SQUARE Other Function Interface ICs 1,418

Reset All

Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	Maximum Output Current	No. of Functions	No. of Channels	Technology	Screening Level	No. of Bits	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Maximum Delay	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Output Characteristics	Minimum Operating Temperature	Driver No. of Bits	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Output Polarity	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Maximum Receive Delay
TUSB320IRWBR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY		YES	5 V		1						3.5 V					CHIP CARRIER, VERY THIN PROFILE						2.7 V	.4 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm				e4	30	260	1.6 mm
MAX3869EHJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						3.3 V		3.3/5			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ				Display Drivers	3.14 V	.5 mm	85 Cel			-40 Cel		TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified			e0			5 mm
MAX3869EHJ+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						3.3 V		3.3/5			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ				Display Drivers	3.14 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified			e3	30	260	5 mm
PCA9517ADP-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS				1.2 V		3/5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Line Driver or Receivers	.9 V	.65 mm	85 Cel			-40 Cel			DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified		OPERATES WITH 2.7 V TO 5.5 V				3 mm
MFRC52201HN1,151	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		1						3.3 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.5 V	.5 mm	85 Cel			-25 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N32	1	1 mm	5 mm				e4	30	260	5 mm
PCF8578HT/1,518	NXP Semiconductors		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES					CMOS			.05 mA			3/5			FLATPACK	TQFP64,.47SQ	32		32-BP	Other Interface ICs		.5 mm	85 Cel			-40 Cel			QUAD	S-PQFP-G64	3			Not Qualified					260
TUSB320LAIRWBR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY		YES	5 V		1						3.5 V					CHIP CARRIER, VERY THIN PROFILE						2.7 V	.4 mm	85 Cel			-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm				e4	30	260	1.6 mm
ADBMS6822WCCSZ	Analog Devices	INTERFACE CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		2			AEC-Q100								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20					3 V	.5 mm	125 Cel			-40 Cel			QUAD	S-PQCC-N32		.8 mm	5 mm							5 mm
TUSB320LIRWBR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY		YES	5 V		1						3.5 V					CHIP CARRIER, VERY THIN PROFILE						2.7 V	.4 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm				e4	30	260	1.6 mm
MAX4896ETP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	.1 A	1		BICMOS				3.6 V		3/5			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25				Peripheral Drivers	2.7 V	.65 mm	85 Cel			-40 Cel	8	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified			e0		245	5 mm
MAX4896ETP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	.1 A	1		BICMOS				3.6 V		3/5			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25				Peripheral Drivers	2.7 V	.65 mm	85 Cel			-40 Cel	8	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified			e3	30	260	5 mm
NVT2002DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.4 V		1							5.5 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		0 V			0 V	.65 mm	85 Cel			-40 Cel			DUAL	S-PDSO-G8	1	1.1 mm	3 mm			Also Required Vref(B) Supply 0 to 5.5V		30	260	3 mm
MAX13035EETE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.2 V		1		BICMOS				1.8 V	3.6 V	2.5/3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		2.2 V		Other Interface ICs	1.62 V	.65 mm	85 Cel	3.3 V		-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
NCP1093MNRG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	57 V		1											SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE						0 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	DUAL	S-PDSO-N10	3	1 mm	3 mm	Not Qualified			e3	30	260	3 mm
MAX7301ATL+TGH7	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1		CMOS									CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.5 V	.5 mm	125 Cel			-40 Cel		MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm	6 mm				e3	30	260	6 mm
PCA9512ADP,118	NXP Semiconductors	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1					3.6 mA	3.3 V		3/5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs	2.7 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
CY8CMBR3116-LQXI	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1		CMOS				3.3 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						1.8 V	.5 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N24	3	.6 mm	4 mm			ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V	e4	30	260	4 mm
PCA9517ADMR2G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						2.7 V	5.5 V	3/5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		2.7 V		Line Driver or Receivers	.9 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
MAX3738ETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V		1		BIPOLAR				3.3 V		3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel			-40 Cel		TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified			e0			4 mm
MAX3738ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V		1		BIPOLAR				3.3 V		3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
PTN5110HQZ	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						3.3 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,16					2.7 V	.4 mm	85 Cel			-40 Cel			QUAD	S-PQCC-N16	1	.4 mm	2.6 mm						260	2.6 mm
MAX14591ETA+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		BICMOS				1.2 V	5.5 V	1.2/5,1.8/5			SMALL OUTLINE, VERY THIN PROFILE	SOCC8,.2,20		1.65 V		Other Interface ICs	.9 V	.5 mm	85 Cel	3 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N8	1	.8 mm	2 mm	Not Qualified			e4	30	260	2 mm
LTC6957IDD-2#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY		YES	3.45 V		1		CMOS				3.3 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18					3.15 V	.45 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm				e3		260	3 mm
SN65DSI86ZXHR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		1						1.2 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,9X9,20					1.14 V	.5 mm	85 Cel			-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B64	3	1 mm	5 mm					30	260	5 mm
HMC677LP5ETR	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		BICMOS				5 V		+-5	-5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20				Other Interface ICs	4.5 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	QUAD	S-PQCC-N32	1	1 mm	5 mm	Not Qualified			e3			5 mm
PCA9617ADMR2G	Onsemi	INTERFACE CIRCUIT	MILITARY	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						.95 V	5.5 V	1.2/5,2.5/5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		2.2 V		Other Interface ICs	.8 V	.65 mm	125 Cel	2.5 V		-55 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			e4	30	260	3 mm
MAX7301ATL+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1		CMOS				3.3 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.5 V	.5 mm	125 Cel			-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified			e3	30	260	6 mm
MAX13035EETE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.2 V		1		BICMOS				1.8 V	3.6 V	2.5/3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		2.2 V		Other Interface ICs	1.62 V	.65 mm	85 Cel	3.3 V		-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
HMC677LP5E	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		BICMOS				5 V		+-5	-5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20				Other Interface ICs	4.5 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	QUAD	S-PQCC-N32	1	1 mm	5 mm	Not Qualified			e3		260	5 mm
SN65DSI85ZXHR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY		YES	1.95 V		1	2					1.8 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,9X9,20					1.65 V	.5 mm	85 Cel			-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B64	3	1 mm	5 mm					30	260	5 mm
MAX3656ETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V		1		BIPOLAR				3.3 V		3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	3 V	.5 mm	85 Cel			-40 Cel		TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified			e0			4 mm
MAX3656ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V		1		BIPOLAR				3.3 V		3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	3 V	.5 mm	85 Cel			-40 Cel		MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified			e3	30	260	4 mm
MAX8521ETP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1		BICMOS				5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						3 V	.65 mm	85 Cel			-40 Cel		TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified			e0			5 mm
MAX8521ETP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1		BICMOS				5 V					CHIP CARRIER, VERY THIN PROFILE						3 V	.65 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified			e3	30	260	5 mm
GTL2002DP/DG,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1							5.5 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		0 V			0 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		Also required VDREF 0 to 5.5V	e4		260	3 mm
TUSB321RWBR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						5 V					CHIP CARRIER, VERY THIN PROFILE						4.5 V	.4 mm	70 Cel			0 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm				e4	30	260	1.6 mm
LTC6957IDD-3#PBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY		YES	3.45 V		1		CMOS				3.3 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18					3.15 V	.45 mm	85 Cel			-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm				e3	30	260	3 mm
MAX4896ATP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	.0001 A	1		BICMOS				3.6 V		3/5			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25				Peripheral Drivers	2.7 V	.65 mm	85 Cel			-40 Cel	8	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified			e3	30	260	5 mm
CY8CMBR2044-24LKXIT	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1		CMOS				3 V					CHIP CARRIER, VERY THIN PROFILE						1.71 V	.5 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	.6 mm	3 mm				e4	20	260	3 mm
NB4N527SMNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V		1					53 mA	3.3 V		3.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20				Line Driver or Receivers	3 V	.5 mm	85 Cel			-40 Cel		NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N16	1	1 mm	3 mm	Not Qualified				30	260	3 mm	.47 ns
PM8561B-F3EI	Microchip Technology	INTERFACE CIRCUIT					SQUARE	UNSPECIFIED					1
GTL2002DP/S440,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1							5.5 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		0 V			0 V	.65 mm	85 Cel			-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		Also required VDREF 0 to 5.5V	e4			3 mm
TXB0104RGYRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		1				4	.01 mA	1.4 V	5.5 V	1.2/3.6,1.8/5		13.7 ns	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14(UNSPEC)		1.65 V		Other Interface ICs	1.2 V	.5 mm	85 Cel	1.8 V	3-STATE	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N14	2	1 mm	3.5 mm	Not Qualified	TRUE	ALSO REQUIRED 1.8V SUPPLY NOMINAL	e4	NOT SPECIFIED	260	3.5 mm
PR5331C3HN/C370E	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		1						3.3 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20					2.5 V	.5 mm	85 Cel			-30 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	2	1 mm	6 mm				e4	30	260	6 mm
HCTL-2020#PLC	Broadcom	INTERFACE CIRCUIT	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY		YES			1		CMOS									CHIP CARRIER							1.27 mm						TIN LEAD	QUAD	S-PQCC-J20		4.57 mm	9.04 mm	Not Qualified			e0			9.04 mm
TCA9802DGKR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V		1						1.8 V	3.6 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			1.65 V			.8 V	.65 mm	125 Cel			-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			ALSO HAVE 1.65 MIN INPUT	e4	30	260	3 mm
MAX14595ETA+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		BICMOS				1.2 V	5.5 V	1.2/5,1.8/5			SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.08,20		1.65 V		Other Interface ICs	.9 V	.5 mm	85 Cel	3 V		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N8	1	.8 mm	2 mm	Not Qualified			e4	30	260	2 mm
AY0438I/L	General Semiconductor		OTHER	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	SEGMENT	YES					CMOS				5 V		5			CHIP CARRIER	LDCC44,.7SQ	32		1-BP	Other Interface ICs		1.27 mm	85 Cel			0 Cel		Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44				Not Qualified			e0

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.