VFBGA Other Function Interface ICs 230

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NVT4857UK	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1		3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.9 V	.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B20		.53 mm	1.7 mm						2.1 mm
NVT4556AUK	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1		1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.55 V	.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B12		.412 mm	1.205 mm						1.605 mm
935371405118	NXP Semiconductors	INTERFACE CIRCUIT		BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1		3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16			.8 V	.4 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B42	1	1 mm	2.6 mm			e1			3 mm
IP4855CX25/C	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		2.9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.5 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		.55 mm	2.05 mm						2.05 mm
IP4855CX25	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		2.9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.5 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		.5 mm	2.05 mm						2.05 mm
IP4855CX25,14	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		2.9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.5 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		.5 mm	2.05 mm						2.05 mm
IP4856CX25/C	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		2.9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.8 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		.55 mm	2.05 mm						2.05 mm
IP4855CX25/P	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		4 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.5 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		.5 mm	2.04 mm						2.04 mm
IP4856CX25	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		2.9 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.8 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		.5 mm	2.05 mm						2.05 mm
IP4855CX25Z	Nexperia	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.1 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		.5 mm	2.04 mm		VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5		NOT SPECIFIED	NOT SPECIFIED	2.04 mm
IP4855CX25/CAZ	Nexperia	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.1 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		.5 mm	2.04 mm		VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5		NOT SPECIFIED	NOT SPECIFIED	2.04 mm
MAX8521EBX-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B36	1	.67 mm	3.06 mm	Not Qualified		e0			3.06 mm
MAX8521EBX	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B36	1	.67 mm	3.06 mm	Not Qualified		e0			3.06 mm
MAX7360EWX+T	Maxim Integrated	INTERFACE CIRCUIT		BALL	36	VFBGA	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6x6,16			1.62 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-XBGA-B36		.69 mm	2.57 mm						2.57 mm
MAX3005EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3004EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX14591EWA+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.2 V	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V		.9 V	.4 mm	85 Cel	3 V	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B8	1	.69 mm	.837 mm			e2	30	260	1.627 mm
MAX3375EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX13002EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6	BICMOS	1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX13032EEBE+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e1	30	260	2.02 mm
MAX3010EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V	8	BICMOS			1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B20	1	.67 mm		Not Qualified		e0
MAX3975UBA-T	Maxim Integrated	INTERFACE CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,20		Display Drivers	2.97 V	.5 mm	85 Cel		0 Cel	TIN LEAD	BOTTOM	S-PBGA-B25	1	.67 mm	2.54 mm	Not Qualified		e0			2.54 mm
MAX3803UBP-T	Maxim Integrated	INTERFACE CIRCUIT	OTHER	BALL	14	VFBGA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1		3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				3 V	.5 mm	85 Cel		0 Cel	TIN LEAD	BOTTOM	R-XBGA-B14	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3601CWO+	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.9 V	1		1.8 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,20		Display Drivers	1.7 V	.5 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B42		.69 mm	3.395 mm	Not Qualified	IT ALSO REQUIRES 3.3V				3.515 mm
MAX3006EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3393EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			2.02 mm
MAX3340EEBE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V	3.6 V	5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	1.8 V	Other Interface ICs	4 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0		245	2.02 mm
MAX13003EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6	BICMOS	1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX14595EWA+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.2 V	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V		.9 V	.4 mm	85 Cel	3 V	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B8	1	.69 mm	.837 mm			e2	30	260	1.627 mm
MAX3392EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			2.02 mm
MAX13032EEBE+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2 mm	Not Qualified		e1	30	260	2 mm
MAX3012EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V	8	BICMOS			1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B20	1	.67 mm		Not Qualified		e0
MAX3379EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			2.02 mm
MAX3803UBP	Maxim Integrated	INTERFACE CIRCUIT	OTHER	BALL	14	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1		3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				3 V	.5 mm	85 Cel		0 Cel	TIN LEAD	BOTTOM	R-PBGA-B14	1	.67 mm	2.03 mm			e0			2.54 mm
MAX3011EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX13000EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6	BICMOS	1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16		.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX3002EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V		1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm			e0			2.54 mm
MAX3023EBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e0			2.02 mm
MAX13034EEBE+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B16		.67 mm	2.02 mm	Not Qualified		e3			2.02 mm
MAX3010EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3372EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX3008EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V	8	BICMOS			1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B20	1	.67 mm		Not Qualified		e0
MAX13033EEBE+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B16		.67 mm	2.02 mm	Not Qualified		e3			2.02 mm
MAX3023EBC+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e1	30	260	2.02 mm
MAX13013EBT-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B6	1	.67 mm	1.75 mm	Not Qualified		e0		245	1.98 mm
MAX3004EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified				245	2.54 mm
MAX3011EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V	8	BICMOS			1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B20	1	.67 mm		Not Qualified		e0
MAX3009EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V	8	BICMOS			1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B20	1	.67 mm		Not Qualified		e0

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.