RECTANGULAR Other Function Interface ICs 2,400+

Reset All
Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

LTC4315CMS#PBF

Analog Devices

BUS BUFFERS

GULL WING

12

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP12,.19

2.9 V

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G12

1

1.1 mm

3 mm

COMPATIBLE WITH I2C, I2C FAST MODE AND SMBUS

e3

30

260

4.039 mm

LTC4317IDHC#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.25 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-N16

1

.8 mm

3 mm

e3

260

5 mm

LTC6957HMS-1#TRPBF

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

12

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.45 V

1

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP12,.19

3.15 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G12

1

1.1 mm

4.039 mm

e3

3 mm

LTC6957HMS-3#TRPBF

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

12

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.45 V

1

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP12,.19

3.15 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G12

1

1.1 mm

4.039 mm

e3

3 mm

LTM2810HY-S#PBF

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

36

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

5 V

GRID ARRAY

1.62 V

1 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B36

2.31 mm

6.25 mm

NOT SPECIFIED

NOT SPECIFIED

22 mm

LTM2886IY-5S#PBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

32

LBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

5 V

GRID ARRAY, LOW PROFILE

BGA32,8X11,50

4.5 V

1.27 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B32

3

3.62 mm

11.25 mm

30

245

15 mm

MADR-009190-0001TR

M/a-com Technology Solutions

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

5 V

-5 V

SMALL OUTLINE

4.5 V

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

e3

260

9.9 mm

MAX3002EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3002EBP+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e1

30

260

2.54 mm

MAX3007EBP

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

Not Qualified

e0

MAX3131EAI

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

1

1.99 mm

5.29 mm

Not Qualified

e0

10.2 mm

MAX3131EAI+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.99 mm

5.29 mm

Not Qualified

e3

10.2 mm

MAX3377EETD+

Maxim Integrated

INDUSTRIAL

NO LEAD

14

SON

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

SMALL OUTLINE

SOLCC14,.12,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-N14

1

Not Qualified

e3

30

260

MAX3766EEP+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

Display Drivers

.635 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

1.73 mm

3.9 mm

Not Qualified

e3

30

260

8.65 mm

MAX3766EEP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

5

SMALL OUTLINE, SHRINK PITCH

SOP20,.25

Display Drivers

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.73 mm

3.9 mm

Not Qualified

e0

8.65 mm

MC33978AEK

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

2.45 mm

7.5 mm

e3

40

260

11 mm

NLSX4401MU1TCG

Onsemi

INTERFACE CIRCUIT

MILITARY

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

3.3 V

1.5/5.5

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

Other Interface ICs

1.5 V

.5 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N6

1

.55 mm

1 mm

Not Qualified

e4

30

260

1.45 mm

NLSX5004MUTAG

Onsemi

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

4.5 V

CHIP CARRIER, VERY THIN PROFILE

LCC12,.07X.08,16

.9 V

.4 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-PQCC-N12

1

.55 mm

1.7 mm

e4

30

260

2 mm

NLV9306USG

Onsemi

INTERFACE CIRCUIT

MILITARY

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TSSOP8,.12,20

Other Interface ICs

.5 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

.9 mm

2 mm

Not Qualified

e3

30

260

2.3 mm

PCA9510AD,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

6 mA

3.3 V

3/5

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.7 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PI6ULS5V9511AZWEX

Diodes Incorporated

BUS BUFFERS

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,20

2.7 V

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N8

.65 mm

2 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

SI8630BD-B-IS

Silicon Labs

DIGITAL ISOLATOR

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

AEC-Q100

3.3 V

SMALL OUTLINE

SOP16,.4

2.5 V

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

10.3 mm

ST8004CDR

STMicroelectronics

INTERFACE CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

1

3.3 V

SMALL OUTLINE

2.7 V

1.27 mm

85 Cel

-25 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G28

3

2.65 mm

7.5 mm

Not Qualified

ALSO OPERATES AT 5V SUPPLY

e4

30

250

17.9 mm

TCA4311ADR

Texas Instruments

BUS BUFFERS

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

5.5 V

SMALL OUTLINE

2.7 V

2.7 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

e4

30

260

4.9 mm

TLE9201SG

Infineon Technologies

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

12

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

3.5 V

1 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G12

3

2.6 mm

6.4 mm

7.5 mm

TXB0101DRLR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

FLAT

6

VSOF

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1

.008 mA

1.5 V

5.5 V

1.2/3.6,1.8/5

SMALL OUTLINE, VERY THIN PROFILE

TSSOP6,.06,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

1.8 V

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-F6

1

.6 mm

1.2 mm

Not Qualified

e4

30

260

1.6 mm

TXBN0304RSVR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

4

.01 mA

3.6 V

1.2/3.3

CHIP CARRIER, VERY THIN PROFILE

LCC16,.07X.1,16

.9 V

Other Interface ICs

.9 V

.4 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

R-PQCC-N16

1

.55 mm

1.8 mm

Not Qualified

e4

30

260

2.6 mm

TXBN0304RUTR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

4

.01 mA

3.6 V

1.2/3.3

CHIP CARRIER, VERY THIN PROFILE

LCC12,.07X.08,16

.9 V

Other Interface ICs

.9 V

.4 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

R-PQCC-N12

1

.55 mm

1.7 mm

Not Qualified

e4

30

260

2 mm

TXS0101DCKR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1

.0144 mA

1.8 V

1.8/3.3,2.5/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

Other Interface ICs

1.65 V

.65 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

1.1 mm

1.25 mm

Not Qualified

ALSO OPERATES WITH 2.3 TO 5.5 VOLT

e4

30

260

2 mm

TXS0206-29YFPRB

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

4

.011 mA

1.2 V

1.2/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,16

Other Interface ICs

1.1 V

.4 mm

85 Cel

3-STATE

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B20

1

.5 mm

2.2 mm

Not Qualified

e1

30

260

1.8 mm

FPC402RHUR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQCC-N56

2

.8 mm

5 mm

e3

30

260

11 mm

TIR1000PSG4

Texas Instruments

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

SMALL OUTLINE

SOP8,.3

2.7 V

1.27 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

2 mm

5.3 mm

30

260

6.2 mm

UC563DP

Texas Instruments

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

5 V

SMALL OUTLINE

4.75 V

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

CURRENT LIMIT AND THERMAL SHUTDOWN PROTECTION

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

ECL2537N

Texas Instruments

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

ECL

IN-LINE

DIP16,.3

Other Interface ICs

2.54 mm

70 Cel

0 Cel

DUAL

R-PDIP-T16

Not Qualified

TIR1000PS

Texas Instruments

INTERFACE CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

SMALL OUTLINE

SOP8,.3

2.7 V

1.27 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

2 mm

5.3 mm

30

260

6.2 mm

THS6101CPWP

Texas Instruments

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

5 V

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

4.5 V

4.5 V

.65 mm

70 Cel

5 V

0 Cel

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

7.8 mm

TPS2212IDBR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

BICMOS

3.3 V

SMALL OUTLINE, SHRINK PITCH

0 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

2 mm

5.3 mm

Not Qualified

e4

30

260

6.2 mm

THS6101IPWP

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

5 V

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

4.5 V

4.5 V

.65 mm

85 Cel

5 V

-40 Cel

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

7.8 mm

DS80PCI402SQ/NOPB

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

54

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

2.625 V

1

8

BICMOS

2.5 V

2.5,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC54,.2X.4,20

Line Driver or Receivers

2.375 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-XQCC-N54

2

.8 mm

5.5 mm

Not Qualified

ALSO OPERATES AT 3.3V SUPPLY

e3

30

260

10 mm

TIR1000IPWR

Texas Instruments

INTERFACE CIRCUIT

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

1

1

CMOS

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

2.7 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1.2 mm

3 mm

4.4 mm

SNJ553491HS

Texas Instruments

MILITARY

GULL WING

100

QFP

RECTANGULAR

CERAMIC

SEGMENT

YES

CMOS

38535Q/M;38534H;883B

5,14/26

FLATPACK

QFP100,.55X.8

0

80-BP

Other Interface ICs

.635 mm

125 Cel

-55 Cel

QUAD

R-XQFP-G100

Not Qualified

HPA02270YZPR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B8

1

.5 mm

.888 mm

ALSO REQUIRED VCCB = 2.3V TO 5.5V SUPPLY

e1

30

260

1.888 mm

UCC25710DW

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

18 V

1

12 V

SMALL OUTLINE

11 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

2.65 mm

7.5 mm

Not Qualified

e4

30

260

12.8 mm

CF4320HZKFR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

114

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

.01 mA

3.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B114

3

1.4 mm

5.5 mm

Not Qualified

e1

30

260

16 mm

SN75LVPE5421RUAR

Texas Instruments

INTERFACE CIRCUIT

NO LEAD

42

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

4

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

3 V

.5 mm

85 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

R-PQCC-N42

2

.8 mm

3.5 mm

e4

260

9 mm

FPC202RHUR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQCC-N56

2

.8 mm

5 mm

e3

30

260

11 mm

HPA02222DR

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE

3 V

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

2

1.75 mm

3.9 mm

e4

30

260

4.9 mm

DS250DF810ABVR

Texas Instruments

INTERFACE CIRCUIT

OTHER

BALL

135

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

8

GRID ARRAY

85 Cel

-10 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B135

3

e1

30

260

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.