SQUARE Other Function Interface ICs 1,418

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	No. of Bits	Interface Standard	Maximum Supply Current	No. of Digits/Characters	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Nominal Output Peak Current Limit	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCA9509ADP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	2 V	1							1.1 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					.8 V	.65 mm	85 Cel			-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm		3 mm				30	260	3 mm
PCA9515ADGKRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	2	BICMOS						3 V	3.6 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		2.3 V	Line Driver or Receivers	2.3 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
TCA4311ADGKR	Texas Instruments	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1							3.3 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			2.7 V		2.7 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	1.1 mm		3 mm			e4	30	260	3 mm
TLE9263BQXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100					13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					5.5 V	.5 mm					TIN	QUAD	S-XQCC-N48	3	.9 mm		7 mm			e3			7 mm
FXMAR2104UMX	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1							5 V		1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC12,.08SQ,16			Other Interface ICs	1.65 V	.4 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N12	1	.55 mm		1.8 mm	Not Qualified		e4	30	260	1.8 mm
IC-NZNQFN24-4X4	Laser Components	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1							5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				3 V	.5 mm	85 Cel			-40 Cel		QUAD	S-XQCC-N24		.9 mm		4 mm						4 mm
PCA9306DP1	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES		2										SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16			Other Interface ICs	1 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
PCA9511ADP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1					6 mA		3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19			Other Interface ICs	2.7 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
TLE92623BQXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100					13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					5.5 V	.5 mm					TIN	QUAD	S-XQCC-N48	3	.9 mm		7 mm			e3			7 mm
GTL2002DP/Q900,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		AEC-Q100						5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		0 V		0 V	.65 mm	85 Cel			-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm		3 mm		Also required VDREF 0 to 5.5V			260	3 mm
PI4ULS3V204ZBEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1							1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.14SQ,20				1.1 V	.5 mm	85 Cel			-40 Cel		QUAD	S-XQCC-N14		.9 mm		3.5 mm		IT ALSO HAS 1.1 TO 3.6V SUPPLY VOLTAGE		NOT SPECIFIED	NOT SPECIFIED	3.5 mm
TLE9263QXXUMA2	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100					13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					5.5 V	.5 mm					TIN	QUAD	S-PQCC-N48	3	.9 mm		7 mm			e3			7 mm
GTL2002DP/G,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1							1 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		0 V		0 V	.65 mm	85 Cel			-40 Cel		DUAL	S-PDSO-G8		1.1 mm		3 mm						3 mm
TIOL1123DRCR	Texas Instruments	INTERFACE CIRCUIT		NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	36 V	1							24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.11,20				7 V	.5 mm	125 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	1 mm	.35 A	3 mm		LDO output range(V) : 3.3	e4		260	3 mm
TLE9263QXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100					13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					5.5 V	.5 mm						QUAD	S-PQCC-N48		.9 mm		7 mm						7 mm
LMH1219RTWT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	2.625 V	1							2.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					2.375 V	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	.8 mm		4 mm			e3	30	260	4 mm
LSF0204DRGYR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY		YES					4		.0125 mA				1/4.5,1.8/5.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14/18,.14SQ,20			Other Interface ICs		.5 mm	125 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N14	2	1 mm		3.5 mm	Not Qualified		e4	30	260	3.5 mm
MC33CD1030AER2	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	36 V	1	SMARTMOS						16 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH					4.5 V	.5 mm	125 Cel			-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm		7 mm				40	260	7 mm
TPD2S703QDSKRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	7 V	1		AEC-Q100					5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					4.5 V	.5 mm	125 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N10	2	.8 mm		2.5 mm			e4	30	260	2.5 mm
LTC4301LIDD#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1							3.3 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					2.7 V	.5 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
TC358746AXBG	Toshiba	INTERFACE CIRCUIT		BALL	72	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V	1	CMOS						1.2 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA72,9x9,16				1.1 V	.4 mm	85 Cel			-30 Cel		BOTTOM	S-PBGA-B72		1 mm		4.5 mm				NOT SPECIFIED	NOT SPECIFIED	4.5 mm
PCA9509D,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	CMOS						5 V		1/4.5,3.3/5	SMALL OUTLINE	SOP8,.25			Line Driver or Receivers	3 V	1.27 mm	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e4	30	260	4.9 mm
LTC4303IMS8#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1							3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					2.7 V	.65 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
TLE9263QXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100					13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					5.5 V	.5 mm						QUAD	S-PQCC-N48	3	.9 mm		7 mm						7 mm
TLE9262QXXUMA2	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	28 V	1		AEC-Q100					13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					5.5 V	.5 mm					TIN	QUAD	S-PQCC-N48	3	.9 mm		7 mm			e3			7 mm
MAX6956ATL	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	SEGMENT	YES	5.5 V	1	CMOS					7-DIGIT	3.3 V		3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	7		Display Drivers	2.5 V	.5 mm	125 Cel			-40 Cel	TIN LEAD	QUAD	S-XQCC-N40	1	.8 mm		6 mm	Not Qualified	COMMON-ANODE	e0		245	6 mm
MAX6956ATL+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	SEGMENT	YES	5.5 V	1	CMOS					7-DIGIT	3.3 V		3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	7		Display Drivers	2.5 V	.5 mm	125 Cel			-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N40	1	.8 mm		6 mm	Not Qualified	COMMON-ANODE	e3	30	260	6 mm
HI-8425PQIF	Holt Integrated Circuits	INTERFACE CIRCUIT		GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	SOI-CMOS						3.3 V			FLATPACK	QFP44,.5SQ,32				3 V	.8 mm	85 Cel			-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G44	3	2.7 mm		10 mm			e3	40	260	10 mm
HI-8429PCIF	Holt Integrated Circuits	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.47 V	1	CMOS						3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3.13 V	.5 mm	85 Cel			-40 Cel	Matte Tin (Sn)	QUAD	S-PQCC-N40	3	1 mm		6 mm			e3	40	260	6 mm
MAX3984UTE+	Analog Devices	INTERFACE CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR						3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.5 mm	85 Cel			0 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	.8 mm		3 mm	Not Qualified		e3	30	260	3 mm
PCA9515ADGKTG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	2	BICMOS						3 V	3.6 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	DIP8,.3		2.3 V	Line Driver or Receivers	2.3 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
FXLP34FHX	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS						1.2 V		1/3.6	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14			Other Interface ICs	1 V	.35 mm	85 Cel			-40 Cel	NICKEL PALLADIUM	DUAL	S-PDSO-N6	1	.55 mm		1 mm	Not Qualified		e4	30	260	1 mm
PCA9574BS,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS						2.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					1.1 V	.5 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	1	1 mm		3 mm	Not Qualified		e4	30	260	3 mm
PI74STX2G4245UX	Pericom Semiconductor	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1							1.8 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			2.3 V		1.65 V	.65 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
NCN8026AMNTXG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1							3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					2.7 V	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	1 mm		4 mm		IT ALSO OPERATES AT 5V, REQUIRES VDDP=5	e3	30	260	4 mm
PCA9306GM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	2							1.8 V	5.5 V		CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20		1.8 V	Other Interface ICs	1 V	.55 mm	85 Cel	2.5 V		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N8	1	.5 mm		1.6 mm	Not Qualified		e4	30	260	1.6 mm
PCA9509ADP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	2 V	1							1.1 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					.8 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm			e4			3 mm
PCA9509DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	CMOS						5 V		3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19			Line Driver or Receivers	3 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
PCA9509PDP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1.5 V	1	CMOS						1.1 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			2.3 V		.8 V	.65 mm	85 Cel	3.3 V		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm		3 mm				30	260	3 mm
SN65CML100DGKR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			EIA-644; TIA-644			3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19			Line Driver or Receivers	3 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
PCA9306DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES		2										SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25			Other Interface ICs	1 V	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
TLE9274QXXUMA2	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V	1		AEC-Q100					13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20				4.5 V	.5 mm	150 Cel			-40 Cel	TIN	QUAD	S-XQCC-N48	3	.9 mm		7 mm			e3			7 mm
LTC4316IMS#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	SON	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	CMOS						3.3 V			SMALL OUTLINE					2.25 V	.5 mm	85 Cel			-40 Cel	MATTE TIN	DUAL	S-PDSO-N10		1.1 mm		3 mm			e3			3 mm
MAX253EUA	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	CMOS						5 V		5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19			Other Interface ICs	4.5 V	.65 mm	85 Cel			-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
MAX253EUA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	CMOS						5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					4.5 V	.65 mm	85 Cel			-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm		3 mm			e3	30	260	3 mm
ST6G3244MEBJR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.98 V	1	CMOS						1.8 V	5 V	1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		3 V	Level Translators	1.62 V	.4 mm	85 Cel	3.4 V		-40 Cel		BOTTOM	S-PBGA-B25		.65 mm		2 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	2 mm
TC358748XBG(EL)	Toshiba	INTERFACE CIRCUIT		BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.3 V	1	CMOS						1.2 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,10X10,25				1.1 V	.65 mm	85 Cel			-30 Cel		BOTTOM	S-PBGA-B80		1 mm		7 mm						7 mm
TPD2S703QDGSRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	7 V	1		AEC-Q100					5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					4.5 V	.5 mm	125 Cel			-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G10	2	1.1 mm		3 mm			e4	NOT SPECIFIED	260	3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.