Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Ic-haus |
INTERFACE CIRCUIT |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
4.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.2SQ,20 |
3 V |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-XQCC-N28 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
NO LEAD |
24 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
BUS BUFFERS |
COMMERCIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, VERY THIN PROFILE |
2.25 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
1 |
.8 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.45 V |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC12,.12,18 |
3.15 V |
.45 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
e3 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
CHIP CARRIER |
2.3 V |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.7 V |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.7 V |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
e0 |
6 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
CMOS |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.5 V |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N40 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N16 |
1 |
.55 mm |
3 mm |
e3 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 V |
1 |
3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-PQFP-G48 |
3 |
1.1 mm |
7 mm |
Not Qualified |
e3 |
260 |
7 mm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2.5 V |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
QUAD |
S-PQCC-N48 |
.9 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||||||||||||||||||||||||||||||
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
QUAD |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
CHIP CARRIER, VERY THIN PROFILE |
4.5 V |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N12 |
2 |
.4 mm |
1.6 mm |
e4 |
30 |
260 |
1.6 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.53 V |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Display Drivers |
3.07 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
3 |
.9 mm |
3 mm |
Not Qualified |
e3 |
260 |
3 mm |
|||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
100 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-XQCC-N16 |
3 |
.9 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
2 |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
3 |
.8 mm |
4 mm |
ALSO OPERATES WITH 3V TO 3.6V |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||
Holt Integrated Circuits |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SOI-CMOS |
3.3 V |
FLATPACK |
QFP44,.5SQ,32 |
3 V |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G44 |
3 |
2.7 mm |
10 mm |
10 mm |
||||||||||||||||||||||||||||||||||
Holt Integrated Circuits |
INTERFACE CIRCUIT |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
SOI-CMOS |
3.3 V |
FLATPACK |
QFP44,.5SQ,32 |
3 V |
.8 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G44 |
3 |
2.7 mm |
10 mm |
e0 |
30 |
240 |
10 mm |
||||||||||||||||||||||||||||||||
|
Onsemi |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
3.3 V |
3.3 |
CHIP CARRIER |
LCC24,.13SQ,20 |
Other Interface ICs |
.5 mm |
80 Cel |
-20 Cel |
QUAD |
S-PQCC-N24 |
1 |
Not Qualified |
30 |
260 |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
e0 |
4 mm |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.3 V |
Other Interface ICs |
1.1 V |
.65 mm |
85 Cel |
3.3 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
3 mm |
||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
2.3 V |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N56 |
.8 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1.8 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
1.16 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD |
BOTTOM |
S-PBGA-B25 |
3 |
1.16 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
TFBGA |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
CMOS |
3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.4 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-XBGA-B25 |
3 |
1.16 mm |
3 mm |
Not Qualified |
e1 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
NO LEAD |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
36 V |
1 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.11,20 |
7 V |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N10 |
2 |
1 mm |
.35 A |
3 mm |
LDO output range(V) : 5 |
e4 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
28 V |
1 |
AEC-Q100 |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
5.5 V |
.5 mm |
TIN |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
125 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
e3 |
40 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
1.8 V |
5.5 V |
1.2/5,1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
1.65 V |
Other Interface ICs |
1.15 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
3 |
1 mm |
4 mm |
Not Qualified |
e3 |
260 |
4 mm |
|||||||||||||||||||||||||||
|
ROHM |
INTERFACE CIRCUIT |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.65 V |
.5 mm |
QUAD |
S-XQCC-N20 |
1 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
34 V |
1 |
BICMOS |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
7 V |
.5 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N12 |
1 |
.8 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
2.7 V |
5.5 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
2.7 V |
Line Driver or Receivers |
.9 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
3.3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Line Driver or Receivers |
2.7 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||
|
Phoenix Contact |
DIGITAL I/O MODULE |
INDUSTRIAL |
GULL WING |
64 |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
1 |
3.3 V |
2.97 V |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
|||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC8,.06SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N8 |
1 |
.5 mm |
1.6 mm |
Not Qualified |
Also required VDREF 0 to 5.5V |
e4 |
30 |
260 |
1.6 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
105 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
e3 |
40 |
260 |
5 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
6 mA |
3.3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Interface ICs |
2.7 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
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NXP Semiconductors |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
40 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG |
2.5 V |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
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Renesas Electronics |
INTERFACE CIRCUIT |
NO LEAD |
44 |
QCCN |
SQUARE |
CERAMIC |
YES |
5.25 V |
1 |
CMOS |
5 V |
CHIP CARRIER |
LCC44,.65SQ |
4.75 V |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-CQCC-N44 |
3.05 mm |
16.535 mm |
e0 |
16.535 mm |
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|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
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Toshiba |
INTERFACE CIRCUIT |
BALL |
72 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
BGA72(UNSPEC) |
BOTTOM |
S-PBGA-B72 |
IT HAS I/O SUPPLY 1.8 TO 3.6V |
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|
Toshiba |
INTERFACE CIRCUIT |
BALL |
80 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BOTTOM |
S-PBGA-B80 |
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|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.9 V |
1 |
CMOS |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N64 |
3 |
1 mm |
9 mm |
Not Qualified |
e3 |
30 |
260 |
9 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.