VFBGA Other Function Interface ICs 230

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

TXS0104EYZTR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

4

.01 mA

1.8 V

5.5 V

1.8/3.3,2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

2.3 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

3.3 V

3-STATE

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B12

1

.625 mm

1.4 mm

Not Qualified

e1

NOT SPECIFIED

260

1.87 mm

TXS0104ENMNR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

4

.01 mA

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

.5 mm

85 Cel

3-STATE

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

2

1 mm

2 mm

ALSO REQUIRE SUPPLY FROM 2.3V TO 5.5V AND ESD VALUE 3B FOR PORT B

e1

30

260

2.5 mm

TXS0104EZXUR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

4

.01 mA

1.8 V

5.5 V

1.8/3.3,2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

2.3 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

3.3 V

3-STATE

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.61 mm

2 mm

Not Qualified

e1

30

260

2.5 mm

TXB0108YZPR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

8

.01 mA

1.5 V

5.5 V

1.2/3.6,1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

1.8 V

3-STATE

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B20

1

.5 mm

1.9 mm

Not Qualified

HTTP://WWW.TI.COM/LIT/ML/MXBG100B/MXBG100B.PDF

e1

NOT SPECIFIED

260

2.4 mm

SN65DSI83ZXHR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA64,9X9,20

1.65 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

3

1 mm

5 mm

30

260

5 mm

TXS0108ENMER

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

8

.008 mA

1.65 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.4 V

.5 mm

85 Cel

3-STATE

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

2

1.6 mm

2.5 mm

e1

30

260

3 mm

TXS0108EZXYR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

8

.008 mA

2.5 V

1.2/3.6,1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

3-STATE

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

1

.61 mm

2.5 mm

Not Qualified

ALSO OPERATES WITH 1.65 TO 5.5 VOLT

e1

30

260

3 mm

SN65DSI84ZXHR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA64,9X9,20

1.65 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

3

1 mm

5 mm

30

260

5 mm

TXB0108YZPR2

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

8

.01 mA

1.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.2 V

.5 mm

85 Cel

3-STATE

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B20

1

.5 mm

1.888 mm

ALSO HAVE 1.65 TO 5.5 INPUT VOLTAGE

e1

30

260

2.388 mm

TXS0102YZPR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

2

.01 mA

1.8 V

5.5 V

1.8/3.3,2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA8,2X4,20

2.3 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

2.5 V

3-STATE

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B8

1

.5 mm

.9 mm

Not Qualified

e1

NOT SPECIFIED

260

1.9 mm

TXB0108NMER

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

8

.01 mA

1.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.2 V

.5 mm

85 Cel

3-STATE

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

2

.5 mm

1.888 mm

IT HAS 1.65 TO 5V PORT B SUPPLY VOLTAGE

e1

30

260

2.388 mm

TXB0104YZTR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

4

.01 mA

1.4 V

5.5 V

1.8/3.3,2.5/5

13.7 ns

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

1.8 V

3-STATE

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B12

1

.625 mm

1.37 mm

Not Qualified

TRUE

ALSO REQUIRED 1.8V SUPPLY NOMINAL

e1

NOT SPECIFIED

260

1.87 mm

TXS0104EGXUR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

5.5 V

1.8/3.3,2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

2.3 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.61 mm

2 mm

Not Qualified

e0

240

2.5 mm

SN65DSI86ZXHR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA64,9X9,20

1.14 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

3

1 mm

5 mm

30

260

5 mm

SN65DSI85ZXHR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

1

2

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA64,9X9,20

1.65 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

3

1 mm

5 mm

30

260

5 mm

TCA9406YZPR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

1.8 V

5.5 V

1.8/3.3,2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA8,2X4,20

2.3 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

2.5 V

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B8

1

.5 mm

.888 mm

Not Qualified

e1

NOT SPECIFIED

260

1.888 mm

LSF0204YZPR

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

4

.0125 mA

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

125 Cel

3-STATE

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B12

1

.5 mm

1.442 mm

e1

30

260

1.942 mm

TXB0102YZPR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

2

.008 mA

1.5 V

5.5 V

1.2/3.6,1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA8,2X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

1.8 V

3-STATE

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B8

1

.5 mm

.9 mm

Not Qualified

e1

NOT SPECIFIED

260

1.9 mm

TC358746AXBG

Toshiba

INTERFACE CIRCUIT

BALL

72

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.3 V

1

CMOS

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA72,9x9,16

1.1 V

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B72

1 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

4.5 mm

PCA9306YZTR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

2

2

LATCH

3 V

5.5 V

1.3 ns

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA8,2X4,20

1.8 V

Other Interface ICs

0 V

.5 mm

85 Cel

OPEN-DRAIN

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B8

1

.625 mm

.9 mm

Not Qualified

e1

NOT SPECIFIED

260

1.9 mm

MAX3378EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

LSF0102YZTR

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

8

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

4.5 V

1

2

.0125 mA

LATCH

3.3 V

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA8,2X4,20

1.8 V

1 V

.5 mm

125 Cel

3.3 V

OPEN-DRAIN

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B8

1

.625 mm

.888 mm

e1

NOT SPECIFIED

260

1.888 mm

TPD1S514-1YZR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.9 V

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3.5 V

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.625 mm

1.29 mm

e1

30

260

1.99 mm

ST6G3244MEBJR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

1

CMOS

1.8 V

5 V

1.8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

3 V

Level Translators

1.62 V

.4 mm

85 Cel

3.4 V

-40 Cel

BOTTOM

S-PBGA-B25

.65 mm

2 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

2 mm

TC358748XBG(EL)

Toshiba

INTERFACE CIRCUIT

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.3 V

1

CMOS

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,10X10,25

1.1 V

.65 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B80

1 mm

7 mm

7 mm

PI4ULS3V204GAEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.1 V

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.625 mm

1.37 mm

IT ALSO HAS 1.1 TO 3.6V SUPPLY VOLTAGE

NOT SPECIFIED

NOT SPECIFIED

1.87 mm

SN74AVC2T872YFPR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

2

.04 mA

1.2 V

3.6 V

1.2/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,16

1.1 V

Other Interface ICs

1.1 V

.4 mm

85 Cel

1.2 V

PUSH-PULL

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.5 mm

1.17 mm

Not Qualified

e1

30

260

1.57 mm

TUSB2E111YCGR

Texas Instruments

INTERFACE CIRCUIT

BALL

15

VFBGA

RECTANGULAR

UNSPECIFIED

YES

4.32 V

1

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA15,3X5,14

3 V

.35 mm

85 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B15

1

.5 mm

1.303 mm

e1

260

2.003 mm

IP4856CX25/CZ

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.7 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1

.55 mm

2.05 mm

VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6

30

260

2.05 mm

IP4855CX25/P,135

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

4 V

3/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

Level Translators

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

Not Qualified

2.04 mm

NVT4857UKAZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.9 V

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B20

.53 mm

1.7 mm

e2

30

260

2.1 mm

PCAL6534EVJ

NXP Semiconductors

INTERFACE CIRCUIT

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA42,6X7,16

.8 V

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B42

1

1 mm

2.6 mm

e1

30

260

3 mm

CCE4502CC3.3L-CSP

Renesas Electronics

DIGITAL I/O MODULE

BALL

24

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

HV-CMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA24,4X6,16

9 V

.4 mm

105 Cel

-40 Cel

BOTTOM

R-PBGA-B24

.5834 mm

1.98 mm

2.572 mm

LSF0204DYZPR

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

4

.0125 mA

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

125 Cel

3-STATE

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B12

1

.5 mm

1.442 mm

e1

30

260

1.942 mm

MAX13005EEBE+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

2.02 mm

MAX13005EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

245

2.02 mm

MAX3373EEBL-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA9,3X3,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

1.52 mm

NVT4857UKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.9 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

.53 mm

1.7 mm

2.1 mm

ADN8833ACBZ-R7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.66 mm

2.54 mm

e1

30

260

2.54 mm

MAX13030EEBE+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.67 mm

2 mm

Not Qualified

e1

30

260

2 mm

SN74AUP1T97YFPR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

1

.0009 mA

2.5 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Other Interface ICs

2.3 V

.4 mm

85 Cel

PUSH-PULL

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B6

1

.5 mm

.77 mm

Not Qualified

e1

30

260

1.17 mm

DRV2604YZFT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B9

1

.625 mm

1.44 mm

e1

30

260

1.44 mm

TPD4S214YFFR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B12

1

.625 mm

1.39 mm

e1

30

260

1.69 mm

TXS0206YFPR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

4

.011 mA

1.2 V

1.2/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,16

Other Interface ICs

1.1 V

.4 mm

85 Cel

3-STATE

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B20

1

.5 mm

1.57 mm

Not Qualified

e1

30

260

1.97 mm

ADG3304BCBZ-REEL7

Analog Devices

INTERFACE CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

1.8 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.15 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.65 mm

1.61 mm

Not Qualified

e1

260

2.01 mm

ADG3308BCBZ-1-RL7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

1.8 V

5.5 V

1.2/5,1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.15 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

1

.65 mm

2 mm

Not Qualified

e1

260

2.5 mm

MAX3002EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3002EBP+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e1

30

260

2.54 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.