12 Other Function Interface ICs 155

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX3390EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX13043EEBC+

Maxim Integrated

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

2.5/3.3

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

Not Qualified

e1

30

260

MAX3390EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3379EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3391EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

12

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.2 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.54 mm

e1

30

260

2.02 mm

MAX3377EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX13045EEBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.2 V

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

2.12 mm

MAX13044EEBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.2 V

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

2.12 mm

MAX13043EEBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

TC7LX0104MU(TE85L)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

1.2/3.6

CHIP CARRIER

LCC12,.07X.08,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N12

Not Qualified

TC7LX1104WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

1.2/3.6

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.