SQUARE Other Function Interface ICs 1,418

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Maximum Output Current	No. of Functions	No. of Channels	Technology	Screening Level	No. of Bits	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Maximum Delay	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Output Characteristics	Minimum Operating Temperature	Driver No. of Bits	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Output Polarity	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TXS0104ERGYR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1				4		.01 mA	1.8 V	5.5 V	1.8/3.3,2.5/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14/18,.14SQ,20	2.3 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	3.3 V	3-STATE	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N14	2	1 mm	3.5 mm	Not Qualified			e4	NOT SPECIFIED	260	3.5 mm
PCA9517ADP/DG,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					1.2 V	5.5 V	3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.7 V	Line Driver or Receivers	.9 V	.65 mm	85 Cel	3.3 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4			3 mm
PCA9517ADP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					1.2 V	5.5 V	3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.7 V	Line Driver or Receivers	.9 V	.65 mm	85 Cel	3.3 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
TCA9548ARGERQ1	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.25 V		1	8		AEC-Q100								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.65 V	.5 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	2	1 mm	4 mm				e4	30	260	4 mm
PCA9617ADPJ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					.95 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.8 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			ALSO OPERATES WITH 2.2 V TO 5.5 V	e4	30	260	3 mm
TUSB4041IPAPR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V		1							1.1 V				FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH				.99 V	.5 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm			IT ALSO REQUIRES 3.3V	e4	30	260	10 mm
TCA9517DGKRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.25 V		1			AEC-Q100					5.25 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V		.9 V	.65 mm	125 Cel			-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			ALSO HAVE 2.7 MIN INPUT	e4	30	260	3 mm
TXS0104ERGYRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1				4		.01 mA	1.8 V	5.5 V	1.8/3.3,2.5/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14/18,.14SQ,20	2.3 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	3.3 V	3-STATE	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N14	2	1 mm	3.5 mm	Not Qualified			e4	NOT SPECIFIED	260	3.5 mm
PCA9306DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1							1.8 V	5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.3 V	Other Interface ICs	1.1 V	.65 mm	85 Cel	3.3 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
P82B96DP,118	NXP Semiconductors	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	15 V		2		BIPOLAR					5 V		2/15		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
TCA9509DGKR	Texas Instruments	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1							1.1 V	5.5 V	3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.7 V	Line Driver or Receivers	.9 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		ALSO OPERATES WITH 2.7 TO 5.5V	e4	30	260	3 mm
PCA9615DPZ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20			2.3 V	.5 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G10	1	1.1 mm	3 mm			ALSO REQUIRE VDDB SUPPLY FROM 3V TO 5.5V	e4	30	260	3 mm
PCA9615DPJ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1							3.3 V	5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	3 V		2.3 V	.5 mm	85 Cel	5 V		-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G10	1	1.1 mm	3 mm			ALSO REQUIRE VDDB SUPPLY FROM 3V TO 5.5V	e4	30	260	3 mm
TCA9517DGKR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		BICMOS					3.3 V	5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.7 V		.9 V	.65 mm	85 Cel	3.3 V		-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm				e4	30	260	3 mm
NCP1094MNRG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	57 V		1											SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				0 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	DUAL	S-PDSO-N10	3	1 mm	3 mm	Not Qualified			e3	30	260	3 mm
TCA9517ADGKR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		BICMOS					2.7 V	5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.7 V		.9 V	.65 mm	85 Cel			-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			ALSO REQUIRED 3.3V SUPPLY NOMINAL	e4	NOT SPECIFIED	260	3 mm
MFRC52202HN1,115	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1							3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20			2.5 V	.5 mm	85 Cel			-25 Cel			QUAD	S-PQCC-N32	1	1 mm	5 mm					30	260	5 mm
FXMA2102L8X	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		1							5 V		1.8/5		CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20		Other Interface ICs	1.65 V	.5 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N8	1	.55 mm	1.6 mm	Not Qualified			e4	30	260	1.6 mm
P82B96DPZ	NXP Semiconductors	BUS BUFFERS		GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	15 V		2		BIPOLAR					5 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19			2 V	.65 mm	85 Cel			-40 Cel			DUAL	S-PDSO-G8	1	1.1 mm	3 mm					NOT SPECIFIED	260	3 mm
PCA9517ADP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					1.2 V	5.5 V	3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.7 V	Line Driver or Receivers	.9 V	.65 mm	85 Cel	3.3 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
SN65DSI83ZXHR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		1							1.8 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,9X9,20			1.65 V	.5 mm	85 Cel			-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B64	3	1 mm	5 mm					30	260	5 mm
PCA9517DP,118	NXP Semiconductors	VOLTAGE LEVEL TRANSLATOR	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3.3 V		3/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Line Driver or Receivers	2.7 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
PM8805TR	STMicroelectronics	INTERFACE CIRCUIT		NO LEAD	43	HQCCN	SQUARE	UNSPECIFIED	YES			1											CHIP CARRIER, HEAT SINK/SLUG												QUAD	S-XQCC-N43		1 mm	8 mm					NOT SPECIFIED	NOT SPECIFIED	8 mm
PCA9306DP1,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		2							1.8 V	5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16	1.8 V	Other Interface ICs	1 V	.65 mm	85 Cel	2.5 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
SN65DSI84ZXHR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		1							1.8 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,9X9,20			1.65 V	.5 mm	85 Cel			-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B64	3	1 mm	5 mm					30	260	5 mm
LTC6820HUD#PBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		CMOS									CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	125 Cel			-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	3 mm				e3	30	260	3 mm
TUSB4041IPAP	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V		1							1.1 V				FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH				.99 V	.5 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm			IT ALSO REQUIRES 3.3V	e4	30	260	10 mm
SN6507DGQRQ1	Texas Instruments	INTERFACE CIRCUIT		GULL WING	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	36 V		1			AEC-Q100				24 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	TSSOP10,.20,20			3 V	.5 mm	125 Cel			-55 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G10	2	1.1 mm	3 mm				e4		260	3 mm
TUSB321AIRWBR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1							5 V				CHIP CARRIER, VERY THIN PROFILE				4.5 V	.4 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm				e4	30	260	1.6 mm
MFRC52201HN1,157	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1							3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	85 Cel			-25 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N32	1	1 mm	5 mm				e4	30	260	5 mm
PI4IOE5V6416ZDEX	Diodes Incorporated	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE		YES	5.5 V		1											CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20			1.65 V	.5 mm	85 Cel			-40 Cel			DUAL	S-XQCC-N24		.9 mm	4 mm							4 mm
ZIOL2401BI1R	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	36 V		1		CMOS									CHIP CARRIER				8 V		85 Cel			-40 Cel		TIN	QUAD	S-XQCC-N24	1		4 mm				e3		260	4 mm
ZIOL2401BI1W	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	36 V		1							24 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				8 V	.5 mm	85 Cel			-40 Cel		TIN	QUAD	S-XQCC-N24	1	.9 mm	4 mm				e3		260	4 mm
TXB0104RGYR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		1				4		.01 mA	1.4 V	5.5 V	1.2/3.6,1.8/5	13.7 ns	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14(UNSPEC)	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	1.8 V	3-STATE	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N14	2	1 mm	3.5 mm	Not Qualified	TRUE	ALSO REQUIRED 1.8V SUPPLY NOMINAL	e4	NOT SPECIFIED	260	3.5 mm
CY8CMBR3108-LQXIT	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		1		CMOS					3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.8 V	.5 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-XQCC-N16	3	.6 mm	3 mm			ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V	e4	30	260	3 mm
PCA9600DP/S911,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	15 V		2							5 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.5 V	.65 mm	85 Cel			-40 Cel			DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified						3 mm
LTC6820IUD#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		CMOS									CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	3 mm				e3	30	260	3 mm
LTC6957IDD-2#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V		1		CMOS			EIA-644-A; TIA-644-A		3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm				e3	30	260	3 mm
PCA9507DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1						5 mA	3.6 V		3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
MAX7301ATL+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		1		CMOS					3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	125 Cel			-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified			e3	30	260	6 mm
PCA9306AMUTCG	Onsemi	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	YES			1											CHIP CARRIER	LCC8,.06SQ,20		Other Interface ICs		.5 mm	125 Cel			-55 Cel		NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N8	1	.6 mm	1.6 mm	Not Qualified				30	260	1.6 mm
MAX3646ETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V		1		BIPOLAR					3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel			-40 Cel		TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified			e0			4 mm
MAX3646ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V		1		BIPOLAR					3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
PCA9517ADP/DG	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1		CMOS					3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.9 V	.65 mm	85 Cel			-40 Cel			DUAL	S-PDSO-G8		1.1 mm	3 mm			OPERATES WITH 2.7 V TO 5.5 V				3 mm
MAX4896ETP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	.1 A	1		BICMOS					3.6 V		3/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25		Peripheral Drivers	2.7 V	.65 mm	85 Cel			-40 Cel	8	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified			e3	30	260	5 mm
GTL2002DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1								3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	3 V		0 V	.65 mm	85 Cel	3.3 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
PCA9511ADP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		1						6 mA	3.3 V		3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
ADBMS6822WCCSZ-RL	Analog Devices	INTERFACE CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		2			AEC-Q100								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20			3 V	.5 mm	125 Cel			-40 Cel			QUAD	S-PQCC-N32		.8 mm	5 mm							5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.