TSSOP Other Function Interface ICs 687

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC4302IMS-1#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
LTC4301LIMS8#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC6957IMS-2#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm	4.039 mm			e3		260	3 mm
LTC4302IMS-2#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4302IMS-1#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4302CMS-1#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302CMS-2#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4304IMS#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4303CMS8#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302IMS-2	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302IMS-2#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4304IMS#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4303CMS8	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4303IMS8#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4302CMS-2	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4301LCMS8	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302CMS-1#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
LTC4315CMS#TRPBF	Analog Devices	BUS BUFFERS		GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			2.9 V	.65 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G12	1	1.1 mm	3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4.039 mm
LTC4302CMS-1	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302IMS-1#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC6957IMS-4#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm	4.039 mm			e3			3 mm
LTC4301LIMS8#TRPBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC6957IMS-3#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm	4.039 mm			e3			3 mm
LTC4303IMS8	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4307CMS8#TR	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	11 mA	3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs		.635 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8				Not Qualified		e0
LTC4301LCMS8#TR	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4302IMS-1	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4315IMS#PBF	Analog Devices	BUS BUFFERS		GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			2.9 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G12	1	1.1 mm	3 mm		COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS	e3	30	260	4.039 mm
LTC4301LCMS8#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4303IMS8#TR	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC6957HMS-2#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm	4.039 mm			e3	30	260	3 mm
LTC4302CMS-2#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4301LIMS8#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3023EUD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS		2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
MAX3004EUP+T	Analog Devices		INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS				1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs		.635 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1			Not Qualified		e3	30	260
MAX6618AUB+T	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3013EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	8	BICMOS		3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.65 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX3006EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX3008EUP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX6618AUB+	Analog Devices	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		Other Interface ICs	3 V	.5 mm	120 Cel		-20 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3026EUD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS		2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX253EUA+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS		5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				4.5 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e3	30	260	3 mm
MAX3003EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX3004EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX1841EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			1.8 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.4 V		1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3390EEUD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS		1.8 V	5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e3	30	260	5 mm
MAX3289CUE+T	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				3 V	.65 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3			5 mm
MAX3010EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.