32 Other Function Interface ICs 226

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MFRC52202HN1,115

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.5 V

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1

1 mm

5 mm

30

260

5 mm

MFRC52201HN1,157

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

e4

30

260

5 mm

ADBMS6822WCCSZ-RL

Analog Devices

INTERFACE CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

3 V

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N32

.8 mm

5 mm

5 mm

MAX3869EHJ

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

MAX3869EHJ+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e3

30

260

5 mm

MFRC52201HN1,151

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

85 Cel

-25 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N32

1

1 mm

5 mm

e4

30

260

5 mm

ADBMS6822WCCSZ

Analog Devices

INTERFACE CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

3 V

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N32

.8 mm

5 mm

5 mm

HMC677LP5ETR

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

+-5

-5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Interface ICs

4.5 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e3

5 mm

HMC677LP5E

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

+-5

-5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Interface ICs

4.5 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e3

260

5 mm

HCTL-2032-SC

Broadcom

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

5 V

5

SMALL OUTLINE

SOP32,.4

Other Interface ICs

4.5 V

1.27 mm

100 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G32

3

2.54 mm

7.5184 mm

Not Qualified

e3

260

20.7772 mm

HCTL-2032-SCT

Broadcom

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

5 V

5

SMALL OUTLINE

SOP32,.4

Other Interface ICs

4.5 V

1.27 mm

100 Cel

-40 Cel

DUAL

R-PDSO-G32

3

2.54 mm

7.5184 mm

Not Qualified

260

20.7772 mm

LTM2886IY-3I#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

3.3 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

3 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

3

3.62 mm

11.25 mm

30

245

15 mm

ADBMS6821WCCSZ

Analog Devices

INTERFACE CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

3 V

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N32

.8 mm

5 mm

5 mm

ADBMS6821WCCSZ-RL

Analog Devices

INTERFACE CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

3 V

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N32

.8 mm

5 mm

5 mm

MC33797BPEWR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP32,.4

Other Interface ICs

.635 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

Not Qualified

e3

40

260

MC33978AEKR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

2.45 mm

7.5 mm

e3

40

260

11 mm

ADN2848ACPZ-32

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Display Drivers

3 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

260

5 mm

LTM2887IY-3I#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

3.3 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

3 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

4

3.62 mm

15 mm

30

245

11.25 mm

MAX3668EHJ+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX3668EHJ

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

MC33797BPEW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP32,.4

Other Interface ICs

.635 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

Not Qualified

e3

40

260

LTM2883IY-3S#PBF

Analog Devices

DIGITAL ISOLATOR

INDUSTRIAL

BALL

32

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

5.5 V

GRID ARRAY

BGA32,8X11,50

1.62 V

1.62 V

1.27 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

R-PBGA-B32

4

3.62 mm

11.25 mm

30

245

15 mm

LTM2883IY-5S#PBF

Analog Devices

DIGITAL ISOLATOR

INDUSTRIAL

BALL

32

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

5 V

5.5 V

GRID ARRAY

BGA32,8X11,50

1.62 V

4.5 V

1.27 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

R-PBGA-B32

3.62 mm

11.25 mm

NOT SPECIFIED

NOT SPECIFIED

15 mm

MC33978AESR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

3

.9 mm

5 mm

e3

40

260

5 mm

PI4IOE5V96224ZLEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.12X.24,16

2.3 V

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N32

.8 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

MC34978AES

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

3

.9 mm

5 mm

e3

40

260

5 mm

HCTL-2032

Broadcom

INTERFACE CIRCUIT

INDUSTRIAL

THROUGH-HOLE

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

1

CMOS

5 V

5

IN-LINE

DIP32,.6

Other Interface ICs

4.5 V

2.54 mm

100 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T32

15.24 mm

Not Qualified

e3

260

41.91 mm

HI-8422PQIF

Holt Integrated Circuits

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

8

CMOS

5 V

FLATPACK, LOW PROFILE

4.5 V

.8 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G32

3

1.6 mm

7 mm

Not Qualified

e3

40

260

7 mm

HI-8426PQT

Holt Integrated Circuits

INTERFACE CIRCUIT

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

SOI-CMOS

3.3 V

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

3 V

.8 mm

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G32

3

1.2 mm

7 mm

e0

30

240

7 mm

LTM2886IY-5S#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

5 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

4.5 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

3

3.62 mm

11.25 mm

30

245

15 mm

MC33978AEK

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

2.45 mm

7.5 mm

e3

40

260

11 mm

TUSB1210BRHB

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

4.8 V

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

TUSB1210RHBR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

4.8 V

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

TUSB1210BQRHBRQ1

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

4.8 V

1

AEC-Q100

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

.5 mm

125 Cel

-40 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

TUSB1210RHB

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

4.8 V

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

TPS65191RHBR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

35 V

1

30 V

-10,30

-10 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Interface ICs

15 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

LTM2883C-5I#PBF

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

BALL

32

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

I2C

5 V

GRID ARRAY

BGA32,8X11,50

4.5 V

1.27 mm

70 Cel

0 Cel

BOTTOM

R-PBGA-B32

3.62 mm

11.25 mm

NOT SPECIFIED

NOT SPECIFIED

15 mm

LTM2883I-3S#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

SPI

3.3 V

GRID ARRAY

BGA32,8X11,50

3 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B32

3.62 mm

11.25 mm

NOT SPECIFIED

NOT SPECIFIED

15 mm

LTM2883H-3S#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

SPI

3.3 V

GRID ARRAY

BGA32,8X11,50

3 V

1.27 mm

105 Cel

-40 Cel

BOTTOM

R-PBGA-B32

3.62 mm

11.25 mm

NOT SPECIFIED

NOT SPECIFIED

15 mm

LTM2886HY-3I#PBF

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

3.3 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

3 V

1.27 mm

125 Cel

-40 Cel

BOTTOM

R-XBGA-B32

3

3.62 mm

11.25 mm

30

245

15 mm

LTM2886IY-5I#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

5 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

4.5 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

3

3.62 mm

11.25 mm

30

245

15 mm

LTM2887IY-3S#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

3.3 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

3 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

4

3.62 mm

15 mm

30

245

11.25 mm

LTM2887IY-5I#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

5 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

4.5 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

4

3.62 mm

15 mm

30

245

11.25 mm

LTM2883CY-3S#PBF

Analog Devices

DIGITAL ISOLATOR

COMMERCIAL

BALL

32

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

5.5 V

GRID ARRAY

BGA32,8X11,50

1.62 V

1.62 V

1.27 mm

70 Cel

3.3 V

0 Cel

BOTTOM

R-PBGA-B32

3.62 mm

11.25 mm

NOT SPECIFIED

NOT SPECIFIED

15 mm

LTM2883H-5S#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

SPI

5 V

GRID ARRAY

BGA32,8X11,50

4.5 V

1.27 mm

105 Cel

-40 Cel

BOTTOM

R-PBGA-B32

3.62 mm

11.25 mm

NOT SPECIFIED

NOT SPECIFIED

15 mm

LTM2887IY-5S#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

5 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

4.5 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

4

3.62 mm

15 mm

30

245

11.25 mm

LTM2886HY-5S#PBF

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

5 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

4.5 V

1.27 mm

125 Cel

-40 Cel

BOTTOM

R-XBGA-B32

3

3.62 mm

11.25 mm

30

245

15 mm

LTM2887CY-3S#PBF

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

3.3 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

3 V

1.27 mm

70 Cel

0 Cel

BOTTOM

R-XBGA-B32

4

3.62 mm

15 mm

30

245

11.25 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.