TSSOP Other Function Interface ICs 687

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Maximum Output Current	No. of Functions	No. of Channels	Technology	Screening Level	No. of Bits	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Output Characteristics	Minimum Operating Temperature	Driver No. of Bits	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCA9507DP-T	NXP Semiconductors		INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES									5 mA			3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs		.635 mm	85 Cel			-40 Cel			DUAL	R-PDSO-G8				Not Qualified
PCA9601DP,118	NXP Semiconductors	BUS BUFFERS		GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	15 V		1							5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19			2.5 V	.65 mm	85 Cel			-40 Cel			DUAL	S-PDSO-G8	1	1.1 mm	3 mm				30	260	3 mm
SN65CML100DGKRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1		CMOS			EIA-644; TIA-644		3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Line Driver or Receivers	3 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
SN74GTL2010PWE4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		CMOS					3.3 V	2.64 V	2.5,3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	2.36 V	Other Interface ICs	3 V	.65 mm	85 Cel	2.5 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
ISL33001IUZ	Renesas Electronics	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					2.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19			2.3 V	.65 mm	85 Cel			-40 Cel		MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e3	30	260	3 mm
TIR1000PWR	Texas Instruments	INTERFACE CIRCUIT		GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V		1	1	CMOS					3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25			2.7 V	.65 mm	70 Cel			0 Cel			DUAL	R-PDSO-G8		1.2 mm	3 mm						4.4 mm
PCA9702PW,118	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.5 V	.65 mm	125 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	5 mm
SN74AUP1T98DCKT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1				1		.0009 mA	3.3 V		1.2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			Other Interface ICs	2.3 V	.65 mm	85 Cel		PUSH-PULL	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	NOT SPECIFIED	260	2 mm
GTL2012DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1							3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	3 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
MAX3001EAUP/V+T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		BICMOS	AEC-Q100					5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.65 V		1.2 V	.65 mm	125 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm			e3	30	260	6.5 mm
PCA9616PW,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3 V		.8 V	.65 mm	85 Cel	5 V		-40 Cel			DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm				30	260	5 mm
GTL2003PW	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1							3.3 V	2.64 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.36 V		3 V	.65 mm	85 Cel	2.5 V		-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
GTL2003PW,112	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		CMOS					3.3 V	2.64 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	2.36 V	Other Interface ICs	3 V	.65 mm	85 Cel	2.5 V		-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
LTC4303CMS8#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	70 Cel			0 Cel		MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX13003EEUE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		6		BICMOS					1.65 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel			-40 Cel		TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0		245	5 mm
MAX13003EEUE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		BICMOS					3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
MAX13003EEUE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1		CMOS					3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel			-40 Cel		TIN LEAD	DUAL	S-PDSO-G16	1	1.1 mm	5 mm	Not Qualified		e0			5 mm
MAX13003EEUE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		BICMOS					1.2 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	1.5 V	Other Interface ICs	.9 V	.65 mm	85 Cel	1.65 V		-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
PCA9512ADP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1						3.6 mA	3.3 V	5.5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.7 V	Other Interface ICs	2.7 V	.65 mm	85 Cel	3.3 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9574PW,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		CMOS					2.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				1.1 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	5 mm
TPL7407LPW	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	40 V	.5 A	1									1.5/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Peripheral Drivers	8.5 V	.65 mm	125 Cel			-40 Cel	7		DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified					5 mm
2N7001TQDCKRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1			AEC-Q100	1		.014 mA	1.8 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08			1.65 V	.65 mm	125 Cel		PUSH-PULL	-40 Cel		MATTE TIN	DUAL	R-PDSO-G5	1	1.1 mm	1.25 mm			e3	30	260	2 mm
ADG3123BRUZ-REEL7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					2.7 V		2.5/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	2.3 V	.65 mm	85 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified		e3		260	6.5 mm
LTC6957IMS-1#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	12	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.45 V		1		CMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP12,.19			3.15 V	.65 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G12	1	1.1 mm	4.039 mm			e3			3 mm
MAX3371EXT	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES					BICMOS							1.8/5,3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		Other Interface ICs		.635 mm	85 Cel			-40 Cel			DUAL	R-PDSO-G6				Not Qualified
MAX3371EXT+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		BICMOS					1.8 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.5 V		1.6 V	.65 mm	85 Cel	3.3 V		-40 Cel		NICKEL GOLD PALLADIUM	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm				30	260	2 mm
SN74AUP1T97DCKRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1				1		.0009 mA	2.5 V		1.2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			Other Interface ICs	2.3 V	.65 mm	85 Cel		PUSH-PULL	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	30	260	2 mm
TCA9803DGKT	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1							1.8 V	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	1.65 V		.8 V	.65 mm	125 Cel			-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		ALSO HAVE 1.65 MIN INPUT	e4	30	260	3 mm
LTC4304CMS#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel			0 Cel		MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4304CMS#TRPBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel			0 Cel		MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX31722MUA+T	Analog Devices	INTERFACE CIRCUIT	MILITARY	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.7 V		1							3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				1.7 V	.65 mm	125 Cel			-55 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3297CUE+	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		BIPOLAR					3.3 V		3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel			0 Cel		TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
NCN6001DTBR2	Onsemi	INTERFACE CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1							3 V			SMALL OUTLINE				2.7 V	.65 mm	85 Cel			-25 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified		e4		260	6.5 mm
NCP1090DBRG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	57 V		1										SMALL OUTLINE				0 V	.65 mm	85 Cel			-40 Cel			DUAL	R-PDSO-G8	2	1.1 mm	3 mm	Not Qualified					4.4 mm
NTB0102DP-Q100H	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						AEC-Q100						1.2/3.6,1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16		Other Interface ICs		.635 mm	125 Cel			-40 Cel			DUAL	R-PDSO-G8	1			Not Qualified				260
P2N7001TQDCKRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1			AEC-Q100	1		.014 mA	1.8 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP5/6,.08			1.65 V	.65 mm	125 Cel			-40 Cel			DUAL	R-PDSO-G5		1.1 mm	1.25 mm						2 mm
PCA9515APWT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		2		BICMOS					3 V	3.6 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25	2.3 V	Line Driver or Receivers	2.3 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	1.2 mm	3 mm	Not Qualified		e4	30	260	4.4 mm
PCA9518PW,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		BICMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25			3 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
PCA9518PW/G,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		BICMOS					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25			3 V	.65 mm	85 Cel			-40 Cel			DUAL	R-PDSO-G20		1.1 mm	4.4 mm						6.5 mm
PI4ULS3V204LEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1							1.2 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25			1.1 V	.65 mm	85 Cel			-40 Cel			DUAL	R-PDSO-G14		1.2 mm	4.4 mm		IT ALSO HAS 1.1 TO 3.6V SUPPLY VOLTAGE		NOT SPECIFIED	NOT SPECIFIED	5 mm
SN74AUP1T57DCKRE4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		CMOS					2.5 V		1.2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		Other Interface ICs	2.3 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	30	260	2 mm
SN74AUP1T57DCKRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		CMOS					2.5 V		1.2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		Other Interface ICs	2.3 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	30	260	2 mm
SN74AUP1T97DCKR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1				1		.0009 mA	2.5 V		1.2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			Other Interface ICs	2.3 V	.65 mm	85 Cel		PUSH-PULL	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	30	260	2 mm
SN74AUP1T97DCKRE4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1		CMOS					2.5 V		1.2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		Other Interface ICs	2.3 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	30	260	2 mm
TXB0101DCKT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1				1		.008 mA	1.5 V	5.5 V	1.2/3.6,1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	1.8 V	3-STATE	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	NOT SPECIFIED	260	2 mm
TXB0101DCKTG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1				1		.008 mA	1.5 V	5.5 V	1.2/3.6,1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	1.8 V	3-STATE	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	NOT SPECIFIED	260	2 mm
FXGL2014MTCX	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		1							3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25			3 V	.65 mm	85 Cel			-40 Cel		MATTE TIN	DUAL	R-PDSO-G14	1	1.2 mm	4.4 mm			e3	30	260	5 mm
GTL2002DC-G	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		1		MOS								SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20			0 V	.5 mm	85 Cel			-40 Cel			DUAL	R-PDSO-G8		1 mm	2 mm						2.3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.