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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

UPD6308AGFM

Renesas Electronics

INDUSTRIAL

GULL WING

54

QFP

SQUARE

PLASTIC/EPOXY

SEGMENT

YES

CMOS

5 V

5

FLATPACK

QFP54,.53SQ

0

40-BP

Other Interface ICs

.635 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G54

Not Qualified

e0

ISL33002IUZ-T

Renesas Electronics

BUS BUFFERS

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.3 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

e3

30

260

3 mm

ZIOL2201BI1R

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

QCCN

SQUARE

UNSPECIFIED

YES

36 V

1

CMOS

CHIP CARRIER

LCC24,.16SQ,20

8 V

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-XQCC-N24

1

.9 mm

4 mm

e3

260

4 mm

ZIOL2411BI1R

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

QCCN

SQUARE

UNSPECIFIED

YES

36 V

1

CMOS

CHIP CARRIER

LCC24,.16SQ,20

8 V

.5 mm

85 Cel

-40 Cel

Tin (Sn)

QUAD

S-XQCC-N24

1

.9 mm

4 mm

e3

NOT SPECIFIED

260

4 mm

ZIOL2401

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

QCCN

SQUARE

UNSPECIFIED

YES

36 V

1

CMOS

CHIP CARRIER

LCC24,.16SQ,20

8 V

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

.9 mm

4 mm

4 mm

ISL33001IUZ-T13

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.3 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

30

260

3 mm

ISL34321INZ-T13

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

48

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1

80 mA

1.8 V

3.6 V

1.8,3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP48,.35SQ

3 V

Line Driver or Receivers

1.7 V

.5 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.2 mm

7 mm

Not Qualified

e3

30

260

7 mm

ZIOL2411BI1W

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

QCCN

SQUARE

UNSPECIFIED

YES

36 V

1

CMOS

CHIP CARRIER

LCC24,.16SQ,20

8 V

.5 mm

85 Cel

-40 Cel

Tin (Sn)

QUAD

S-XQCC-N24

1

.9 mm

4 mm

e3

NOT SPECIFIED

260

4 mm

ISL33001IUZ-T7

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.3 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

30

260

3 mm

ISL34321INZ

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

48

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1

80 mA

1.8 V

3.6 V

1.8,3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP48,.35SQ

3 V

Line Driver or Receivers

1.7 V

.5 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.2 mm

7 mm

Not Qualified

e3

30

260

7 mm

ISL34341INZ-T13

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

64

HTFQFP

SQUARE

PLASTIC

YES

1.9 V

1

GENERAL PURPOSE

1.8 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

1.7 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.2 mm

10 mm

ALSO OPERATES WITH 3 AND 3.6 V SUPPLY

e3

30

260

10 mm

ZIOL2201BI1W

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

QCCN

SQUARE

UNSPECIFIED

YES

36 V

1

CMOS

CHIP CARRIER

LCC24,.16SQ,20

8 V

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-XQCC-N24

1

.9 mm

4 mm

e3

260

4 mm

ISL33001IUZ-T

Renesas Electronics

BUS BUFFERS

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.3 V

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

e3

30

260

3 mm

ISL34340INZ-T13

Renesas Electronics

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1

90 mA

1.8 V

3.6 V

1.8,3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

3 V

Line Driver or Receivers

1.7 V

.5 mm

85 Cel

3.3 V

-40 Cel

QUAD

S-PQFP-G64

1.2 mm

10 mm

Not Qualified

IT ALSO REQUIRES 3 TO 3.6 I/O SUPPLY

NOT SPECIFIED

NOT SPECIFIED

10 mm

PI2EQX510EXUAEX

Renesas Electronics

INTERFACE CIRCUIT

NO LEAD

10

VQCCN

SQUARE

UNSPECIFIED

YES

2 V

1

1.8 V

CHIP CARRIER, VERY THIN PROFILE

LCC10,.063SQ,16

1.6 V

.4 mm

70 Cel

0 Cel

QUAD

S-XQCC-N10

.4 mm

1.6 mm

1.6 mm

LG1625AXF

Broadcom

INTERFACE CIRCUIT

GULL WING

24

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

-5.2 V

FLATPACK

1.27 mm

TIN LEAD

QUAD

S-PQFP-G24

2.3876 mm

9.2456 mm

Not Qualified

e0

30

240

9.2456 mm

LSI53C140IJ

Broadcom

INTERFACE CIRCUIT

COMMERCIAL

BALL

192

BGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

3.3 V

GRID ARRAY

3.13 V

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B192

2.32 mm

23 mm

Not Qualified

e0

30

225

23 mm

LSI53C140PF

Broadcom

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

3.3 V

FLATPACK

3.13 V

.65 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G160

4.01 mm

28 mm

Not Qualified

e0

30

225

28 mm

LG1627BXC

Broadcom

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

24

QFP

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

-5.2 V

FLATPACK

.762 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-CQFP-G24

7.112 mm

Not Qualified

e0

30

240

7.112 mm

LSI53C180

Broadcom

INTERFACE CIRCUIT

COMMERCIAL

BALL

192

BGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

3.3 V

GRID ARRAY

3.13 V

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B192

2.32 mm

23 mm

Not Qualified

e0

30

225

23 mm

LSI53C140I2

Broadcom

INTERFACE CIRCUIT

COMMERCIAL

BALL

192

BGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

3.3 V

GRID ARRAY

3.13 V

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B192

2.32 mm

23 mm

Not Qualified

e0

30

225

23 mm

SYM53C140

Broadcom

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

3.47 V

1

3.3 V

FLATPACK

3.13 V

.65 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G160

4.01 mm

28 mm

Not Qualified

e0

28 mm

HSDL-7002

Broadcom

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

2.7 V

.65 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

3

.84 mm

4 mm

Not Qualified

255

4 mm

BCM5387

Broadcom

INTERFACE CIRCUIT

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B256

Not Qualified

HCTL-2016#PLC

Broadcom

INTERFACE CIRCUIT

INDUSTRIAL

J BEND

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

CHIP CARRIER

1.27 mm

TIN LEAD

QUAD

S-PQCC-J20

4.57 mm

9.04 mm

Not Qualified

e0

9.04 mm

KS0010

Samsung

INTERFACE CIRCUIT

OTHER

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

.5 mm

85 Cel

-30 Cel

QUAD

S-PQFP-G48

1.7 mm

7 mm

Not Qualified

7 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.