12 Other Function Interface ICs 155

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX3378EEBC+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

12

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.2 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.54 mm

e1

30

260

2.02 mm

MAX3024EBC-T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e0

2.02 mm

MAX14839GWC+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

4.75 V

.5 mm

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.885 mm

e1

30

260

2.215 mm

MAX13042EEBC+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

MAX14838GWC+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

7 V

.5 mm

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.885 mm

e1

30

260

2.215 mm

MAX14839GTC+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.75 V

.5 mm

105 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

e3

30

260

3 mm

MAX13045EEBC+

Analog Devices

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

2.5/3.3

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

BOTTOM

R-PBGA-B12

Not Qualified

e3

MAX3028EBC-T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e0

2.02 mm

MAX13042EEBC+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.2 V

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

e1

30

260

2.12 mm

MAX3391EEBC+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

12

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.2 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.54 mm

e1

30

260

2.02 mm

MAX14838GTC+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

7 V

.5 mm

105 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

e3

30

260

3 mm

MAX3025EBC-T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e0

2.02 mm

MAX3026EBC-T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e0

2.02 mm

MAX14839GTC+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.75 V

.5 mm

105 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

e3

30

260

3 mm

MAX14839GWC+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

4.75 V

.5 mm

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.885 mm

e1

30

260

2.215 mm

MAX14838GWC+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

7 V

.5 mm

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.885 mm

e1

30

260

2.215 mm

NLSXN5004MUTAG

Onsemi

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

4.5 V

1

CHIP CARRIER, VERY THIN PROFILE

LCC12,.07X.08,16

.9 V

.4 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N12

.55 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

NLSXN5004MU2TAG

Onsemi

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

4.5 V

CHIP CARRIER, VERY THIN PROFILE

LCC12,.07X.08,16

.9 V

.4 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N12

.55 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

FXMHD103UMX

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

1.8 V

5.3 V

1.8/3.3

CHIP CARRIER, VERY THIN PROFILE

LCC12,.08SQ,16

4.8 V

Other Interface ICs

1.6 V

.4 mm

85 Cel

5 V

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N12

1

.55 mm

1.8 mm

Not Qualified

e4

1.8 mm

FUSB380UCX

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

GENERAL PURPOSE

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,16

2.4 V

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.612 mm

1.21 mm

e1

30

260

1.67 mm

FUSB380CUCX

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

GENERAL PURPOSE

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,16

2.4 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

1

.612 mm

1.21 mm

NOT SPECIFIED

260

1.67 mm

NLVSX5004MUTAG

Onsemi

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

4.5 V

AEC-Q100

CHIP CARRIER, VERY THIN PROFILE

LCC12,.07X.08,16

.9 V

.4 mm

125 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

R-PQCC-N12

1

.55 mm

1.7 mm

30

260

2 mm

NLVSXN5004MUTAG

Onsemi

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

4.5 V

1

AEC-Q100

CHIP CARRIER, VERY THIN PROFILE

LCC12,.07X.08,16

.9 V

.4 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N12

.55 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

NLVSXN5004MU2TAG

Onsemi

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

4.5 V

AEC-Q100

CHIP CARRIER, VERY THIN PROFILE

LCC12,.07X.08,16

.9 V

.4 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N12

.55 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

NVT4556BUK

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.55 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.412 mm

1.205 mm

1.605 mm

NVT4555UKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.2 V

1.2/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,16

Other Interface ICs

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.6 mm

1.19 mm

Not Qualified

IT ALSO REQUIRES 2.5 TO 5.5V

NOT SPECIFIED

NOT SPECIFIED

1.62 mm

NVT4556AUKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.55 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.412 mm

1.205 mm

NOT SPECIFIED

NOT SPECIFIED

1.605 mm

NTB0104UK-Q100Z

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

AEC-Q100

1.2/3.6,1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

NVT4556BUKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.55 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.412 mm

1.205 mm

NOT SPECIFIED

NOT SPECIFIED

1.605 mm

NVT4556AUK

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.55 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.412 mm

1.205 mm

1.605 mm

PCA9849BS

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

PLASTIC

YES

3.6 V

1

GENERAL PURPOSE

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC12,.16X16

.8 V

.65 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N12

1 mm

4 mm

ALSO OPERATES WITH 1.65 TO 3.6 VOLT

4 mm

PCA9849BSJ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

PLASTIC

YES

3.6 V

1

GENERAL PURPOSE

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC12,.16X16

.8 V

.65 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N12

1 mm

4 mm

ALSO OPERATES WITH 1.65 TO 3.6 VOLT

4 mm

LSF0204GU12

Nexperia

INTERFACE CIRCUIT

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

4

1 V

CHIP CARRIER, VERY THIN PROFILE

LCC12,.07X.08,16

0 V

.4 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-PQCC-N12

1

.5 mm

1.7 mm

e4

30

260

2 mm

AP91352MN1-DT8-7R

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

QCCN

RECTANGULAR

UNSPECIFIED

YES

12 V

1

5 V

CHIP CARRIER

3.6 V

85 Cel

-40 Cel

MATTE TIN

QUAD

R-XQCC-N12

.8 mm

2 mm

e3

260

3 mm

AP91352MN1-DT8-7

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

QCCN

RECTANGULAR

UNSPECIFIED

YES

12 V

1

5 V

CHIP CARRIER

3.6 V

85 Cel

-40 Cel

MATTE TIN

QUAD

R-XQCC-N12

.8 mm

2 mm

e3

260

3 mm

PI4ULS3V304ZMEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

UNSPECIFIED

YES

2.7 V

1

1.8 V

3.6 V

CHIP CARRIER, VERY THIN PROFILE

1.35 V

.85 V

.4 mm

85 Cel

2.8 V

-40 Cel

QUAD

R-XQCC-N12

.55 mm

1.7 mm

2 mm

PI4ULS3V304ZME

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

UNSPECIFIED

YES

2.7 V

1

1.8 V

3.6 V

CHIP CARRIER, VERY THIN PROFILE

1.35 V

.85 V

.4 mm

85 Cel

2.8 V

-40 Cel

QUAD

R-XQCC-N12

.55 mm

1.7 mm

2 mm

MAX3378EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

12

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.2 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.54 mm

e1

30

260

2.02 mm

MAX3393EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX3393EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3392EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX3379EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX3023EBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e0

2.02 mm

MAX3395EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B12

Not Qualified

e0

MAX3392EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3023EBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.02 mm

MAX3391EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX3027EBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e0

2.02 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.