SQUARE Other Function Interface ICs 1,418

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

IC-MB4QFN28-5X5ET-40/125

Ic-haus

INTERFACE CIRCUIT

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

4.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2SQ,20

3 V

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N28

1 mm

5 mm

5 mm

ISL58303DRTZ-T13

Renesas Electronics

INTERFACE CIRCUIT

NO LEAD

24

QCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER

MATTE TIN

QUAD

S-XQCC-N24

1

e3

30

260

LTC4304CMS#PBF

Analog Devices

BUS BUFFERS

COMMERCIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC4304CMS#TRPBF

Analog Devices

BUS BUFFERS

COMMERCIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC4316IDD#TRPBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

10

VSON

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

SMALL OUTLINE, VERY THIN PROFILE

2.25 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N10

1

.8 mm

3 mm

e3

30

260

3 mm

LTC6957IDD-3#TRPBF

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

3.45 V

1

CMOS

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC12,.12,18

3.15 V

.45 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

e3

260

3 mm

MAX17079GTL+TW

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

40

QCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER

2.3 V

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N40

1

e3

30

260

MAX31722MUA+T

Analog Devices

INTERFACE CIRCUIT

MILITARY

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.7 V

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.7 V

.65 mm

125 Cel

-55 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX7300ATL

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N40

1

.8 mm

6 mm

Not Qualified

e0

6 mm

MAX7300ATL+

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N40

1

.8 mm

6 mm

Not Qualified

e3

30

260

6 mm

MAX7300ATL+T

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

CMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N40

1

.8 mm

6 mm

Not Qualified

e3

30

260

6 mm

NB7VPQ702MMUTXG

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-XQCC-N16

1

.55 mm

3 mm

e3

260

3 mm

NCN6004AFTBR2G

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

5 V

1

3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

2.7 V

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G48

3

1.1 mm

7 mm

Not Qualified

e3

260

7 mm

PR5331C3HN/C370Y

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2.5 V

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

2

1 mm

6 mm

260

6 mm

TLE9262QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE9262QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

7 mm

TUSB322IRWBR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

CHIP CARRIER, VERY THIN PROFILE

4.5 V

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

ADN2525ACPZ-REEL7

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.53 V

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

3.07 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.9 mm

3 mm

Not Qualified

e3

260

3 mm

ADN2531ACPZ

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

100 Cel

-40 Cel

Tin (Sn)

QUAD

S-XQCC-N16

3

.9 mm

3 mm

e3

30

260

3 mm

DS110DF111SQ/NOPB

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

2.625 V

1

2

2.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

2.375 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

4 mm

ALSO OPERATES WITH 3V TO 3.6V

e3

30

260

4 mm

HI-8425PQI

Holt Integrated Circuits

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

SOI-CMOS

3.3 V

FLATPACK

QFP44,.5SQ,32

3 V

.8 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G44

3

2.7 mm

10 mm

10 mm

HI-8425PQT

Holt Integrated Circuits

INTERFACE CIRCUIT

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

SOI-CMOS

3.3 V

FLATPACK

QFP44,.5SQ,32

3 V

.8 mm

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G44

3

2.7 mm

10 mm

e0

30

240

10 mm

LV5609LP-TE-L-E

Onsemi

COMMERCIAL EXTENDED

NO LEAD

24

QCCN

SQUARE

PLASTIC/EPOXY

YES

BICMOS

3.3 V

3.3

CHIP CARRIER

LCC24,.13SQ,20

Other Interface ICs

.5 mm

80 Cel

-20 Cel

QUAD

S-PQCC-N24

1

Not Qualified

30

260

MAX3735AEGG

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

1 mm

4 mm

e0

4 mm

MAX3735EGG

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

1 mm

4 mm

Not Qualified

e0

4 mm

PCA9306DP-T

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.3 V

Other Interface ICs

1.1 V

.65 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

3 mm

PI4IOE5V96248ZLEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.27SQ,16

2.3 V

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

ST6G3237TBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1.16 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

ST6G3238BETBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

NICKEL GOLD

BOTTOM

S-PBGA-B25

3

1.16 mm

3 mm

Not Qualified

e4

30

260

3 mm

ST6G3238ETBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

UNSPECIFIED

YES

3.6 V

1

CMOS

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B25

3

1.16 mm

3 mm

Not Qualified

e1

30

260

3 mm

TIOL1125DRCR

Texas Instruments

INTERFACE CIRCUIT

NO LEAD

10

HVSON

SQUARE

PLASTIC/EPOXY

YES

36 V

1

24 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC10,.11,20

7 V

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N10

2

1 mm

.35 A

3 mm

LDO output range(V) : 5

e4

260

3 mm

TLE92623BQXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

MC33978AESR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

3

.9 mm

5 mm

e3

40

260

5 mm

ADG3308BCPZ-REEL

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

1.8 V

5.5 V

1.2/5,1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

1.65 V

Other Interface ICs

1.15 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

3

1 mm

4 mm

Not Qualified

e3

260

4 mm

BU21026MUV-E2

ROHM

INTERFACE CIRCUIT

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.65 V

.5 mm

QUAD

S-XQCC-N20

1 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

MAX14838GTC+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

HVSON

SQUARE

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

7 V

.5 mm

105 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N12

1

.8 mm

3 mm

e3

30

260

3 mm

PCA9508DP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.7 V

5.5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.7 V

Line Driver or Receivers

.9 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

PCA9508DP,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Line Driver or Receivers

2.7 V

.65 mm

85 Cel

-40 Cel

TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

2988117

Phoenix Contact

DIGITAL I/O MODULE

INDUSTRIAL

GULL WING

64

SQUARE

PLASTIC/EPOXY

YES

3.63 V

1

3.3 V

2.97 V

85 Cel

-40 Cel

QUAD

S-PQFP-G64

GTL2002GM

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC8,.06SQ,20

0 V

0 V

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N8

1

.5 mm

1.6 mm

Not Qualified

Also required VDREF 0 to 5.5V

e4

30

260

1.6 mm

MC34978AES

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

3

.9 mm

5 mm

e3

40

260

5 mm

PCA9514ADP,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

6 mA

3.3 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Interface ICs

2.7 V

.65 mm

85 Cel

-40 Cel

TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

PR5331C3HN/C360,518

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

40

HQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

2.5 V

85 Cel

-30 Cel

QUAD

S-PQCC-N40

HS4-3282-8

Renesas Electronics

INTERFACE CIRCUIT

NO LEAD

44

QCCN

SQUARE

CERAMIC

YES

5.25 V

1

CMOS

5 V

CHIP CARRIER

LCC44,.65SQ

4.75 V

1.27 mm

125 Cel

-55 Cel

TIN LEAD

QUAD

S-CQCC-N44

3.05 mm

16.535 mm

e0

16.535 mm

PI3EQX7502AIZDEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

1 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

TC358746XBG

Toshiba

INTERFACE CIRCUIT

BALL

72

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

BGA72(UNSPEC)

BOTTOM

S-PBGA-B72

IT HAS I/O SUPPLY 1.8 TO 3.6V

TC9595XBG(EL)

Toshiba

INTERFACE CIRCUIT

BALL

80

SQUARE

PLASTIC/EPOXY

YES

1

BOTTOM

S-PBGA-B80

AD9984AKCPZ-170

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1.9 V

1

CMOS

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.7 V

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N64

3

1 mm

9 mm

Not Qualified

e3

30

260

9 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.