SQUARE Other Function Interface ICs 1,418

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	Maximum Output Current	No. of Functions	No. of Channels	Technology	Screening Level	No. of Bits	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Driver No. of Bits	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCA9517DGKR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		BICMOS				3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Line Driver or Receivers	2.7 V	.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	IT CAN ALSO OPERATE 0.9 TO 5.5	e4	30	260	3 mm
PM8564B-FEI	Microchip Technology	INTERFACE CIRCUIT					SQUARE	UNSPECIFIED					1
TUSB320RWBR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY		YES	5 V		1						3.5 V			CHIP CARRIER, VERY THIN PROFILE						2.7 V	.4 mm	70 Cel		0 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
HCTL-2017-PLC	Broadcom	INTERFACE CIRCUIT	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS				5 V		5	CHIP CARRIER	LDCC20,.4SQ				Other Interface ICs	4.5 V	1.27 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-PQCC-J20	3	4.572 mm	8.94 mm	Not Qualified		e3		260	8.94 mm
PTN5110NHQZ	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,16					2.7 V	.4 mm	85 Cel		-40 Cel		TIN	QUAD	S-PQCC-N16	1	.4 mm	2.6 mm			e3	30	260	2.6 mm
PCA9655EMTTXG	Onsemi	INTERFACE CIRCUIT	MILITARY	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						2.3 V			SMALL OUTLINE						1.65 V	.5 mm	125 Cel		-55 Cel		MATTE TIN	DUAL	S-PDSO-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
TCA9802DGKT	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V		1						1.8 V	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			1.65 V			.8 V	.65 mm	125 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		ALSO HAVE 1.65 MIN INPUT	e4	30	260	3 mm
TUSB320HAIRWBR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY		YES	5 V		1						3.5 V			CHIP CARRIER, VERY THIN PROFILE						2.7 V	.4 mm	85 Cel		-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
LTC6820HUD#TRPBF	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.7 V	.5 mm	125 Cel		-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	3 mm			e3	30	260	3 mm
PCA9509GM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS				5 V		1/4.5,3.3/5	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20				Line Driver or Receivers	3 V	.55 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N8	1	.5 mm	1.6 mm	Not Qualified		e4	30	260	1.6 mm
PM8565B-FEI	Microchip Technology	INTERFACE CIRCUIT					SQUARE	UNSPECIFIED					1
PCA9515ADGKR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V		2		BICMOS				3 V	3.6 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		2.3 V		Line Driver or Receivers	2.3 V	.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
LTC6820IUD#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.7 V	.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	3 mm			e3	30	260	3 mm
PM8563B-F3EI	Microchip Technology	INTERFACE CIRCUIT					SQUARE	UNSPECIFIED					1
TCA9803DGKR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V		1						1.8 V	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		1.65 V			.8 V	.65 mm	125 Cel		-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm		ALSO HAVE 1.65 MIN INPUT	e4	30	260	3 mm
PCA9515ADRGR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY		YES	3.6 V		2		BICMOS				3 V	3.6 V	2.5/3.3	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.12,20		2.3 V		Other Interface ICs	2.3 V	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N8	2	.8 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9548ARGER	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1	8					2.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.3 V	.5 mm	85 Cel		-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N24	2	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
TUSB320HIRWBR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY		YES	5 V		1						3.5 V			CHIP CARRIER, VERY THIN PROFILE						2.7 V	.4 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N12	2	.4 mm	1.6 mm			e4	30	260	1.6 mm
FXMA2104UMX	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1						5 V		1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC12,.08SQ,16				Other Interface ICs	1.65 V	.4 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N12	1	.55 mm	1.8 mm	Not Qualified		e4	30	260	1.8 mm
MAX31723MUA+T	Analog Devices	INTERFACE CIRCUIT	MILITARY	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.7 V		1						3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						1.7 V	.65 mm	125 Cel		-55 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
PM8562B-F3EI	Microchip Technology	INTERFACE CIRCUIT					SQUARE	UNSPECIFIED					1																					TIN SILVER COPPER								e1
MAX3735AETG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V		1		BIPOLAR				3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel		TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3735AETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V		1		BIPOLAR				3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX7304ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	VSON	SQUARE	PLASTIC/EPOXY		YES	3.6 V		1		BICMOS				3.3 V		1.8/3.3	SMALL OUTLINE, VERY THIN PROFILE	LCC24,.14SQ,16				Display Drivers	1.62 V	.4 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-N24	1	.85 mm	3.5 mm	Not Qualified		e3	30	260	3.5 mm
HV892K7-G	Microchip Technology	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						3.8 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,25					2.65 V	.65 mm	85 Cel		-25 Cel		MATTE TIN	DUAL	S-PDSO-N10		.8 mm	4 mm	Not Qualified		e3			4 mm
PCA9509DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS				5 V		1/4.5,3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Line Driver or Receivers	3 V	.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9515ADGKT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V		2		BICMOS				3 V	3.6 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		2.3 V		Line Driver or Receivers	2.3 V	.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
MAX253CUA	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS				5 V		5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs	4.5 V	.65 mm	70 Cel		0 Cel		TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
MAX253CUA+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS				5 V		5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs	4.5 V	.65 mm	70 Cel		0 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3996CTP	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	20	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.5 V		1		BIPOLAR				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						3 V	.5 mm	70 Cel		0 Cel		TIN LEAD	QUAD	S-CQCC-N20	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3996CTP+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	20	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.5 V		1		BIPOLAR				3.3 V		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20				Display Drivers	3 V	.5 mm	70 Cel		0 Cel		MATTE TIN	QUAD	S-CQCC-N20	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
LTC4301LCMS8#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1						3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						2.7 V	.65 mm	70 Cel		0 Cel		MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
NLVPCA9306AMUTCG	Onsemi	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY		YES			2			AEC-Q100						CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20						.5 mm	125 Cel		-55 Cel		NICKEL GOLD PALLADIUM	QUAD	S-PQCC-N8	1	.6 mm	1.6 mm				30	260	1.6 mm
CY8CMBR3108-LQXI	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1		CMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						1.8 V	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-XQCC-N16	3	.6 mm	3 mm		ALSO OPERATED WITH SUPPLY VOLTAGE 1.71 TO 1.89V	e4	30	260	3 mm
PCA9513ADP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1					6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
MAX4896ATP	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	.1 A	1		BICMOS				3.6 V		3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25				Peripheral Drivers	2.7 V	.65 mm	125 Cel		-40 Cel	8	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified		e0		245	5 mm
MAX4896ATP+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	.1 A	1		BICMOS				3.6 V		3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25				Peripheral Drivers	2.7 V	.65 mm	125 Cel		-40 Cel	8	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
PI2EQX5904NJEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.25 V		1					800 mA	1.2 V		1.2	GRID ARRAY, LOW PROFILE	BGA100,10X10,40				Other Interface ICs	1.15 V	1 mm	85 Cel		-40 Cel			BOTTOM	S-PBGA-B100		1.7 mm	11 mm	Not Qualified					11 mm
LSF0204RGYR	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY		YES							4	.0125 mA			1/4.5,1.8/5.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14/18,.14SQ,20				Other Interface ICs		.5 mm	125 Cel	3-STATE	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N14	2	1 mm	3.5 mm	Not Qualified		e4	30	260	3.5 mm
CY8CMBR2044-24LKXI	Infineon Technologies	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1		CMOS				3 V			CHIP CARRIER, VERY THIN PROFILE						1.71 V	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	.6 mm	3 mm			e4	20	260	3 mm
HT1621B(48LQFP-A)	Holtek Semiconductor		INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES					CMOS			.6 mA			3/5	FLATPACK	QFP48,.35SQ,20	32		4-BP	Other Interface ICs		.5 mm	85 Cel		-40 Cel			QUAD	S-PQFP-G48				Not Qualified
TOIM5232-TR3	Vishay Intertechnology	INTERFACE CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V		1		CMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.7 V	.5 mm	85 Cel		-25 Cel			QUAD	S-XQCC-N20		.8 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
PM8566B-FEI	Microchip Technology	INTERFACE CIRCUIT					SQUARE	UNSPECIFIED					1
PCA9517DGKRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		BICMOS				3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Line Driver or Receivers	2.7 V	.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	IT CAN ALSO OPERATE 0.9 TO 5.5	e4	30	260	3 mm
PCA9548ARGERG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V		1						2.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.3 V	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N24	2	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
TLE9263BQXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	28 V		1			AEC-Q100			13.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						5.5 V	.5 mm					TIN	QUAD	S-XQCC-N48	3	.9 mm	7 mm			e3			7 mm
MAX253CUA-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS				5 V		5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs	4.5 V	.65 mm	70 Cel		0 Cel		TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
MAX253CUA+T	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		1		CMOS				5 V		5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs	4.5 V	.65 mm	70 Cel		0 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.