Part | RoHS | Manufacturer | General IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Maximum Supply Current | Power Supplies (V) | Harmonic Distortion | Package Style (Meter) | Package Equivalence Code | Mode (Playback/Record) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Nominal Dolby Level | Length | Dolby Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
BIPOLAR |
SMALL OUTLINE |
PLAYBACK |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
3 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
7.6 V |
e4 |
387.5 mV |
15.4 mm |
B |
||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
2 |
BIPOLAR |
.15 % |
IN-LINE |
PLAYBACK AND RECORD |
2.54 mm |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T24 |
15 V |
5.1 mm |
15.24 mm |
Not Qualified |
9 V |
e3/e4 |
580 mV |
31.7 mm |
B |
||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
SMALL OUTLINE |
PLAYBACK |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4.5 V |
20.5 mm |
B |
|||||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
.2 % |
IN-LINE |
PLAYBACK AND RECORD |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
20 V |
4.06 mm |
7.62 mm |
Not Qualified |
8 V |
580 mV |
19.09 mm |
B |
||||||||||||||
|
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BIPOLAR |
31 mA |
10 |
1 % |
SMALL OUTLINE |
SOP24,.4 |
PLAYBACK |
Noise Suppression ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
7.6 V |
260 |
387.5 mV |
15.4 mm |
B |
|||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
BIPOLAR |
28 mA |
10 |
1 % |
SMALL OUTLINE |
SOP32,.4 |
PLAYBACK |
Noise Suppression ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
7.6 V |
387.5 mV |
20.5 mm |
B |
|||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
1 |
.2 % |
IN-LINE |
PLAYBACK AND RECORD |
2.54 mm |
70 Cel |
0 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
14 V |
4.06 mm |
7.62 mm |
Not Qualified |
6 V |
e3/e4 |
580 mV |
19.09 mm |
B |
|||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
1 |
.15 % |
IN-LINE |
PLAYBACK AND RECORD |
2.54 mm |
70 Cel |
0 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
20 V |
4.06 mm |
7.62 mm |
Not Qualified |
8 V |
e3/e4 |
580 mV |
19.09 mm |
B |
|||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 % |
SMALL OUTLINE |
PLAYBACK |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
7.6 V |
387.5 mV |
15.4 mm |
B |
||||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
BIPOLAR |
10 |
.15 % |
SMALL OUTLINE |
SOP32,.4 |
PLAYBACK |
Noise Suppression ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
7.6 V |
387.5 mV |
20.5 mm |
B |
|||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.15 % |
SMALL OUTLINE |
PLAYBACK AND RECORD |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
8 V |
2.65 mm |
7.5 mm |
Not Qualified |
4 V |
CAN ALSO WORK WITH SINGLE 14V SUPPLY |
387.5 mV |
17.9 mm |
B AND C |
||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
1 |
.15 % |
IN-LINE |
PLAYBACK AND RECORD |
2.54 mm |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T28 |
8 V |
5.1 mm |
15.24 mm |
Not Qualified |
4 V |
CAN ALSO WORK WITH SINGLE 14V SUPPLY |
e3/e4 |
387.5 mV |
35.5 mm |
B AND C |
||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
SMALL OUTLINE |
PLAYBACK |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4.5 V |
20.5 mm |
B |
|||||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
THROUGH-HOLE |
32 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
BIPOLAR |
28 mA |
10 |
1 % |
IN-LINE, SHRINK PITCH |
SDIP32,.4 |
PLAYBACK |
Noise Suppression ICs |
1.778 mm |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T32 |
12 V |
4.7 mm |
10.16 mm |
Not Qualified |
7.6 V |
e3/e4 |
387.5 mV |
28.95 mm |
B |
|||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
SMALL OUTLINE |
PLAYBACK |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4.5 V |
20.5 mm |
B |
|||||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
THROUGH-HOLE |
24 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
1 % |
IN-LINE, SHRINK PITCH |
PLAYBACK |
1.778 mm |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T24 |
12 V |
4.7 mm |
10.16 mm |
Not Qualified |
7.6 V |
e3/e4 |
387.5 mV |
21.85 mm |
B |
||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
.15 % |
IN-LINE |
PLAYBACK AND RECORD |
2.54 mm |
70 Cel |
0 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
20 V |
4.06 mm |
7.62 mm |
Not Qualified |
8 V |
e3/e4 |
580 mV |
19.09 mm |
B |
||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
SMALL OUTLINE |
PLAYBACK |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
2.65 mm |
7.5 mm |
Not Qualified |
4.5 V |
20.5 mm |
B |
|||||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
BIPOLAR |
SMALL OUTLINE |
PLAYBACK |
1.27 mm |
DUAL |
R-PDSO-G32 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
7.6 V |
387.5 mV |
20.5 mm |
B |
||||||||||||||||
|
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
BIPOLAR |
SMALL OUTLINE |
PLAYBACK |
1.27 mm |
DUAL |
R-PDSO-G24 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
7.6 V |
40 |
250 |
387.5 mV |
15.4 mm |
B |
|||||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
2 |
.15 % |
IN-LINE |
PLAYBACK |
2.54 mm |
85 Cel |
-40 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T20 |
15 V |
4.2 mm |
7.62 mm |
Not Qualified |
8 V |
e3/e4 |
387.5 mV |
26.73 mm |
B |
|||||||||||
NXP Semiconductors |
DOLBY NOISE REDUCTION IC |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
1 % |
SMALL OUTLINE |
PLAYBACK |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
12 V |
2.65 mm |
7.5 mm |
Not Qualified |
7.6 V |
387.5 mV |
20.5 mm |
B |
Noise reduction ICs, also known as noise suppression ICs or noise cancellers, are electronic devices that remove unwanted noise from audio or video signals. These ICs are used in a variety of applications, such as audio recording, broadcasting, and communication systems.
Noise reduction ICs can be classified into several types based on the specific noise reduction technique they use. Some of the most common types of noise reduction ICs include:
1. Passive noise reduction ICs - These ICs use passive components, such as resistors and capacitors, to filter out unwanted noise from the audio or video signal. They are often used in low-cost applications where a simple and effective solution is required.
2. Active noise reduction ICs - These ICs use active components, such as transistors and op-amps, to actively remove unwanted noise from the audio or video signal. They are often used in high-end audio systems where a high level of noise reduction is required.
3. Adaptive noise reduction ICs - These ICs use advanced algorithms to analyze the audio or video signal and adaptively remove unwanted noise. They are often used in communication systems where the noise level varies depending on the environment.
Noise reduction ICs can be integrated into a variety of devices, such as audio recording equipment, microphones, and communication systems. They can also be used in combination with other components, such as amplifiers and filters, to provide a complete noise reduction solution.