32 Other Function Interface ICs 226

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
935263837118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES		1					FLATPACK, LOW PROFILE, FINE PITCH					.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified					5 mm
935260371551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES		1					FLATPACK, LOW PROFILE, FINE PITCH					.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified					5 mm
935263836118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V			FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified					5 mm
TZA3031BHL/C4	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V			FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified					5 mm
TZA3011AVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	YES	3.47 V	1	BICMOS	3.3 V	3.47 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3.14 V	Display Drivers	3.14 V	.5 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified		e4			5 mm
TZA3011BVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	YES	3.47 V	1	BICMOS	3.3 V	3.47 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3.14 V	Display Drivers	3.14 V	.5 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified		e4			5 mm
MC33SA0528AC	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1		5 V			FLATPACK, LOW PROFILE				4.8 V	.8 mm	125 Cel		-40 Cel	TIN	QUAD	S-PQFP-G32	3	1.6 mm	7 mm			e3	30	250	7 mm
MC33975ATEK	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		5 V			SMALL OUTLINE				3 V	.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified		e3	40	260	10 mm
MC34978AEK	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	105 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm			e3	40	260	11 mm
MC33975TEKR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		5 V			SMALL OUTLINE				3 V	.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified		e3	40	260	10 mm
MC34978EK	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	105 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm			e3			11 mm
935293912151	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm						5 mm
MC33975AEK	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified					11 mm
MC33978EKR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm			e3			11 mm
MC33975ATEKR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		5 V			SMALL OUTLINE				3 V	.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified		e3	40	260	10 mm
935293912115	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20			2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm						5 mm
MC34978AEKR2	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	105 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm			e3	40	260	11 mm
MC33978EK	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm			e3			11 mm
MC33972TEWR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		3.3 V	26 V		SMALL OUTLINE, SHRINK PITCH		8 V		3.1 V	.65 mm	125 Cel	13 V	-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	11 mm
MC33993DWB	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		3.3 V	26 V		SMALL OUTLINE, SHRINK PITCH		8 V		3.1 V	.65 mm	125 Cel	13 V	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G32	1	2.65 mm	7.5 mm	Not Qualified		e0	30	220	11 mm
MC33SA0528ACR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1		5 V			FLATPACK, LOW PROFILE				4.8 V	.8 mm	125 Cel		-40 Cel		QUAD	S-PQFP-G32	3	1.6 mm	7 mm				30	250	7 mm
MC33972TEW	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		3.3 V	26 V		SMALL OUTLINE, SHRINK PITCH		8 V		3.1 V	.65 mm	125 Cel	13 V	-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	11 mm
MC33975TEK	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		5 V			SMALL OUTLINE				3 V	.65 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified		e3	40	260	10 mm
MC34978EKR2	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	105 Cel		-40 Cel	TIN	DUAL	R-PDSO-G32	3	2.45 mm	7.5 mm			e3			11 mm
MC34978AESR2	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	105 Cel		-40 Cel	TIN	QUAD	S-XQCC-N32	3	.9 mm	5 mm			e3	40	260	5 mm
MC33975AEKR2	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified					11 mm
MC33978AES	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	125 Cel		-40 Cel	TIN	QUAD	S-XQCC-N32	3	.9 mm	5 mm			e3	40	260	5 mm
MFRC52202HN1/TRAYB	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm						5 mm
MFRC52201HN1/TRAYB	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
MFRC52202HN1/TRAYBM	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm						5 mm
MFRC52201HN1/TRAYBM	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel		-25 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
CY8CMBR2110-24LQXI	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	CMOS	3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.71 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	.6 mm	5 mm			e4	30	260	5 mm
CY8CMBR2110-24LQXIT	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	CMOS	3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.71 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	.6 mm	5 mm			e4			5 mm
PI3USB32212ZLEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.63 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.12X.24,16			2.97 V	.4 mm	85 Cel		-40 Cel		QUAD	R-XQCC-N32		.8 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
PI3USB32212ZLEX+DA	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	3.63 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.12X.24,16			2.97 V	.4 mm	85 Cel		-40 Cel		QUAD	R-XQCC-N32		.8 mm	3 mm						6 mm
MAX9406ETJ+TG071	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	4	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm			e3	30	260	5 mm
MAX3869EHJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V		3.3/5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3786UTJ-T	Maxim Integrated	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel		0 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e0			5 mm
MAX3261ECJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1		5 V			FLATPACK, THIN PROFILE, FINE PITCH				4.75 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3863ETJ+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3.15 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
MAX3261ECJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1	BIPOLAR	5 V		5	FLATPACK, THIN PROFILE, FINE PITCH	QFP32,.35SQ,32		Display Drivers	4.75 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3667ECJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32		Display Drivers	3.135 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e0			7 mm
MAX3261CCJ-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1	BIPOLAR	5 V		5	FLATPACK, THIN PROFILE, FINE PITCH	QFP32,.35SQ,32		Display Drivers	4.75 V	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3869EGJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		3.3 V		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3667ECJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32		Display Drivers	3.135 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e0			7 mm
MAX3668EHJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3261ECJ+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1		5 V			FLATPACK, THIN PROFILE, FINE PITCH				4.75 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e3			5 mm
MAX3667ECJ+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32		Display Drivers	3.135 V	.8 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e3	30	260	7 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.