Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BUTT |
12 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.2 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.69 mm |
1.54 mm |
e1 |
30 |
260 |
2.02 mm |
|||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.2 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
e0 |
2.02 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
34 V |
1 |
BICMOS |
24 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
4.75 V |
.5 mm |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.69 mm |
1.885 mm |
e1 |
30 |
260 |
2.215 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.2 V |
1 |
BICMOS |
1.8 V |
3.6 V |
2.5/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
2.2 V |
Other Interface ICs |
1.62 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
e1 |
30 |
260 |
2.12 mm |
||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
34 V |
1 |
BICMOS |
24 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
7 V |
.5 mm |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.69 mm |
1.885 mm |
e1 |
30 |
260 |
2.215 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
34 V |
1 |
BICMOS |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
4.75 V |
.5 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
BALL |
12 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
2.5/3.3 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
BOTTOM |
R-PBGA-B12 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.2 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
e0 |
2.02 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.2 V |
1 |
BICMOS |
1.8 V |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.2 V |
1.62 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
e1 |
30 |
260 |
2.12 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BUTT |
12 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.2 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.69 mm |
1.54 mm |
e1 |
30 |
260 |
2.02 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
34 V |
1 |
BICMOS |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
7 V |
.5 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.2 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
e0 |
2.02 mm |
|||||||||||||||||||||||||||
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.2 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
e0 |
2.02 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
34 V |
1 |
BICMOS |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
4.75 V |
.5 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
34 V |
1 |
BICMOS |
24 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
4.75 V |
.5 mm |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.69 mm |
1.885 mm |
e1 |
30 |
260 |
2.215 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
34 V |
1 |
BICMOS |
24 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
7 V |
.5 mm |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.69 mm |
1.885 mm |
e1 |
30 |
260 |
2.215 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
.9 V |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N12 |
.55 mm |
1.7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
|||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
.9 V |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N12 |
.55 mm |
1.7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1.8 V |
5.3 V |
1.8/3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.08SQ,16 |
4.8 V |
Other Interface ICs |
1.6 V |
.4 mm |
85 Cel |
5 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N12 |
1 |
.55 mm |
1.8 mm |
Not Qualified |
e4 |
1.8 mm |
|||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
GENERAL PURPOSE |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
2.4 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.612 mm |
1.21 mm |
e1 |
30 |
260 |
1.67 mm |
||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
GENERAL PURPOSE |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
2.4 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
1 |
.612 mm |
1.21 mm |
NOT SPECIFIED |
260 |
1.67 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
AEC-Q100 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
.9 V |
.4 mm |
125 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
R-PQCC-N12 |
1 |
.55 mm |
1.7 mm |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
AEC-Q100 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
.9 V |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N12 |
.55 mm |
1.7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
AEC-Q100 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
.9 V |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
R-PQCC-N12 |
.55 mm |
1.7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.55 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.412 mm |
1.205 mm |
1.605 mm |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.2 V |
1.2/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
Other Interface ICs |
1.1 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.6 mm |
1.19 mm |
Not Qualified |
IT ALSO REQUIRES 2.5 TO 5.5V |
NOT SPECIFIED |
NOT SPECIFIED |
1.62 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.55 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.412 mm |
1.205 mm |
NOT SPECIFIED |
NOT SPECIFIED |
1.605 mm |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
12 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
1.2/3.6,1.8/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,16 |
Other Interface ICs |
.4 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.55 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.412 mm |
1.205 mm |
NOT SPECIFIED |
NOT SPECIFIED |
1.605 mm |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.55 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.412 mm |
1.205 mm |
1.605 mm |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVQCCN |
SQUARE |
PLASTIC |
YES |
3.6 V |
1 |
GENERAL PURPOSE |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.16X16 |
.8 V |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N12 |
1 mm |
4 mm |
ALSO OPERATES WITH 1.65 TO 3.6 VOLT |
4 mm |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVQCCN |
SQUARE |
PLASTIC |
YES |
3.6 V |
1 |
GENERAL PURPOSE |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC12,.16X16 |
.8 V |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N12 |
1 mm |
4 mm |
ALSO OPERATES WITH 1.65 TO 3.6 VOLT |
4 mm |
|||||||||||||||||||||||||||||||||||
|
Nexperia |
INTERFACE CIRCUIT |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
4 |
1 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.07X.08,16 |
0 V |
.4 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N12 |
1 |
.5 mm |
1.7 mm |
e4 |
30 |
260 |
2 mm |
||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
12 V |
1 |
5 V |
CHIP CARRIER |
3.6 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQCC-N12 |
.8 mm |
2 mm |
e3 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
12 V |
1 |
5 V |
CHIP CARRIER |
3.6 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQCC-N12 |
.8 mm |
2 mm |
e3 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2.7 V |
1 |
1.8 V |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
1.35 V |
.85 V |
.4 mm |
85 Cel |
2.8 V |
-40 Cel |
QUAD |
R-XQCC-N12 |
.55 mm |
1.7 mm |
2 mm |
||||||||||||||||||||||||||||||||||
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
2.7 V |
1 |
1.8 V |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
1.35 V |
.85 V |
.4 mm |
85 Cel |
2.8 V |
-40 Cel |
QUAD |
R-XQCC-N12 |
.55 mm |
1.7 mm |
2 mm |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BUTT |
12 |
VFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.2 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.69 mm |
1.54 mm |
e1 |
30 |
260 |
2.02 mm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
2.02 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
2.02 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
2.02 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.2 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
e0 |
2.02 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B12 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.2 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
e1 |
30 |
260 |
2.02 mm |
||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
2.02 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.2 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
e0 |
2.02 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.