12 Other Function Interface ICs 155

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Screening Level	No. of Bits	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Nominal Output Peak Current Limit	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC6957IDD-1#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS			EIA-644-A; TIA-644-A		3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3	30	260	3 mm
TPS25821DSSR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1							5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N12	1	.8 mm		2 mm			e4	30	260	3 mm
NTS0104UK-Q100Z	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	12	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES					AEC-Q100						1.8/3.3,2.5/5	GRID ARRAY, FINE PITCH	BGA12,3X4,16		Other Interface ICs		.4 mm	125 Cel		-40 Cel		BOTTOM	R-PBGA-B12					Not Qualified
TPS25820DSSR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1							5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N12	1	.8 mm		2 mm			e4	30	260	3 mm
TPS25821DSST	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1							5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N12	1	.8 mm		2 mm			e4	30	260	3 mm
LSF0204DYZPR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES		1				4		.0125 mA				GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.5 mm	125 Cel	3-STATE	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B12	1	.5 mm		1.442 mm			e1	30	260	1.942 mm
PTXU0204DTRR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4				4		.006 mA	1.1 V			CHIP CARRIER				1.08 V		125 Cel	3-State	-40 Cel		QUAD	R-PBCC-N12		.4 mm		1 mm						1.7 mm
TPS25820DSST	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1							5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-N12	1	.8 mm		2 mm			e4	30	260	3 mm
TUSB321IRWBR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1							5 V			CHIP CARRIER, VERY THIN PROFILE				4.5 V	.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm		1.6 mm			e4	30	260	1.6 mm
TXU0204DTRR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	12	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				4		.006 mA	1.1 V			CHIP CARRIER				1.08 V		125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-N12	1	.4 mm		1 mm			e4		260	1.7 mm
LTC6957IMS-1#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm		4.039 mm			e3			3 mm
LTC6957IDD-3#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3		260	3 mm
TIOL1123LYAHR	Texas Instruments	INTERFACE CIRCUIT		BALL	12		RECTANGULAR	PLASTIC/EPOXY	YES	36 V	1							24 V							7 V		125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1		.35 A			LDO output range(V) : 3.3	e1		260
TUSB322IRWBR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1							5 V			CHIP CARRIER, VERY THIN PROFILE				4.5 V	.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm		1.6 mm			e4	30	260	1.6 mm
ST2149BQTR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1							1.8 V		1.8/3.3,1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC12,.07X.08,16		Other Interface ICs	1.65 V	.4 mm	85 Cel		-40 Cel		QUAD	R-XQCC-N12		.55 mm		1.7 mm	Not Qualified	ALSO REQUIRED VCC = 3.3V SUPPLY NOMINAL				2 mm
TPD4S214YFFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES		1										GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.8 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B12	1	.625 mm		1.39 mm			e1	30	260	1.69 mm
MAX14838GTC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1		BICMOS					24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				7 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3	30	260	3 mm
ADG3304BCBZ-REEL7	Analog Devices	INTERFACE CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					1.8 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.15 V	Other Interface ICs	1.65 V	.5 mm	85 Cel		-25 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.65 mm		1.61 mm	Not Qualified		e1		260	2.01 mm
LTC4315CMS#PBF	Analog Devices	BUS BUFFERS		GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			2.9 V	.65 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G12	1	1.1 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4.039 mm
LTC6957HMS-1#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm		4.039 mm			e3			3 mm
LTC6957HMS-3#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm		4.039 mm			e3			3 mm
LTC6957IDD-1#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3		260	3 mm
NLSX5004MUTAG	Onsemi	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	4.5 V											CHIP CARRIER, VERY THIN PROFILE	LCC12,.07X.08,16			.9 V	.4 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N12	1	.55 mm		1.7 mm			e4	30	260	2 mm
TLE9201SG	Infineon Technologies	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	12	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	1			AEC-Q100				13.5 V			SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH				3.5 V	1 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G12	3	2.6 mm		6.4 mm						7.5 mm
TXBN0304RUTR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1				4		.01 mA		3.6 V	1.2/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC12,.07X.08,16	.9 V	Other Interface ICs	.9 V	.4 mm	85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	R-PQCC-N12	1	.55 mm		1.7 mm	Not Qualified		e4	30	260	2 mm
TPD1S514-2YZR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	9.9 V	1							9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				3.5 V	.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.625 mm		1.29 mm			e1	30	260	1.99 mm
TPD1S514-3YZR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	13.5 V	1							12 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				3.5 V	.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.625 mm		1.29 mm			e1	30	260	1.99 mm
TXS4555RUTR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	1				3		.005 mA	1.8 V		1.6/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC12,.07X.08,16		Other Interface ICs	1.65 V	.4 mm	85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	R-PQCC-N12	1	.55 mm		1.7 mm	Not Qualified		e4	30	260	2 mm
TPD4S214AYFFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES		1										GRID ARRAY, VERY THIN PROFILE, FINE PITCH					.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBGA-B12		.625 mm		1.39 mm						1.69 mm
TUSB216IRWBT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	6.5 V	1	1					36 mA	5 V			CHIP CARRIER, VERY THIN PROFILE	LCC12,.062SQ,16			2.3 V	.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm		1.6 mm			e4	30	260	1.6 mm
TUSB216IRWBR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	6.5 V	1	1					36 mA	5 V			CHIP CARRIER, VERY THIN PROFILE	LCC12,.062SQ,16			2.3 V	.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm		1.6 mm			e4	30	260	1.6 mm
TUSB216RWBTQ1	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	6.5 V	1	1		AEC-Q100			36 mA	5 V			CHIP CARRIER, VERY THIN PROFILE	LCC12,.06SQ,16			2.3 V	.4 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm		1.6 mm			e4		260	1.6 mm
ADG3304BCB	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4								5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.65 V	Other Interface ICs	1.1 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12		.57 mm		1.5 mm	Not Qualified		e0			2 mm
ADG3304BCBZ-REEL	Analog Devices	INTERFACE CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					1.8 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.15 V	Other Interface ICs	1.65 V	.5 mm	85 Cel		-25 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.65 mm		1.61 mm	Not Qualified		e1		260	2.01 mm
LTC4315CDE#PBF	Analog Devices	BUS BUFFERS		NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20			2.9 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-N12	1	.8 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4 mm
LTC4315CDE#TRPBF	Analog Devices	BUS BUFFERS		NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20			2.9 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-N12	1	.8 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4 mm
LTC6957HMS-4#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm		4.039 mm			e3			3 mm
LTC4315IMS#TRPBF	Analog Devices	BUS BUFFERS		GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			2.9 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G12	1	1.1 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4.039 mm
LTC4315IDE#PBF	Analog Devices	BUS BUFFERS		NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20			2.9 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N12	1	.8 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4 mm
LTC6957IMS-2#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm		4.039 mm			e3		260	3 mm
LTC4315CMS#TRPBF	Analog Devices	BUS BUFFERS		GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			2.9 V	.65 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G12	1	1.1 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4.039 mm
LTC6957IMS-4#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm		4.039 mm			e3			3 mm
LTC6957IMS-3#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm		4.039 mm			e3			3 mm
LTC6957IDD-4#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm			e3		260	3 mm
LTC4315IMS#PBF	Analog Devices	BUS BUFFERS		GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			2.9 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G12	1	1.1 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4.039 mm
LTC6957HMS-2#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm		4.039 mm			e3	30	260	3 mm
LTC4315IDE#TRPBF	Analog Devices	BUS BUFFERS		NO LEAD	12	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20			2.9 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N12	1	.8 mm		3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4 mm
MAX13044EEBC+	Analog Devices		INDUSTRIAL	BALL	12	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES				BICMOS							2.5/3.3	GRID ARRAY, FINE PITCH	BGA12,3X4,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	R-PBGA-B12					Not Qualified		e3

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.