16 Other Function Interface ICs 2,000

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	Interface Standard	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCA9574PW,112	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS			2.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				1.1 V	.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	5 mm
PCA9574HR	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS			2.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.1 V	.8 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N16		.5 mm	2 mm	Not Qualified					2 mm
PCA9846PWZ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1				1.2 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.8 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		1.1 mm	4.4 mm						5 mm
PCA9849PW	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC	YES	3.6 V	1			GENERAL PURPOSE	1.2 V			SMALL OUTLINE	TSOP16,.25			.8 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		1.1 mm	4.4 mm		ALSO OPERATES WITH 1.65 TO 3.6 VOLT				5 mm
PCA9516PW,112	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e4		260	5 mm
GTL2009PW,112	NXP Semiconductors		INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs		.635 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16				Not Qualified
PCA9574PW	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS			2.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				1.1 V	.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	5 mm
PCA9846BSJ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1				1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.8 V	.65 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N16		1 mm	4 mm						4 mm
PCA9516PW	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		1.1 mm	4.4 mm	Not Qualified		e4		260	5 mm
PCA9516PW,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e4			5 mm
PCA9574HK	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS						CHIP CARRIER, VERY THIN PROFILE				1.1 V	.4 mm	85 Cel		-40 Cel		QUAD	R-PQCC-N16	1	.5 mm	1.8 mm						2.6 mm
PCA9574BS	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS			2.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.1 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	1	1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9516D	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS			3.3 V			SMALL OUTLINE				3 V	1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified		e4			9.9 mm
PCA9616PW	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V		.8 V	.65 mm	85 Cel	5 V	-40 Cel		DUAL	R-PDSO-G16		1.1 mm	4.4 mm						5 mm
PCA9516D,112	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS			3.3 V			SMALL OUTLINE				3 V	1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified		e4			9.9 mm
PCA9702PW	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.5 V	.65 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	5 mm
IRM7001	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS			5 V			SMALL OUTLINE				2.7 V	1.27 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified		e0			9.9 mm
TLE9221SX	Infineon Technologies	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	18 V	1		AEC-Q100		13.5 V	5.25 V		SMALL OUTLINE, SHRINK PITCH		4.75 V		5.5 V	.65 mm	125 Cel	5 V	-40 Cel	NICKEL GOLD PALLADIUM SILVER	DUAL	R-PDSO-G16	2A	2 mm	5.3 mm						6.2 mm
PI4MSD5V9546ALE	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				1.65 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
PI4MSD5V9546AWE	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25			1.65 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm						5 mm
PI4MSD5V9546AWEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25			1.65 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm						5 mm
PI4MSD5V9546AZYEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1				3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25			1.65 V	.65 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N16		.8 mm	4 mm						4 mm
PI6ULS5V9627AZYE	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS					1.2/5,2.5/5	CHIP CARRIER	LCC16,.16SQ,25		Other Interface ICs		.635 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N16				Not Qualified
PI6ULS5V9627AZYEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS					1.2/5,2.5/5	CHIP CARRIER	LCC16,.16SQ,25		Other Interface ICs		.635 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N16				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
PI6ULS5V9627AQE	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS					1.2/5,2.5/5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25		Other Interface ICs		.635 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16				Not Qualified
PI6ULS5V9627AQEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS					1.2/5,2.5/5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25		Other Interface ICs		.635 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
PI4IOE5V9557LEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25			2.3 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
MAX9483CTE-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				4.5 V	.65 mm	70 Cel		0 Cel		QUAD	S-XQCC-N16		.8 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
MAX9483CEE-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				5 V			SMALL OUTLINE, SHRINK PITCH				4.5 V	.635 mm	70 Cel		0 Cel		DUAL	R-PDSO-G16		1.73 mm	3.9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4.89 mm
MAX9483CEE	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1				5 V		5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25		Display Drivers	4.5 V	.635 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
DS1861B	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	BALL	16	LBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1							GRID ARRAY, LOW PROFILE				2.85 V	1 mm	70 Cel		0 Cel		BOTTOM	S-PBGA-B16	1	1.5 mm	4 mm	Not Qualified					4 mm
MAX9483CTE	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1				5 V		5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		Display Drivers	4.5 V	.65 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	4 mm	Not Qualified		e0			4 mm
DS1861B+	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	BALL	16	LBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1							GRID ARRAY, LOW PROFILE				2.85 V	1 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	3	1.5 mm	4 mm	Not Qualified		e1			4 mm
MAX13002EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6	BICMOS			1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX13032EEBE+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e1	30	260	2.02 mm
MAX7302AEE+T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS			3.3 V			SMALL OUTLINE, SHRINK PITCH				1.62 V	.635 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16		1.75 mm	3.9 mm			e3			4.89 mm
MAX3299CUE-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3298CUE	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3340EEBE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				5 V	3.6 V	5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	1.8 V	Other Interface ICs	4 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0		245	2.02 mm
MAX13004EEUE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS			3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G16	1	1.1 mm	5 mm	Not Qualified		e0			5 mm
MAX13003EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6	BICMOS			1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX3298CUE-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX13032EEBE+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2 mm	Not Qualified		e1	30	260	2 mm
MAX3299CUE	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3736ETE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e0			3 mm
MAX3341EEUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS			5 V		2/3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	4 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3287CUE	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3287CUE-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.