16 Other Function Converters 270

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  2. Other Function Converters
Manufacturers
    • Ams Ag
    • Analog Devices
    • Bias Power
    • Broadcom
    • Diodes Incorporated
    • Dymec
    • General Electric Solid State
    • Infineon Technologies
    • Maxim Integrated
    • Murata Manufacturing
    • NXP Semiconductors
    • New Japan Radio
    • Onsemi
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Telcom Semiconductor
    • Texas Instruments
    • Thine Electronics
    • Toshiba
    • XP Power
Converter Type
    • Analog to Digital Converter
    • Analog to Digital Converter, Delta-sigma
    • Converter
    • Digital to Analog Converter
Temperature Grade
    • Automotive
    • Commercial
    • Commercial Extended
    • Industrial
    • Military
    • Other
Terminal Form
    • Ball
    • Gull Wing
    • J Bend
    • No Lead
    • Through-Hole
No. of Terminals (1)
    • 16
    • 10
    • 100
    • 105
    • 112
    • 12
    • 14
    • 144
    • 160
    • 18
    • 20
    • 22
    • 24
    • 28
    • 30
    • 32
    • 36
    • 38
    • 40
    • 42
    • 44
    • 48
    • 5
    • 56
    • 6
    • 64
    • 68
    • 72
    • 8
    • 80
    • 84
Package Code
    • DIP
    • FBGA
    • HVQCCN
    • QCCJ
    • QCCN
    • QFP
    • SDIP
    • SON
    • SOP
    • SSOP
    • TSOP
    • TSSOP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Metal
    • Plastic/Epoxy
No. of Analog In Channels
    • 1
    • 10
    • 2
    • 3
    • 6
    • 8
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 12 V
    • 4.25 V
    • 5.5 V
Maximum Analog Input Voltage
    • 3 V
    • 3.6 V
    • 5.3 V
No. of Functions
    • 1
    • 12
    • 2
    • 3
    • 32
    • 4
    • 8
Technology
    • BICMOS
    • Bipolar
    • CMOS
    • Hybrid
    • MOS
Screening Level
    • 38535Q/M;38534H;883B
    • 38535V;38534K;883S
    • AEC-Q100
    • MIL-STD-883 Class B (Modified)
No. of Bits
    • 10
    • 11
    • 12
    • 14
    • 16
    • 18
    • 20
    • 24
    • 4
    • 5
    • 6
    • 8
Maximum Settling Time
    • 0.1 ns
    • 1 µs
    • 1.5 µs
    • 10 ns
    • 10 µs
    • 100 ns
    • 110 ns
    • 12 ns
    • 120 ns
    • 135 ns
    • 15 µs
    • 150 ns
    • 150 µs
    • 18 ns
    • 18 µs
    • 2 µs
    • 20 ns
    • 20 µs
    • 200 ns
    • 25 ns
    • 250 ns
    • 28 ns
    • 28.5 ns
    • 3 µs
    • 300 ns
    • 300 µs
    • 350 ns
    • 375 ns
    • 4 µs
    • 4.5 µs
    • 40 ns
    • 400 ns
    • 5 µs
    • 500 ns
    • 6 ns
    • 600 ns
    • 7 µs
    • 7.4 ns
    • 8 ns
    • 8 µs
    • 800 ns
    • 9 µs
    • 900 ns
Maximum Supply Current
    • 1 mA
    • 1.2 mA
    • 1.4 mA
    • 1.5 mA
    • 1.8 mA
    • 10 mA
    • 10 μA
    • 100 μA
    • 105 mA
    • 11.6 mA
    • 11.69 mA
    • 12 mA
    • 125 μA
    • 13 mA
    • 15 mA
    • 15.5 mA
    • 150 mA
    • 155 mA
    • 16 mA
    • 160 mA
    • 18 mA
    • 183 mA
    • 188 mA
    • 2 mA
    • 2.5 mA
    • 2.6 mA
    • 2.7 mA
    • 20 mA
    • 220 mA
    • 23 mA
    • 230 μA
    • 24 mA
    • 25 mA
    • 250 mA
    • 26.3 mA
    • 260 μA
    • 27 mA
    • 275 mA
    • 28 mA
    • 280 μA
    • 290 mA
    • 3 mA
    • 3.2 mA
    • 3.5 mA
    • 300 mA
    • 330 mA
    • 340 mA
    • 35 mA
    • 358 mA
    • 391 mA
    • 4 mA
    • 40 mA
    • 400 μA
    • 410 μA
    • 42 mA
    • 450 μA
    • 49 mA
    • 5 mA
    • 5.2 mA
    • 5.6 mA
    • 50 mA
    • 580 mA
    • 6 mA
    • 60 mA
    • 600 μA
    • 65 mA
    • 700 μA
    • 72 mA
    • 8.33 mA
    • 80 mA
    • 85 mA
    • 9 μA
    • 9.3 mA
    • 900 μA
Maximum Linearity Error (EL)
    • 0.0003 %
    • 0.0012 %
    • 0.0022 %
    • 0.003 %
    • 0.006 %
    • 0.0061 %
    • 0.01 %
    • 0.012 %
    • 0.0125 %
    • 0.015 %
    • 0.017 %
    • 0.018 %
    • 0.02 %
    • 0.024 %
    • 0.03 %
    • 0.032 %
    • 0.036 %
    • 0.042 %
    • 0.048 %
    • 0.049 %
    • 0.05 %
    • 0.06 %
    • 0.097 %
    • 0.0976 %
    • 0.098 %
    • 0.1 %
    • 0.12 %
    • 0.15 %
    • 0.19 %
    • 0.195 %
    • 0.2 %
    • 0.2148 %
    • 0.24 %
    • 0.31 %
    • 0.39 %
    • 0.4 %
    • 0.429 %
    • 0.45 %
    • 0.58 %
    • 0.59 %
    • 0.78 %
    • 0.8 %
    • 0.9 %
    • 0.98 %
    • 1.17 %
    • 1.61 %
    • 3.9 %
Input Format
    • Parallel, 8 Bits
Nominal Supply Voltage
    • 1.8 V
    • 12 V
    • 15 V
    • 3 V
    • 3.3 V
    • 5 V
Power Supplies (V)
    • -15 V
    • -3,3/5,5,8 V
    • -4,5,10 V
    • -5.2 V
    • 1,3.3 V
    • 1.8,1.8/3.3 V
    • 1.8,3.3 V
    • 1.8/3.3 V
    • 1.8/3.6 V
    • 12 V
    • 12/15 V
    • 12/15, GND/-5 V
    • 12/15,-0.3 V
    • 12/15,-5 V
    • 12/15,GND/-0.3 V
    • 12/15,GND/-12/-15 V
    • 15 V
    • 2.5/5.5 V
    • 2.7/5,5 V
    • 2/5,3/5 V
    • 3 V
    • 3,5 V
    • 3.3 V
    • 3.3,3.3/5 V
    • 3.3,5 V
    • 3/3.3 V
    • 3/3.3,-7.5,15 V
    • 3/5 V
    • 3/5,5 V
    • 3/5,5,10.5 V
    • 3/5,±12/±15 V
    • 3/5,±12/±16.5 V
    • 5 V
    • 5,-12 V
    • 5,-15 V
    • 5,-5.2 V
    • 5,13 V
    • 5,15 V
    • 5,±12/±15 V
    • 5,±15 V
    • 5/15 V
    • 5/15,-15 V
    • 5/±5 V
    • ±10/±15 V
    • ±12/±15 V
    • ±15 V
    • ±5 V
    • ±5,3/5 V
Nominal Negative Supply Voltage
    • -15 V
    • -5 V
    • -5.2 V
Package Style (Meter)
    • Chip Carrier
    • Chip Carrier, Heat Sink/Slug, Very Thin Profile
    • Flatpack
    • Grid Array, Fine Pitch
    • In-Line
    • In-Line, Shrink Pitch
    • Small Outline
    • Small Outline, Shrink Pitch
    • Small Outline, Thin Profile
    • Small Outline, Thin Profile, Shrink Pitch
Package Equivalence Code
    • BGA105,11X11,25
    • BGA12,3X4,20
    • DIE OR CHIP
    • DIP14,.3
    • DIP16,.3
    • DIP18,.3
    • DIP20,.3
    • DIP22,.3
    • DIP22,.4
    • DIP24(UNSPEC)
    • DIP24,.3
    • DIP24,.4
    • DIP24,.6
    • DIP28,.6
    • DIP30,1.8
    • DIP32,.9
    • DIP40,.6
    • DIP42,.6
    • DIP8,.3
    • LCC16,.12SQ,20
    • LCC20,.35SQ
    • LCC28,.45SQ
    • LCC32,.2SQ,20
    • LCC36,.25SQ,20
    • LCC40,.24SQ,20
    • LCC48,.27SQ,20
    • LCC56,.31SQ,20
    • LCC64,.35SQ,20
    • LCC68,.4SQ,20
    • LCC72,.39SQ,20
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • LDCC84,1.2SQ
    • QFP144,1.2SQ
    • QFP160,1.2SQ
    • QFP44,.5SQ,32
    • QFP48,.35SQ,20
    • QFP48,.5X.66,32
    • QFP64,.47SQ,20
    • QFP64,.7X.95,40
    • QFP80,.55SQ,20
    • SDIP24,.3
    • SDIP28,.4
    • SDIP30,.4
    • SOLCC10,.08,20
    • SOLCC10,.11,20
    • SOLCC10,.12,20
    • SOLCC14,.12,20
    • SOLCC8,.12,25
    • SOP16,.25
    • SOP16,.3
    • SOP16,.4
    • SOP20,.3
    • SOP20,.4
    • SOP24,.3
    • SOP24,.3,32
    • SOP24,.4
    • SOP28,.3
    • SOP28,.4
    • SOP28,.5
    • SOP36,.3,32
    • SOP8,.25
    • SSOP16,.25
    • SSOP20,.25
    • SSOP24,.3
    • SSOP28,.3
    • TQFP100,.63SQ
    • TQFP32,.35SQ,32
    • TQFP48,.35SQ
    • TQFP64,.47SQ
    • TQFP64,.63SQ,32
    • TQFP80,.55SQ
    • TSOP5/6,.11,37
    • TSOP6,.11,37
    • TSSOP10,.19,20
    • TSSOP14,.25
    • TSSOP16,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
    • TSSOP28,.25
    • TSSOP38,.25,20
    • TSSOP6,.08
    • TSSOP8,.1
    • TSSOP8,.19
    • TSSOP8,.25
    • WAFER
Minimum Supply Voltage
    • 2.7 V
    • 3 V
    • 4.75 V
Terminal Pitch
    • 0.02 in (0.5 mm)
    • 0.025 in (0.635 mm)
    • 0.026 in (0.65 mm)
    • 0.031 in (0.8 mm)
    • 0.037 in (0.95 mm)
    • 0.039 in (1 mm)
    • 0.05 in (1.27 mm)
    • 0.07 in (1.78 mm)
    • 0.1 in (2.54 mm)
Maximum Operating Temperature
    • 105 °C (221 °F)
    • 115 °C (239 °F)
    • 125 °C (257 °F)
    • 25 °C (77 °F)
    • 60 °C (140 °F)
    • 70 °C (158 °F)
    • 80 °C (176 °F)
    • 85 °C (185 °F)
Minimum Operating Temperature
    • -10 °C (14 °F)
    • -15 °C (5 °F)
    • -20 °C (-4 °F)
    • -25 °C (-13 °F)
    • -30 °C (-22 °F)
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
    • 25 °C (77 °F)
Terminal Finish
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Nickel Gold Palladium Silver
    • Nickel Palladium Gold
    • Tin Bismuth
    • Tin Lead
    • Tin Silver Copper
    • Tin Silver Copper Nickel
    • Tin/Lead
    • Tin/Lead (Sn63Pb37)
    • Tin/Lead (Sn85Pb15)
    • Tin/Lead - hot dipped
    • Tin/Silver
Terminal Position
    • Bottom
    • Dual
    • Quad
JESD-30 Code
    • R-MDIP-T24
    • R-MDIP-T32
    • R-PBGA-B12
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T30
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T8
    • R-PDSO-G10
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G36
    • R-PDSO-G38
    • R-PDSO-G5
    • R-PDSO-G6
    • R-PDSO-G8
    • R-PDSO-N10
    • R-PDSO-N14
    • R-PDSO-N8
    • R-PQFP-G48
    • R-PQFP-G64
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T18
    • R-XDIP-T20
    • R-XDIP-T22
    • R-XDIP-T24
    • R-XDIP-T28
    • R-XDIP-T30
    • R-XDIP-T32
    • R-XDIP-T40
    • S-MQFP-G160
    • S-PBGA-B105
    • S-PBGA-B112
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J84
    • S-PQCC-N16
    • S-PQCC-N32
    • S-PQCC-N36
    • S-PQCC-N40
    • S-PQCC-N48
    • S-PQCC-N56
    • S-PQCC-N64
    • S-PQCC-N68
    • S-PQCC-N72
    • S-PQFP-G100
    • S-PQFP-G160
    • S-PQFP-G32
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-PQFP-G80
    • S-XQCC-N16
    • S-XQCC-N20
    • S-XQCC-N28
    • S-XQFP-G144
    • X-PQFP-G80
Moisture Sensitivity Level (MSL)
    • 1
    • 3
Maximum Seated Height
    • 0.039 in (1 mm)
    • 0.078 in (1.99 mm)
    • 0.096 in (2.45 mm)
Width
    • 0.049 in (1.25 mm)
    • 0.118 in (3 mm)
    • 0.208 in (5.29 mm)
    • 0.394 in (10 mm)
Qualification
    • No
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
    • e6
Maximum Time At Peak Reflow Temperature (s)
    • 10 s
    • 20 s
    • 30 s
    • 40 s
Peak Reflow Temperature (C)
    • 240 °C (464 °F)
    • 245 °C (473 °F)
    • 260 °C (500 °F)
Length
    • 0.079 in (2 mm)
    • 0.118 in (3 mm)
    • 0.394 in (10 mm)
    • 0.402 in (10.2 mm)
Input Bit Code
    • 2's Complement
    • Binary
    • Binary Coded Decimal
    • Binary, 2'S Complement Binary
    • Binary, Complementary Binary
    • Binary, Complementary Binary, Offset Binary, 2's Complement Binary, 1's Complement Binary, Modified 1's Complement Binary
    • Binary, Offset Binary
    • Binary, Offset Binary, 2's Complentary Binary
    • Binary,Offset Binary
    • Complementary Binary
    • Complementary Binary Coded Decimal
    • Complementary Binary, Complementary Offset Binary
    • Offset Binary
    • Offset Binary, 2's Complement Binary
    • Signed Magnitude
Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC2634HUD-LMX10#PBF

Analog Devices

Digital to Analog Converter

Automotive

No Lead

16

QCCN

Square

Plastic/Epoxy

Yes

4

CMOS

10

900 μA

0.097 %

3/5 V

Chip Carrier

LCC16,.12SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2636CMS-HMX8

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

1.5 mA

0.19 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

LTC2636CMS-HZ10

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

10

1.5 mA

0.097 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

LTC2636CMS-LZ12#TR

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

12

1.5 mA

0.06 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

ADDAC08AD

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

8

135 ns

11.6 mA

0.1 %

15 V

±15 V

-15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

LTC2634HUD-HMX12#PBF

Analog Devices

Digital to Analog Converter

Automotive

No Lead

16

QCCN

Square

Plastic/Epoxy

Yes

4

CMOS

12

900 μA

0.06 %

5 V

5 V

Chip Carrier

LCC16,.12SQ,20

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2634CUD-LMX8#PBF

Analog Devices

Digital to Analog Converter

Commercial

No Lead

16

QCCN

Square

Plastic/Epoxy

Yes

4

CMOS

8

900 μA

0.19 %

3/5 V

Chip Carrier

LCC16,.12SQ,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2636IMS-LMI12

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

12

1.5 mA

0.06 %

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

LTC2634CUD-HZ10#PBF

Analog Devices

Digital to Analog Converter

Commercial

No Lead

16

QCCN

Square

Plastic/Epoxy

Yes

4

CMOS

10

900 μA

0.097 %

5 V

5 V

Chip Carrier

LCC16,.12SQ,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2634CUD-HMI10#PBF

Analog Devices

Digital to Analog Converter

Commercial

No Lead

16

QCCN

Square

Plastic/Epoxy

Yes

4

CMOS

10

900 μA

0.097 %

5 V

5 V

Chip Carrier

LCC16,.12SQ,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

No

e3

30 s

260 °C (500 °F)

Binary

LTC2636IMS-HZ8#TR

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

1.5 mA

0.19 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

LTC2636CMS-HMX12#TR

Analog Devices

Digital to Analog Converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

12

1.5 mA

0.06 %

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

MX7542GKEWE

Analog Devices

Digital to Analog Converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

No

e0

Binary

MX7524SQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

500 ns

2 mA

0.2 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7520TQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

2 mA

0.1 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7533UQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

800 ns

2 mA

0.05 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7520UQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

2 mA

0.05 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7520SQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

2 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7542GTQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary

MX7543SQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.024 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary

MX7533SQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

800 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7542SQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.024 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary

MX7524UQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

500 ns

2 mA

0.05 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7543GTQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary

MX7533TQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

800 ns

2 mA

0.1 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

MX7524TQ/883

Analog Devices

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

500 ns

2 mA

0.1 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

L291B

STMicroelectronics

Digital to Analog Converter

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

5

10 mA

1.61 %

±10/±15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

Tin Lead

Dual

R-PDIP-T16

No

e0

Binary

L291B/1

STMicroelectronics

Digital to Analog Converter

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

5

10 mA

1.61 %

±10/±15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

Tin/Lead

Dual

R-PDIP-T16

No

e0

Binary

SDA8005

Infineon Technologies

Digital to Analog Converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

Bipolar

8

105 mA

0.2148 %

-5.2 V

-5.2 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD7543SQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.024 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD7542GTQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD7543JCWE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.024 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7524JCSE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.2 %

5/15 V

Small Outline

SOP16,.25

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary, Offset Binary

MX7524JN+2

Maxim Integrated

Digital to Analog Converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

500 ns

2 mA

0.2 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

No

e3

Binary, Offset Binary

AD7520UQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

2 mA

0.05 %

15 V

15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

AD7543KCWP

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7524KCSE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.1 %

5/15 V

Small Outline

SOP16,.25

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary, Offset Binary

AD7543KCWE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7543TQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD7543GTQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 µs

2.5 mA

0.012 %

5 V

5 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary

AD7524UQ/883

Maxim Integrated

Digital to Analog Converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

500 ns

2 mA

0.05 %

5/15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

AD7524LCSE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

500 ns

2 mA

0.05 %

5/15 V

Small Outline

SOP16,.25

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary, Offset Binary

MX7543KCWE-TAPE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

AD7543GKCWE

Maxim Integrated

Digital to Analog Converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

5 V

5 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

Binary

UPD6335G

Renesas Electronics

Digital to Analog Converter

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

6

10 µs

5,15 V

Small Outline

SOP16,.4

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G16

No

e0

M62353FP#CF0G

Renesas Electronics

Digital to Analog Converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

300 µs

2.5 mA

0.59 %

5 V

5 V

Small Outline

SOP16,.3

0.05 in (1.27 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G16

No

Binary

UPD6335C

Renesas Electronics

Digital to Analog Converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

6

10 µs

5,15 V

In-Line

DIP16,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

M62353FP#DF0G

Renesas Electronics

Digital to Analog Converter

Other

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

8

CMOS

8

300 µs

2.5 mA

0.59 %

5 V

5 V

Small Outline

SOP16,.3

0.05 in (1.27 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G16

No

Binary
Other Function Converters

Other function converters are specialized electronic devices that perform signal conversion and processing for specific applications. These converters are designed to provide a specific function or task, such as frequency-to-voltage conversion, voltage-to-frequency conversion, or power-to-frequency conversion.

Frequency-to-voltage converters (FVCs) are electronic devices that convert an input frequency signal into an output voltage signal. FVCs are used in applications such as tachometers, speedometers, and frequency counters. Voltage-to-frequency converters (VFCs) are electronic devices that convert an input voltage signal into an output frequency signal. VFCs are used in applications such as waveform generators, signal conditioning circuits, and measurement systems.

Power-to-frequency converters (PFCs) are electronic devices that convert an input power signal into an output frequency signal. PFCs are used in applications such as power monitoring, energy harvesting, and renewable energy systems.

Other function converters may include specialized converters, such as temperature-to-frequency converters, current-to-frequency converters, or phase-locked loop (PLL) frequency synthesizers. These converters are designed to perform specific signal conversion and processing tasks, depending on the application and the required performance.