32 Other Function Interface ICs 226

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADN2841ACP-32-REEL7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		5 V		5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e0		240	5 mm
ADN2847ACP-32-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32		1 mm	5 mm	Not Qualified	e0			5 mm
ADN2847ACPZ-32	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3			5 mm
ADN2848ACPZ-32-RL7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3			5 mm
ADN2847ACP-32-RL7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e0		240	5 mm
ADN2841ACP-32-RL7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		5 V		5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32		1 mm	5 mm	Not Qualified	e0			5 mm
HMC677LP5TR	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	5 V		+-5	-5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Other Interface ICs	4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
ADN2841ACPZ-32	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		5 V		5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3	30	260	5 mm
HMC677LP5RTR	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			BICMOS	5 V		+-5	-5 V	CHIP CARRIER	LCC32,.2SQ,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N32				Not Qualified
ADN2841ACP-32	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		5 V		5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e0		240	5 mm
ADN2843CHIPSET	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	DIE	UNSPECIFIED	UNSPECIFIED	YES	3.6 V	1		3.3 V		3.3		UNCASED CHIP	LCC32,.2SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
ADN2843CHIPSET-B	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	DIE	UNSPECIFIED	UNSPECIFIED	YES	3.6 V	1		3.3 V		3.3		UNCASED CHIP	LCC32,.2SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	UPPER	X-XUUC-N				Not Qualified	e0
ADN2841ACPZ-32-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		5 V		5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3			5 mm
ADN2841ACPZ-32-RL7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		5 V		5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3	30	260	5 mm
HMC677LP5ERTR	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			BICMOS	5 V		+-5	-5 V	CHIP CARRIER	LCC32,.2SQ,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N32				Not Qualified
MAX3286CHJ+T	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				FLATPACK, THIN PROFILE, FINE PITCH				3 V	.5 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified	e3			5 mm
MAX3869EHJ+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V		3.3/5		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX3296CHJ+T	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V				FLATPACK, THIN PROFILE, FINE PITCH				3 V	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified	e3			5 mm
MAX3261CMJ	Analog Devices	INTERFACE CIRCUIT		GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES		1		5 V				FLATPACK, THIN PROFILE, FINE PITCH					.5 mm				TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified	e0			5 mm
MAX3955ETJ+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.47 V	1	BICMOS	3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.85 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm		e3	30	260	5 mm
MAX3737ETJ+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX3737ETJ+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
TZA3001BHL	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3041AHL-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3001AHL	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V		5		FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
TZA3041BHL-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3001AHL/C4	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3001BHL/C1	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
TZA3031AHL	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V		5		FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
TZA3031AHL-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3041BHL	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V		5		FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3041AHL/C4	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES		1						FLATPACK, LOW PROFILE, FINE PITCH					.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3050VH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	VBCC	SQUARE	PLASTIC/EPOXY	YES	3.47 V	1	BICMOS	3.3 V		3.3		CHIP CARRIER, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified	e4			5 mm
TZA3001BHL/C4	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
935263838118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES		1						FLATPACK, LOW PROFILE, FINE PITCH					.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
935263834118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES		1						FLATPACK, LOW PROFILE, FINE PITCH					.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3010BVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	YES	3.47 V	1	BICMOS	3.3 V	3.47 V	3.3,3.3/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3.14 V	Display Drivers	3.14 V	.5 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified	e4			5 mm
935263835118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3041BHL/C4	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES		1						FLATPACK, LOW PROFILE, FINE PITCH					.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3001BHL-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3047BVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HBCC	SQUARE	PLASTIC/EPOXY	YES	3.47 V	1	BICMOS	3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified	e4			5 mm
935263839118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES		1						FLATPACK, LOW PROFILE, FINE PITCH					.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3031BHL-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3001AHL-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3031BHL	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3031AHL/C4	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TZA3047AVH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	32	HBCC	SQUARE	PLASTIC/EPOXY	YES	3.47 V	1	BICMOS	3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified	e4			5 mm
TZA3041AHL	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V		5		FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20		Display Drivers	4.5 V	.5 mm	85 Cel		-40 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.