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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX17079GTL+G0Y

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

QCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER

2.3 V

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N40

1

e3

30

260

MAX7301AGL

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

40

VQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

3.3 V

CHIP CARRIER, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N40

.85 mm

6 mm

Not Qualified

e0

6 mm

MAX7300ATI+

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N28

1

.8 mm

5 mm

e3

30

260

5 mm

MAX3296CGI

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2SQ,20

Display Drivers

3 V

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N28

1

.9 mm

5 mm

Not Qualified

e0

5 mm

MAX3667ECJ+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

3.465 V

1

BIPOLAR

3.3 V

3.3/5

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

Display Drivers

3.135 V

.8 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G32

1

1.6 mm

7 mm

Not Qualified

CAN ALSO OPERATE WITH A 5V SUPPLY

e3

7 mm

MAX1741EUB-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3 V

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

1.425 V

2.25 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

245

3 mm

MAX3261CCJ+

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

1

5 V

FLATPACK, THIN PROFILE, FINE PITCH

4.75 V

.5 mm

70 Cel

0 Cel

TIN

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e3

5 mm

MAX3863ETJ+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Display Drivers

3.15 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX7370AWA+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.62 V

1.62 V

.4 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

S-PBGA-B25

.69 mm

2.09 mm

NOT SPECIFIED

NOT SPECIFIED

2.09 mm

MAX3711ETG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

2.97 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-XQCC-N24

1

.8 mm

4 mm

e3

30

260

4 mm

MAX3341EEBE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

2/3.3,5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

4 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX3013EGP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

8

BICMOS

3.3 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

Other Interface ICs

1.65 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N20

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX3737ETJ

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX3669EHJ+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX7300ATI

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N28

1

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX3286CGI-T

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2SQ,20

Display Drivers

3 V

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N28

1

.9 mm

5 mm

Not Qualified

e0

5 mm

MAX3741HETE#G16

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-XQCC-N16

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3786UTJ

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

245

5 mm

MAX3656ETG-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

3 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e0

4 mm

MAX3601GTL+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1.9 V

1

1.8 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2SQ,16

Display Drivers

1.7 V

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N40

1

.8 mm

5 mm

Not Qualified

IT ALSO REQUIRES 3.3V

e4

30

260

5 mm

MAX3340EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

3.6 V

5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

1.8 V

Other Interface ICs

4 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX1840EUB-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

1.8 V

5.5 V

1.8,1.8/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

1.4 V

Other Interface ICs

1.7 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

245

3 mm

MAX1841EUB-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

1.8 V

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

1.4 V

1.7 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

245

3 mm

MAX13000EEUE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G16

1

1.1 mm

5 mm

Not Qualified

e0

5 mm

MAX3341EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

2/3.3,5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

4 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.65 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX3375EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn63Pb37)

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX3741HETE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

3 mm

MAX3735EGG-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

1 mm

4 mm

Not Qualified

e0

4 mm

MAX3783UCM-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

MAX3286CGI

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2SQ,20

Display Drivers

3 V

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N28

1

.9 mm

5 mm

Not Qualified

e0

5 mm

MAX3863EGJ

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Display Drivers

3.15 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.9 mm

5 mm

Not Qualified

e0

245

5 mm

MAX3394EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA9,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B9

Not Qualified

e0

MAX13002EEUE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G16

1

1.1 mm

5 mm

Not Qualified

e0

5 mm

MAX13037ATX+

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

26 V

1

BICMOS

14 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

6 V

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N36

1

.8 mm

6 mm

Not Qualified

e3

30

260

6 mm

MAX3850EGJ

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

VQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

3.6 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, VERY THIN PROFILE

LCC32,.2SQ,20

Display Drivers

3 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-CQCC-N32

1

1 mm

5 mm

Not Qualified

e0

245

5 mm

MAX3863E/D

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

44

DIE

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

UNCASED CHIP

3.15 V

85 Cel

-40 Cel

TIN LEAD

UPPER

S-XUUC-N44

1

Not Qualified

e0

MAX3735ETG+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

4 mm

MAX17079GTL+TG0Y

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

QCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER

2.3 V

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N40

1

e3

30

260

MAX3869ETJ+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.14 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

5 mm

MAX7300ATI-T

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N28

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX17120ETJ+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.2 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e4

30

260

5 mm

MAX13004EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX6956ATL+GH7

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N40

1

.8 mm

6 mm

6 mm

MAX3273ETG+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX7307ALB+

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

10

VSON

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

SMALL OUTLINE, VERY THIN PROFILE

SOLCC10,.08,16

Display Drivers

1.62 V

.4 mm

125 Cel

-40 Cel

GOLD NICKEL

DUAL

S-XDSO-N10

1

.8 mm

2 mm

Not Qualified

e4

30

260

2 mm

MAX24001TL+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.4 mm

95 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N40

1

.8 mm

5 mm

e3

30

260

5 mm

MAX7370ATG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.62 V

1.62 V

.4 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.85 mm

3.5 mm

e3

30

260

3.5 mm

MAX3634ETM

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e0

245

7 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.