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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

CCE451048QFN

Renesas Electronics

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

32 V

1

HV-CMOS

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

8 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

3

1 mm

7 mm

7 mm

CCE4510_QFN24

Dialog Semiconductor

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

32 V

1

HVCMOS

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

8 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

.8 mm

4 mm

4 mm

GTL2012DP,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Interface ICs

3 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

LT8500ETJ#PBF

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

BUTT

56

HVFLGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BIPOLAR

3.3 V

GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

SLGA56,11X11,22

3 V

.55 mm

125 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B56

.83 mm

6 mm

SEATED HT-CALCULATED

e3

6 mm

LTC4316IMS#TRPBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

10

SON

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE

2.25 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N10

1

1.1 mm

3 mm

e3

260

3 mm

SEC1210-CN-02

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

3.6 V

.65 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N24

1 mm

5 mm

5 mm

SN74AUP1T98DSFR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1

.0009 mA

2.5 V

2.5/3.3

SMALL OUTLINE, VERY THIN PROFILE

Other Interface ICs

2.3 V

.35 mm

85 Cel

PUSH-PULL

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

S-PDSO-N6

1

.4 mm

1 mm

Not Qualified

e4

NOT SPECIFIED

260

1 mm

HI-8429PCTF

Holt Integrated Circuits

INTERFACE CIRCUIT

MILITARY

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.13 V

.5 mm

125 Cel

-55 Cel

Matte Tin (Sn)

QUAD

S-PQCC-N40

3

1 mm

6 mm

e3

40

260

6 mm

LTC4303CMS8#TRPBF

Analog Devices

BUS BUFFERS

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX13003EEUE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G16

1

1.1 mm

5 mm

Not Qualified

e0

5 mm

MAX13005EEBE+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

2.02 mm

MAX13005EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

245

2.02 mm

MAX13032EETE+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

2.2 V

Other Interface ICs

1.62 V

.65 mm

85 Cel

3.3 V

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX13032EETE+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

2.2 V

Other Interface ICs

1.62 V

.65 mm

85 Cel

3.3 V

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX3373EEBL-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA9,3X3,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

1.52 mm

MAX3397EELA+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

SQUARE

UNSPECIFIED

YES

5.5 V

1

BICMOS

1.8 V

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

1.65 V

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

GOLD NICKEL

DUAL

S-XDSO-N8

1

.8 mm

2 mm

e4

30

260

2 mm

MAX3668EHJ+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX3668EHJ

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BIPOLAR

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

PCA9512ADP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.6 mA

3.3 V

5.5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.7 V

Other Interface ICs

2.7 V

.65 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

PCA9701HF,118

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

1

.8 mm

4 mm

e4

30

260

4 mm

SEC1210-CN-02-TR

Microchip Technology

INTERFACE CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.2SQ,25

3.6 V

.65 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N24

1 mm

5 mm

5 mm

TLE9260QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

3

.9 mm

7 mm

7 mm

TUSB321IRWBR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

CHIP CARRIER, VERY THIN PROFILE

4.5 V

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

AD9985AKSTZ-110

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

3.45 V

1

3.3 V

FLATPACK, LOW PROFILE

3.15 V

.65 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G80

3

1.6 mm

14 mm

Not Qualified

e3

260

14 mm

ADN2531ACPZ-R2

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

3 V

.5 mm

100 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

1

.9 mm

3 mm

Not Qualified

e3

3 mm

ADN2870ACPZ-RL

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

3 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

Not Qualified

e3

260

4 mm

ADN8833ACBZ-R7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.66 mm

2.54 mm

e1

30

260

2.54 mm

LMH1218RTWT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

2.625 V

1

2.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.375 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

4 mm

e3

30

260

4 mm

LT6911UXC

Lontium Semiconductor

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

64

SQUARE

UNSPECIFIED

YES

1

85 Cel

-40 Cel

QUAD

S-XQCC-N64

MAX13030EEBE+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.67 mm

2 mm

Not Qualified

e1

30

260

2 mm

MAX3735AETG-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e0

4 mm

MAX3735AETG+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX3795ETG

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e0

4 mm

MAX3795ETG+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MD1711K6-G

Microchip Technology

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

1.8 V

.5 mm

125 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

e3

7 mm

PI3EQX7841ZDEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.8 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

TCA9803DGKT

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

1.65 V

.8 V

.65 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

ALSO HAVE 1.65 MIN INPUT

e4

30

260

3 mm

TPS65193RGER

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

35 V

2

30 V

-10,30

-10 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Interface ICs

15 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

AD9985AKSTZ-140

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

3.45 V

1

3.3 V

FLATPACK, LOW PROFILE

3.15 V

.65 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G80

3

1.6 mm

14 mm

Not Qualified

e3

260

14 mm

ADN2525ACPZ-R2

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.53 V

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

3.07 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.9 mm

3 mm

Not Qualified

e3

260

3 mm

ADN2530YCPZ-500R7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.53 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.07 V

.5 mm

100 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N16

3

.9 mm

3 mm

Not Qualified

e3

260

3 mm

ADN2530YCPZ-R2

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.53 V

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

3.07 V

.5 mm

100 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.9 mm

3 mm

Not Qualified

e3

260

3 mm

ADN2531ACPZ-WP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

3 V

.5 mm

100 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

1

.9 mm

3 mm

Not Qualified

e3

3 mm

DRV2604YZFT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B9

1

.625 mm

1.44 mm

e1

30

260

1.44 mm

HDL6M05585

Ablic

ULTRASOUND PULSER

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

SOI-CMOS

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.4SQ,20

1.7 V

.5 mm

75 Cel

0 Cel

QUAD

S-XQCC-N68

.95 mm

10.2 mm

Operating Supply in Clock mode is 2.4V to 3.6V

260

10.2 mm

HI-8425PCMF

Holt Integrated Circuits

INTERFACE CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

SOI-CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

3 V

.5 mm

125 Cel

-55 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N40

3

.82 mm

6 mm

e4

40

260

6 mm

HI-8425PQTF

Holt Integrated Circuits

INTERFACE CIRCUIT

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

SOI-CMOS

3.3 V

FLATPACK

QFP44,.5SQ,32

3 V

.8 mm

125 Cel

-55 Cel

Matte Tin (Sn)

QUAD

S-PQFP-G44

3

2.7 mm

10 mm

e3

40

260

10 mm

IC-MB4QFN28-5X5

Ic-haus

INTERFACE CIRCUIT

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

4.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2SQ,20

3 V

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N28

1 mm

5 mm

5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.