16 Other Function Interface ICs 2,000

Reset All
Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX3741ETE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX7302ATE+T

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.62 V

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX13000EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX13034EEBE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B16

.67 mm

2.02 mm

Not Qualified

e3

2.02 mm

MAX13005EEUE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G16

1

1.1 mm

5 mm

Not Qualified

e0

5 mm

MAX3982UTE

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

MAX3982UTE-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3289CUE

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Display Drivers

3 V

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-XDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX13033EEBE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B16

.67 mm

2.02 mm

Not Qualified

e3

2.02 mm

MAX3288CUE+

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

70 Cel

0 Cel

TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX3736ETE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX13000EEUE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

5 mm

MAX7302ATE+

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.62 V

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3288CUE

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Display Drivers

3 V

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-XDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX13031EEBE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B16

.67 mm

2.02 mm

Not Qualified

e3

2.02 mm

MAX3298CUE+

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

70 Cel

0 Cel

TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

5 mm

MAX13004EEUE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX3299CUE+

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX14569EEE+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

3 V

5.5 V

3,3.6

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

2.3 V

Other Interface ICs

1.6 V

.635 mm

85 Cel

3.6 V

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.89 mm

MAX4895EETE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

BICMOS

3.3 V

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

2 V

.5 mm

85 Cel

5 V

-40 Cel

QUAD

S-XQCC-N16

.8 mm

3 mm

20

240

3 mm

MAX3741HETE#TG16

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N16

.8 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

MAX3299CUE+T

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

70 Cel

0 Cel

TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

5 mm

MAX3297CUE-T

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Display Drivers

3 V

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-XDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX13001EEUE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G16

1

1.1 mm

5 mm

Not Qualified

e0

5 mm

MAX3741ETE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

MAX13000EEUE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX14569EEE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

3 V

5.5 V

SMALL OUTLINE, SHRINK PITCH

2.3 V

1.6 V

.635 mm

85 Cel

3.6 V

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.75 mm

3.89 mm

e3

30

260

4.9 mm

MAX3343EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

3.6 V

5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

1.8 V

Other Interface ICs

4 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX7302AEE+

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

SMALL OUTLINE, SHRINK PITCH

1.62 V

.635 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.89 mm

MAX3297CUE+T

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Display Drivers

3 V

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

5 mm

MAX13001EEUE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX3341EEBE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

2/3.3,5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

4 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX13002EEUE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX13005EEUE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX3741HETE#G16

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-XQCC-N16

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3340EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

3.6 V

5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

1.8 V

Other Interface ICs

4 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX13000EEUE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G16

1

1.1 mm

5 mm

Not Qualified

e0

5 mm

MAX3341EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

2/3.3,5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

4 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.65 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX3741HETE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

3 mm

MAX13002EEUE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G16

1

1.1 mm

5 mm

Not Qualified

e0

5 mm

MAX3289CUE-T

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Display Drivers

3 V

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-XDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX13004EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX3288CUE-T

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Display Drivers

3 V

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-XDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX13001EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

SAP5SB-B-R

Renesas Electronics

INTERFACE CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-G16

NOT SPECIFIED

NOT SPECIFIED

SAP5SB-B-G1-T

Renesas Electronics

INTERFACE CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-G16

NOT SPECIFIED

NOT SPECIFIED

SAP5SB-B-G1-R

Renesas Electronics

INTERFACE CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-G16

NOT SPECIFIED

NOT SPECIFIED

SAP5SB-B-T

Renesas Electronics

INTERFACE CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-G16

NOT SPECIFIED

NOT SPECIFIED

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.