4 V

Yes

1

CMOS

8

72 mA

0.3906 %

Parallel, 8 Bits

3.3 V

3.3/5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

0 V

0.276 in (7 mm)

Binary

LTC1257IS8#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

0.0977 %

Serial

5 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0.193 in (4.9 mm)

Binary

LTC1451CN8#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

4.145 V

No

1

CMOS

12

0.0977 %

Serial

5 V

In-Line

14 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

Binary

LTC1453CS8

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2.54 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0 V

0.193 in (4.9 mm)

Binary

LTC1453CS8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2.54 V

Yes

1

CMOS

12

0.0977 %

Serial

3 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

LTC1595AIS8#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0015 %

Serial

5 V

Small Outline

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.193 in (4.9 mm)

Binary, Offset Binary

LTC2607IDE#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

12

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2630AHSC6-LM12#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.4 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2630AISC6-LZ12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.4 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2630ISC6-HZ10#TRMPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

10

0.0977 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.4 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2631ITS8-LZ8#TRMPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2633HTS8-HZ12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2641CDD-12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

8

HVSON

Square

Plastic/Epoxy

2.5 V

Yes

1

12

0.0122 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N8

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

LTC2645IMS-L12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

8 mA

0.061 %

Parallel, Word

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

7.8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

260 °C (500 °F)

1.71 V

0.159 in (4.039 mm)

Binary

LTC2688CUJ-16#PBF

Analog Devices

Digital to Analog converter

No Lead

40

HVQCCN

Square

15 V

Yes

1

CMOS

16

28 µs

37 mA

0.0000457 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC40,.24SQ,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-XQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

30 s

260 °C (500 °F)

-15 V

0.236 in (6 mm)

Binary

MAX542AESD+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

1.1 mA

0.0015 %

Serial

5 V

5 V

Small Outline

SOP14,.25

Other Converters

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G14

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.341 in (8.65 mm)

Offset Binary

MAX547BCMH+TD

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

4.5 V

Yes

1

13

0.0488 %

Parallel, Word

5 V

-5 V

Flatpack

5 µs

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

-4.5 V

0.394 in (10 mm)

Offset Binary

MAX549ACUA+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

2

CMOS

8

550 μA

0.39 %

Serial

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5044BRUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

14

6 mA

0.0061 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

10.7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5302ARMZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

450 μA

0.3906 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5320BRTZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

10 µs

250 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Other Converters

12 µs

0.037 in (0.95 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.057 in (1.45 mm)

0.065 in (1.65 mm)

No

e3

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD5321BRMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

250 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5323BRUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

400 μA

0.1953 %

Serial

3 V

2.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.197 in (5 mm)

Binary

AD5325ARMZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

8 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.118 in (3 mm)

Binary

AD5363BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

AD5363BCPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

56

HVQCCN

Square

15.1 V

Yes

1

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

-15.1 V

0.315 in (8 mm)

2's Complement Binary

AD5371BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

15.1 V

Yes

1

CMOS

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

Other Converters

20 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e1

30 s

260 °C (500 °F)

-15.1 V

0.394 in (10 mm)

Binary

AD5391BCPZ-3

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

5.5 V

Yes

1

12

8 µs

475 μA

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

3 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.354 in (9 mm)

Binary

AD5415YRUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

10 μA

0.0244 %

Serial

2.5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

80 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.307 in (7.8 mm)

Binary

AD5426YRMZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

8

100 ns

5 μA

0.0977 %

Serial

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

90 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

.4 V

0.118 in (3 mm)

Binary

AD5441BRMZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

12

10 μA

0.0122 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0.118 in (3 mm)

Binary

AD5441BRMZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

12

10 μA

0.0122 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0.118 in (3 mm)

Binary

AD5542CR-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

4.5 V

Yes

1

CMOS

16

1.1 mA

0.0015 %

Serial

3 V

5 V

Small Outline

SOP14,.25

Other Converters

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G14

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

240 °C (464 °F)

-2.5 V

0.341 in (8.65 mm)

Binary

AD5612AKSZ-2REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

10 µs

100 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Very Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

6 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e4

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD565AJRZ-REEL

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

Bipolar

12

0.0122 %

Serial

15 V

-15 V

Small Outline

250 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

e3

30 s

260 °C (500 °F)

-1.5 V

0.705 in (17.9 mm)

Binary, Offset Binary, 2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.