SQUARE Other Function Interface ICs 1,418

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Screening Level	No. of Bits	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ISL34341INZ	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC	YES	1.9 V	1					GENERAL PURPOSE		1.8 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ			1.7 V	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.2 mm	10 mm		ALSO OPERATES WITH 3 AND 3.6 V SUPPLY	e3	30	260	10 mm
LT8500ITJ#PBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	BUTT	56	HVFLGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		BIPOLAR					3.3 V			GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	SLGA56,11X11,22			3 V	.55 mm	125 Cel			-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B56		.83 mm	6 mm		SEATED HT-CALCULATED	e3			6 mm
MAX3984UTE+T	Analog Devices	INTERFACE CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		BIPOLAR					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel			0 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	.8 mm	3 mm			e3	30	260	3 mm
SEC1210-CN-02NC-TR	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1							5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25			3.6 V	.65 mm	70 Cel			0 Cel	MATTE TIN	QUAD	S-XQCC-N24		1 mm	5 mm						5 mm
LMH1219RTWR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	2.625 V	1							2.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.375 V	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	.8 mm	4 mm			e3	30	260	4 mm
TLE92633BQXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	28 V	1			AEC-Q100				13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				5.5 V	.5 mm					TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm			e3			7 mm
MAX7360ETL+T	Analog Devices	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		BICMOS					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16			1.62 V	.4 mm	85 Cel			-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N40	1	.8 mm	5 mm			e3	30	260	5 mm
PM8055B-FEI	Microchip Technology	INTERFACE CIRCUIT		BALL	1408	BGA	SQUARE	PLASTIC/EPOXY	YES		1										GRID ARRAY											BOTTOM	S-PBGA-B1408
SN74AUP1T97DSFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1				1		.0009 mA	2.5 V		2.5/3.3	SMALL OUTLINE, VERY THIN PROFILE			Other Interface ICs	2.3 V	.35 mm	85 Cel		PUSH-PULL	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-N6	1	.4 mm	1 mm	Not Qualified		e4	30	260	1 mm
ZIOL2211BI1W	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	36 V	1		CMOS								CHIP CARRIER	LCC24,.16SQ,20			8 V	.5 mm	85 Cel			-40 Cel	Tin (Sn)	QUAD	S-XQCC-N24	1	.9 mm	4 mm			e3	NOT SPECIFIED	260	4 mm
FXWA9306L8X	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1							1.5 V	5.5 V	2/5	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	1.8 V	Other Interface ICs	1 V	.5 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N8	1	.55 mm	1.6 mm	Not Qualified	ALSO REQUIRED 1.8V TO 5.5V SUPPLY ON B SIDE	e4	30	260	1.6 mm
GTL2002DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1								5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	0 V		0 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	Also required VDREF 0 to 5.5V	e4	30	260	3 mm
GTL2002DP-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1								5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	0 V		0 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	Also required VDREF 0 to 5.5V	e4			3 mm
HCTL-2021-PLC	Broadcom	INTERFACE CIRCUIT	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					5 V		5	CHIP CARRIER	LDCC20,.4SQ		Other Interface ICs	4.5 V	1.27 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	3	4.572 mm	8.94 mm	Not Qualified		e3		260	8.94 mm
HI-8429PCI	Holt Integrated Circuits	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.47 V	1		CMOS					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3.13 V	.5 mm	85 Cel			-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-N40	3	1 mm	6 mm			e0			6 mm
LTC4316CMS#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					3.3 V			SMALL OUTLINE				2.25 V	.5 mm	70 Cel			0 Cel	MATTE TIN	DUAL	S-PDSO-N10		1.1 mm	3 mm			e3			3 mm
PCA9515BDGKR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		BICMOS					2.5 V	3.6 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.3 V	Line Driver or Receivers	2.3 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
ADBMS6821WCCSZ	Analog Devices	INTERFACE CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			AEC-Q100							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20			3 V	.5 mm	125 Cel			-40 Cel		QUAD	S-PQCC-N32		.8 mm	5 mm						5 mm
ADBMS6821WCCSZ-RL	Analog Devices	INTERFACE CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			AEC-Q100							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20			3 V	.5 mm	125 Cel			-40 Cel		QUAD	S-PQCC-N32		.8 mm	5 mm						5 mm
DS110DF111SQE/NOPB	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	2.625 V	1	2						2.5 V	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	3 V		2.375 V	.5 mm	85 Cel	3.3 V		-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	3	.8 mm	4 mm		ALSO OPERATES WITH 3V TO 3.6V	e3	30	260	4 mm
LTC6957IDD-4#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS					3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel			-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3			3 mm
MAX31723MUA+	Analog Devices	INTERFACE CIRCUIT	MILITARY	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.7 V	1							3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				1.7 V	.65 mm	125 Cel			-55 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
PCA9509AGM	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	YES	2 V	1							1.1 V			CHIP CARRIER, VERY THIN PROFILE				.8 V	.5 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	.5 mm	1.6 mm			e4			1.6 mm
PCA9509AGM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	YES	2 V	1							1.1 V			CHIP CARRIER, VERY THIN PROFILE				.8 V	.5 mm	85 Cel			-40 Cel		BOTTOM	S-PBCC-B8	1	.5 mm	1.6 mm				30	260	1.6 mm
PCA9509D,112	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					5 V		3/3.3	SMALL OUTLINE	SOP8,.25		Line Driver or Receivers	3 V	1.27 mm	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
PCA9509GM	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					5 V		3/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20		Line Driver or Receivers	3 V	.55 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N8	1	.5 mm	1.6 mm	Not Qualified		e4	30	260	1.6 mm
PCA9509PGM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	YES	1.5 V	1		CMOS					1.1 V	5.5 V		CHIP CARRIER, VERY THIN PROFILE		2.3 V		.8 V	.55 mm	85 Cel	3.3 V		-40 Cel		BOTTOM	S-PBCC-B8	1	.5 mm	1.6 mm				30	260	1.6 mm
ADN2848ACPZ-32	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1							3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3 V	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified		e3		260	5 mm
TUSB216RWBRQ1	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	6.5 V	1	1		AEC-Q100			36 mA	5 V			CHIP CARRIER, VERY THIN PROFILE	LCC12,.06SQ,16			2.3 V	.4 mm	105 Cel			-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm			e4		260	1.6 mm
DRV2604LDGSR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.2 V	1							3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2 V	.5 mm	85 Cel			-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G10	2	1.1 mm	3 mm			e4	30	260	3 mm
LTC6957IDD-1#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS			EIA-644-A; TIA-644-A		3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel			-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MADR-009150-TR1000	M/a-com Technology Solutions	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					GENERAL PURPOSE		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20			3 V	.5 mm	85 Cel			-40 Cel		QUAD	S-PQCC-N16		1 mm	3 mm						3 mm
PCA9507DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						5 mA	3.6 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
SN65CML100DGKRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		CMOS			EIA-644; TIA-644		3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Line Driver or Receivers	3 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
TLE9262BQXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	28 V	1			AEC-Q100				13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				5.5 V	.5 mm					TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm			e3			7 mm
TLE9262BQXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	28 V	1			AEC-Q100				13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				5.5 V	.5 mm					TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm			e3			7 mm
TLE92633BQXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	28 V	1			AEC-Q100				13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				5.5 V	.5 mm					TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm			e3			7 mm
ISL33001IUZ	Renesas Electronics	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS					2.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19			2.3 V	.65 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e3	30	260	3 mm
MAX3740AETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1		BIPOLAR					3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel			-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3740AETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1		BIPOLAR					3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
PI2EQX638XUBEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	18	HVQCCN	SQUARE	UNSPECIFIED	YES	1.9 V	1							1.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC18,.08SQ,16			1.7 V	.4 mm	85 Cel			-40 Cel		QUAD	S-XQCC-N18		.4 mm	2 mm				NOT SPECIFIED	NOT SPECIFIED	2 mm
IP4856CX25/CZ	Nexperia	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1							1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.7 V	.4 mm	85 Cel			-40 Cel		BOTTOM	S-PBGA-B25	1	.55 mm	2.05 mm		VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6		30	260	2.05 mm
CCE4510_QFN48	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	32 V	1		HVCMOS					24 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				8 V	.5 mm	85 Cel			-40 Cel		QUAD	S-XQCC-N48		1 mm	7 mm						7 mm
GTL2002GM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	2.64 V	1							2.5 V	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC8,.06SQ,20	3 V		2.36 V	.5 mm	85 Cel	3.3 V		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N8	1	.5 mm	1.6 mm	Not Qualified	ALSO OPERARTES AT 3.3V SUPPLY	e4	30	260	1.6 mm
IP4855CX25/P,135	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1							4 V		3/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		Level Translators	2.5 V	.4 mm	85 Cel			-40 Cel		BOTTOM	S-PBGA-B25		.5 mm	2.04 mm	Not Qualified					2.04 mm
SEC1210-CN-02NC	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1							5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25			3.6 V	.65 mm	70 Cel			0 Cel	MATTE TIN	QUAD	S-XQCC-N24		1 mm	5 mm						5 mm
ADN2531ACPZ-R7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1							3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	3 V	.5 mm	100 Cel			-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	.9 mm	3 mm	Not Qualified		e3			3 mm
CCE4502CC5L-QFN	Renesas Electronics	DIGITAL I/O MODULE		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	36 V	1		HV-CMOS					24 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20			9 V	.5 mm	105 Cel			-40 Cel		QUAD	S-XQCC-N24		.8 mm	4 mm						4 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.