25 Other Function Interface ICs 33

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

ST6G3244MEBJR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1

CMOS

1.8 V

5 V

1.8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

3 V

Level Translators

1.62 V

.4 mm

85 Cel

3.4 V

-40 Cel

BOTTOM

S-PBGA-B25

.65 mm

2 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

2 mm

STGIPS10K60A

STMicroelectronics

INTERFACE CIRCUIT

AUTOMOTIVE

THROUGH-HOLE

25

RECTANGULAR

PLASTIC/EPOXY

NO

17 V

1

15 V

FLANGE MOUNT

12 V

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDFM-T25

Not Qualified

ALSO REQUIRED VPN=300V SUPPLY NOMINAL

e3

IP4856CX25/CZ

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.7 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1

.55 mm

2.05 mm

VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6

30

260

2.05 mm

IP4855CX25/P,135

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

4 V

3/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

Level Translators

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

Not Qualified

2.04 mm

ADN8833ACBZ-R7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.66 mm

2.54 mm

e1

30

260

2.54 mm

ST6G3237TBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1.16 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

ST6G3238BETBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

NICKEL GOLD

BOTTOM

S-PBGA-B25

3

1.16 mm

3 mm

Not Qualified

e4

30

260

3 mm

ST6G3238ETBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

UNSPECIFIED

YES

3.6 V

1

CMOS

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B25

3

1.16 mm

3 mm

Not Qualified

e1

30

260

3 mm

LM8328TME

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.62 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.675 mm

2.015 mm

2.015 mm

LM8328TMX

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.62 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.675 mm

2.015 mm

2.015 mm

LM8328TME/NOPB

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.62 V

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.675 mm

2.015 mm

Not Qualified

e1

30

260

2.015 mm

LM8328TMX/NOPB

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.62 V

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.675 mm

2.015 mm

Not Qualified

e1

30

260

2.015 mm

MAX7370EWA+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

Display Drivers

1.62 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1

.69 mm

2.09 mm

Not Qualified

2.09 mm

MAX7304EWA+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

Display Drivers

1.62 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1

.69 mm

2.09 mm

Not Qualified

2.09 mm

LC898119XC-MH

Onsemi

INTERFACE CIRCUIT

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.6 V

2.6 V

.4 mm

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.675 mm

2 mm

e1

30

260

2 mm

ST6G3237BTBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1.16 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

ST6G3238NETBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.65 V

GRID ARRAY

1.4 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

3

1.16 mm

3 mm

Not Qualified

e1

30

260

3 mm

ST6G3238BE

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1.16 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

IP4855CX25/C

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.55 mm

2.05 mm

2.05 mm

IP4855CX25

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.05 mm

2.05 mm

IP4855CX25,14

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.05 mm

2.05 mm

IP4856CX25/C

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.8 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.55 mm

2.05 mm

2.05 mm

IP4855CX25/P

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

4 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

2.04 mm

IP4856CX25

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.8 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.05 mm

2.05 mm

IP4855CX25Z

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

IP4855CX25/CAZ

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

DS1862B

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.6 V

1.5/3.3,3/5.5

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA25,5X5,30

1.6 V

Display Drivers

2.9 V

.8 mm

100 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

DS1862B+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.6 V

1.5/3.3,3/5.5

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA25,5X5,30

1.6 V

Display Drivers

2.9 V

.8 mm

100 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e1

30

260

5 mm

DS1862B+T&R

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.6 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 V

2.9 V

.8 mm

100 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e1

30

260

5 mm

MAX3975UBA-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,20

Display Drivers

2.97 V

.5 mm

85 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

1

.67 mm

2.54 mm

Not Qualified

e0

2.54 mm

MAX7370EWA+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.62 V

1.62 V

.4 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B25

1

.69 mm

2.09 mm

e2

30

260

2.09 mm

MAX7370AWA+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.62 V

1.62 V

.4 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

S-PBGA-B25

.69 mm

2.09 mm

NOT SPECIFIED

NOT SPECIFIED

2.09 mm

T3GF3WBG(EL)

Toshiba

OTHER

BALL

25

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA25,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B25

Not Qualified

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.