Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.5 V |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
.8 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
3.3/5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Display Drivers |
3.14 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
3.3/5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Display Drivers |
3.14 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
85 Cel |
-25 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
.8 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
5 V |
+-5 |
-5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Interface ICs |
4.5 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
5 V |
+-5 |
-5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Interface ICs |
4.5 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
e3 |
260 |
5 mm |
|||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
5 |
SMALL OUTLINE |
SOP32,.4 |
Other Interface ICs |
4.5 V |
1.27 mm |
100 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
2.54 mm |
7.5184 mm |
Not Qualified |
e3 |
260 |
20.7772 mm |
||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
5 V |
5 |
SMALL OUTLINE |
SOP32,.4 |
Other Interface ICs |
4.5 V |
1.27 mm |
100 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
3 |
2.54 mm |
7.5184 mm |
Not Qualified |
260 |
20.7772 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
3 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
.8 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
.8 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP32,.4 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
Not Qualified |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
2.45 mm |
7.5 mm |
e3 |
40 |
260 |
11 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Display Drivers |
3 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
260 |
5 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
4 |
3.62 mm |
15 mm |
30 |
245 |
11.25 mm |
|||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
3.3/5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Display Drivers |
3.14 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
3.3/5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Display Drivers |
3.14 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP32,.4 |
Other Interface ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
Not Qualified |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL ISOLATOR |
INDUSTRIAL |
BALL |
32 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
5.5 V |
GRID ARRAY |
BGA32,8X11,50 |
1.62 V |
1.62 V |
1.27 mm |
85 Cel |
3.3 V |
-40 Cel |
BOTTOM |
R-PBGA-B32 |
4 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL ISOLATOR |
INDUSTRIAL |
BALL |
32 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
5.5 V |
GRID ARRAY |
BGA32,8X11,50 |
1.62 V |
4.5 V |
1.27 mm |
85 Cel |
3.3 V |
-40 Cel |
BOTTOM |
R-PBGA-B32 |
3.62 mm |
11.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
e3 |
40 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.12X.24,16 |
2.3 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N32 |
.8 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
105 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
e3 |
40 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
Broadcom |
INTERFACE CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
5 V |
5 |
IN-LINE |
DIP32,.6 |
Other Interface ICs |
4.5 V |
2.54 mm |
100 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
15.24 mm |
Not Qualified |
e3 |
260 |
41.91 mm |
||||||||||||||||||||||||||||||
|
Holt Integrated Circuits |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
CMOS |
5 V |
FLATPACK, LOW PROFILE |
4.5 V |
.8 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G32 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
||||||||||||||||||||||||||||||
Holt Integrated Circuits |
INTERFACE CIRCUIT |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SOI-CMOS |
3.3 V |
FLATPACK, THIN PROFILE |
TQFP32,.35SQ,32 |
3 V |
.8 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G32 |
3 |
1.2 mm |
7 mm |
e0 |
30 |
240 |
7 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
3 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
32 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G32 |
3 |
2.45 mm |
7.5 mm |
e3 |
40 |
260 |
11 mm |
||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4.8 V |
1 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4.8 V |
1 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4.8 V |
1 |
AEC-Q100 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.7 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4.8 V |
1 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
35 V |
1 |
30 V |
-10,30 |
-10 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Interface ICs |
15 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
BALL |
32 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
I2C |
5 V |
GRID ARRAY |
BGA32,8X11,50 |
4.5 V |
1.27 mm |
70 Cel |
0 Cel |
BOTTOM |
R-PBGA-B32 |
3.62 mm |
11.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
SPI |
3.3 V |
GRID ARRAY |
BGA32,8X11,50 |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B32 |
3.62 mm |
11.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
SPI |
3.3 V |
GRID ARRAY |
BGA32,8X11,50 |
3 V |
1.27 mm |
105 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B32 |
3.62 mm |
11.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
3 V |
1.27 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
3 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
3 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
4 |
3.62 mm |
15 mm |
30 |
245 |
11.25 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
4 |
3.62 mm |
15 mm |
30 |
245 |
11.25 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL ISOLATOR |
COMMERCIAL |
BALL |
32 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
5.5 V |
GRID ARRAY |
BGA32,8X11,50 |
1.62 V |
1.62 V |
1.27 mm |
70 Cel |
3.3 V |
0 Cel |
BOTTOM |
R-PBGA-B32 |
3.62 mm |
11.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SPI |
5 V |
GRID ARRAY |
BGA32,8X11,50 |
4.5 V |
1.27 mm |
105 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B32 |
3.62 mm |
11.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
4.5 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
4 |
3.62 mm |
15 mm |
30 |
245 |
11.25 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
5 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
4.5 V |
1.27 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
3 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
3 V |
1.27 mm |
70 Cel |
0 Cel |
BOTTOM |
R-XBGA-B32 |
4 |
3.62 mm |
15 mm |
30 |
245 |
11.25 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.