16 Other Function Interface ICs 2,000

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

HCC4054BK

STMicroelectronics

MILITARY

FLAT

16

DFP

RECTANGULAR

CERAMIC

SEGMENT

YES

CMOS

3 mA

5/15

FLATPACK

FL16,.3

4

0-BP

Other Interface ICs

1.27 mm

125 Cel

-55 Cel

DUAL

R-XDFP-F16

Not Qualified

ST21491QTR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

VQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

1.8 V

CHIP CARRIER, VERY THIN PROFILE

1.65 V

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N16

.6 mm

1.8 mm

ALSO REQUIRED VCC = 3.3V SUPPLY NOMINAL

2.6 mm

HCC4055BD

STMicroelectronics

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

SEGMENT

NO

CMOS

3 mA

5/15

IN-LINE

DIP16,.3

7

0-BP

Other Interface ICs

2.54 mm

125 Cel

-55 Cel

DUAL

R-XDIP-T16

Not Qualified

ST2349IQTR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

VQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

CHIP CARRIER, VERY THIN PROFILE

1.65 V

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N16

.6 mm

1.8 mm

ALSO REQUIRED VCC = 1.8V TO 5.5V SUPPLY RANGE

2.6 mm

HCF4054BF

STMicroelectronics

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

SEGMENT

NO

CMOS

.6 mA

5/15

IN-LINE

DIP16,.3

4

0-BP

Other Interface ICs

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-XDIP-T16

Not Qualified

e0

L99MC6-LF

STMicroelectronics

INTERFACE CIRCUIT

GULL WING

16

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.3 V

1

3.3 V

16 V

3.3/5

SMALL OUTLINE

SSOP16,.25,20

6 V

Peripheral Drivers

3 V

.5 mm

13 V

6

DUAL

R-PDSO-G16

1.72 mm

3.9 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

HCC40109BD

STMicroelectronics

INTERFACE CIRCUIT

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

18 V

4

CMOS

5 V

IN-LINE

3 V

2.54 mm

125 Cel

-55 Cel

DUAL

R-CDIP-T16

3.83 mm

7.62 mm

LG-MAX

19.2 mm

HCF40109BEY

STMicroelectronics

INTERFACE CIRCUIT

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

20 V

1

CMOS

5 V

3/15

IN-LINE

DIP16,.3

Other Interface ICs

3 V

2.54 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T16

5.1 mm

7.62 mm

Not Qualified

e4

245

HCC4055BK

STMicroelectronics

MILITARY

FLAT

16

DFP

RECTANGULAR

CERAMIC

SEGMENT

YES

CMOS

3 mA

5/15

FLATPACK

FL16,.3

7

0-BP

Other Interface ICs

1.27 mm

125 Cel

-55 Cel

DUAL

R-XDFP-F16

Not Qualified

L99MC6TR

STMicroelectronics

INTERFACE CIRCUIT

GULL WING

16

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.3 V

1

AEC-Q100

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

SSOP16,.25,20

3 V

.5 mm

150 Cel

-40 Cel

DUAL

R-PDSO-G16

3

1.72 mm

3.9 mm

4.9 mm

L99MC6TR-LF

STMicroelectronics

INTERFACE CIRCUIT

GULL WING

16

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.3 V

1

AEC-Q100

3.3 V

16 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

SSOP16,.25,20

6 V

Peripheral Drivers

3 V

.5 mm

150 Cel

13 V

-40 Cel

6

DUAL

R-PDSO-G16

1.72 mm

3.9 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

ST2349QTR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

VQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

5.5 V

CHIP CARRIER, VERY THIN PROFILE

1.8 V

1.65 V

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-XQCC-N16

1

.6 mm

1.8 mm

Not Qualified

e4

30

260

2.6 mm

HCF4056BF

STMicroelectronics

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

SEGMENT

NO

CMOS

.6 mA

5/15

IN-LINE

DIP16,.3

7

0-BP

Other Interface ICs

2.54 mm

85 Cel

-40 Cel

DUAL

R-XDIP-T16

Not Qualified

HCC4056BK

STMicroelectronics

MILITARY

FLAT

16

DFP

RECTANGULAR

CERAMIC

SEGMENT

YES

CMOS

3 mA

5/15

FLATPACK

FL16,.3

7

0-BP

Other Interface ICs

1.27 mm

125 Cel

-55 Cel

DUAL

R-XDFP-F16

Not Qualified

HCF40109BF

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

15 V

4

CMOS

5 V

IN-LINE

3 V

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-GDIP-T16

5.08 mm

7.62 mm

LG-MAX

e0

20 mm

HCF40109M013TR

STMicroelectronics

INTERFACE CIRCUIT

MILITARY

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

20 V

1

CMOS

5 V

5/15

SMALL OUTLINE

SOP16,.25

Other Interface ICs

3 V

1.27 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Not Qualified

e4

9.9 mm

HCC40109BF

STMicroelectronics

INTERFACE CIRCUIT

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

18 V

4

CMOS

3/18

IN-LINE

DIP16,.3

Other Interface ICs

3 V

2.54 mm

125 Cel

-55 Cel

TIN LEAD

DUAL

R-GDIP-T16

5.08 mm

7.62 mm

Not Qualified

e0

HCC40109BK

STMicroelectronics

INTERFACE CIRCUIT

MILITARY

FLAT

16

DFP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

YES

18 V

4

CMOS

5 V

FLATPACK

3 V

1.27 mm

125 Cel

-55 Cel

DUAL

R-CDFP-F16

6.9 mm

9.95 mm

HCC4056BD

STMicroelectronics

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

SEGMENT

NO

CMOS

3 mA

5/15

IN-LINE

DIP16,.3

7

0-BP

Other Interface ICs

2.54 mm

125 Cel

-55 Cel

DUAL

R-XDIP-T16

Not Qualified

HCF4055BF

STMicroelectronics

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

SEGMENT

NO

CMOS

.6 mA

5/15

IN-LINE

DIP16,.3

7

0-BP

Other Interface ICs

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-XDIP-T16

Not Qualified

e0

HCC4054BD

STMicroelectronics

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

SEGMENT

NO

CMOS

3 mA

5/15

IN-LINE

DIP16,.3

4

0-BP

Other Interface ICs

2.54 mm

125 Cel

-55 Cel

DUAL

R-XDIP-T16

Not Qualified

ST8034ATDT

STMicroelectronics

INTERFACE CIRCUIT

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE

SOP16,.25

2.7 V

1.27 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

NOT SPECIFIED

NOT SPECIFIED

9.9 mm

ST8034TDT

STMicroelectronics

INTERFACE CIRCUIT

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE

SOP16,.25

2.7 V

1.27 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

NOT SPECIFIED

NOT SPECIFIED

9.9 mm

ST8034CQR

STMicroelectronics

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

2.7 V

.5 mm

85 Cel

-25 Cel

QUAD

S-XQCC-N16

.8 mm

2.9 mm

NOT SPECIFIED

NOT SPECIFIED

2.9 mm

ST8034PQR

STMicroelectronics

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

2.7 V

.5 mm

85 Cel

-25 Cel

QUAD

S-XQCC-N16

.8 mm

2.9 mm

NOT SPECIFIED

NOT SPECIFIED

2.9 mm

PTN5110HQ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

.4 mm

2.6 mm

ESD FOR VBUS,CC1,CC2 PINS IS 3B

2.6 mm

SA5775N

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

1

5 V

IN-LINE

4.5 V

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T16

4.2 mm

7.62 mm

Not Qualified

19.025 mm

PTN5110NHQ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

.4 mm

2.6 mm

ESD FOR VBUS,CC1,CC2 PINS IS 3B

2.6 mm

NTBA104GU16,115

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

16

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1.2/3.6,1.8/5

CHIP CARRIER

LCC16,.07X.1,16

Other Interface ICs

.4 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N16

1

Not Qualified

260

SA5777N

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

1

5 V

IN-LINE

4.5 V

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T16

4.2 mm

7.62 mm

Not Qualified

19.025 mm

PTN5110DHQ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

.4 mm

2.6 mm

ESD FOR VBUS,CC1,CC2 PINS IS 3B

2.6 mm

PTN5110THQ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

.4 mm

2.6 mm

ESD FOR VBUS,CC1,CC2 PINS IS 3B

2.6 mm

PTN5110NTHQ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

.4 mm

2.6 mm

ESD FOR VBUS,CC1,CC2 PINS IS 3B

2.6 mm

PTN5110NTHQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

e3

30

260

2.6 mm

PTN5110NDHQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

e3

30

260

2.6 mm

PTN5110NDHQ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

.4 mm

2.6 mm

ESD FOR VBUS,CC1,CC2 PINS IS 3B

2.6 mm

PTN5110THQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

260

2.6 mm

MCZ33811EG

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5,7/17

SMALL OUTLINE

SOP16,.4

Peripheral Drivers

1.27 mm

125 Cel

-40 Cel

5

Matte Tin (Sn)

DUAL

R-PDSO-G16

3

Not Qualified

e3

40

260

MCZ33811EGR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5,7/17

SMALL OUTLINE

SOP16,.4

Peripheral Drivers

1.27 mm

125 Cel

-40 Cel

5

Matte Tin (Sn)

DUAL

R-PDSO-G16

3

Not Qualified

e3

40

260

ISP1105BS,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

4 V

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1 mm

3 mm

Not Qualified

ALSO REQUIRED NOM REGULATED SUPPLY VOLTAGE IS 3.3 V

3 mm

PCA9846PW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.2 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.8 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

5 mm

PCA9516D,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

BICMOS

3.3 V

SMALL OUTLINE

3 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Not Qualified

e4

9.9 mm

PCA9702PW,112

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.5 V

.65 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

5 mm

GTL2009PW,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e4

5 mm

PCA9702PW/Q900

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.5 V

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e4

5 mm

GTL2009PW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

3 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

5 mm

PCA9516DH

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

5 mm

PCA9846BS

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.8 V

.65 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1 mm

4 mm

4 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.