VFBGA Other Function Interface ICs 230

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Interface Standard	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3024EBC-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS		2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e0			2.02 mm
MAX14839GWC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	1	BICMOS		24 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				4.75 V	.5 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.885 mm			e1	30	260	2.215 mm
MAX13042EEBC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS		1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e1	30	260	2.12 mm
MAX3020EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS		1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX14838GWC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	1	BICMOS		24 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				7 V	.5 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.885 mm			e1	30	260	2.215 mm
MAX3018EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS		1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3017EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS		1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel		BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified				245	2.54 mm
MAX13015EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS		2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3016EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS		1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX13004EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS		3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX3014EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS		1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3028EBC-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS		2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e0			2.02 mm
MAX13002EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS		3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX13017EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS		2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3019EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS		1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX13016EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS		2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX13042EEBC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS		1.8 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.2 V		1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm			e1	30	260	2.12 mm
MAX13003EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS		3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX3025EBC-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS		2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e0			2.02 mm
MAX3002EBP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS			5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V		1.2 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm			e1	30	260	2.54 mm
MAX3026EBC-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS		2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e0			2.02 mm
MAX3015EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS		1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX14839GWC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	1	BICMOS		24 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				4.75 V	.5 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.885 mm			e1	30	260	2.215 mm
MAX13030EEBE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS		1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e1	30	260	2.02 mm
MAX14838GWC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	1	BICMOS		24 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				7 V	.5 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.885 mm			e1	30	260	2.215 mm
MAX3022EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS		1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX7304EWA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS		3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		Display Drivers	1.62 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25	1	.69 mm	2.09 mm	Not Qualified					2.09 mm
MAX13035EEBE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS		1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e1	30	260	2.02 mm
LC898122AXA-VH	Onsemi	INTERFACE CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V		2.6 V	.4 mm	85 Cel	2.8 V	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	.45 mm	1.99 mm		IT ALSO OPERATES AT 3V	e1	30	260	2.59 mm
LC898123AXC-VH	Onsemi	INTERFACE CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		2.8 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V		2.6 V	.4 mm	85 Cel	2.8 V	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B35	1	.45 mm	2.3 mm		IT ALSO OPERATES AT 3V	e1	30	260	3.39 mm
LC898111AXB-MH	Onsemi	INTERFACE CIRCUIT		BALL	48	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V		2.6 V	.4 mm				TIN SILVER COPPER	BOTTOM	R-PBGA-B48	1	.69 mm	2.57 mm			e1	30	260	3.22 mm
LC898119XC-MH	Onsemi	INTERFACE CIRCUIT		BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V		2.6 V	.4 mm				TIN SILVER COPPER	BOTTOM	S-PBGA-B25	1	.675 mm	2 mm			e1	30	260	2 mm
NLSX0102FCT2G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	2			3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.5 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B8	1	.5 mm	.9 mm			e1	30	260	1.9 mm
FUSB380UCX	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		GENERAL PURPOSE	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,16			2.4 V	.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.612 mm	1.21 mm			e1	30	260	1.67 mm
NLSX0102FCT1G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	2			3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.5 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B8	1	.5 mm	.9 mm			e1	30	260	1.9 mm
FUSB380CUCX	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		GENERAL PURPOSE	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,16			2.4 V	.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B12	1	.612 mm	1.21 mm				NOT SPECIFIED	260	1.67 mm
LC898121XA-MH	Onsemi	INTERFACE CIRCUIT		BALL	40	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3 V	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V		2.6 V	.5 mm				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B40	1	.65 mm	2.44 mm			e1	30	260	3.94 mm
LC898123XC-VH	Onsemi	INTERFACE CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V		2.6 V	.4 mm	85 Cel	2.8 V	-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B35	1	.45 mm	2.3 mm		IT ALSO OPERATES AT 3V	e1	30	260	3.39 mm
LC898111AXA-MH	Onsemi	INTERFACE CIRCUIT		BALL	48	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V		2.6 V	.4 mm					BOTTOM	R-PBGA-B48		.33 mm	2.57 mm						3.22 mm
LC898122XA-VH	Onsemi	INTERFACE CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V		2.6 V	.4 mm	85 Cel		-30 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	.45 mm	1.99 mm			e1	30	260	2.59 mm
ST1G3234BBJR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		3 V		1.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA5,3X3,17/10		Other Interface ICs	1.4 V	.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		.714 mm	1.02 mm	Not Qualified					1.36 mm
ST4G3235BJR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	11	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS				1.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA11,3X7,17/10		Other Interface ICs	1.4 V	.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B11		.715 mm	1.41 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	2.04 mm
ST4G3234BJR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	11	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		1.65 V		1.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA11,3X7,17/10		Other Interface ICs	1.4 V	.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B11		.715 mm	1.41 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	2.04 mm
ST1G3234BJR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS		1.8 V		1.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA5,3X3,20/10		Other Interface ICs	1.4 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B5		.715 mm	1.02 mm	Not Qualified		e1			1.36 mm
NVT4556BUK	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1			1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.55 V	.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B12		.412 mm	1.205 mm						1.605 mm
NVT4555UKZ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1			1.2 V		1.2/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,16		Other Interface ICs	1.1 V	.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B12		.6 mm	1.19 mm	Not Qualified	IT ALSO REQUIRES 2.5 TO 5.5V		NOT SPECIFIED	NOT SPECIFIED	1.62 mm
NVT4556AUKZ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1			1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.55 V	.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B12		.412 mm	1.205 mm				NOT SPECIFIED	NOT SPECIFIED	1.605 mm
NVT4556BUKZ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1			1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.55 V	.4 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B12		.412 mm	1.205 mm				NOT SPECIFIED	NOT SPECIFIED	1.605 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.